Recent Patents in Fluid Dispensing Processes for Electronics Packaging

Fluid dispensing is a process widely used in electronics packaging manufacturing, by which fluid materials are delivered in a controlled manner for the purpose of bonding, sealing, coating, or conducting. Among various dispensing approaches, the use of a motor-driven screw is recognized as one of the most promising approaches due to its capacity of achieving high flow rates without the need of refilling. In a dispensing process, the flow rate of fluid dispensed is critical to control the volume or amount of fluid dispensed. This paper presents the development of a model for the rotary screw dispensing process. By using the power law equation, the flow behavior of the fluid being dispensed is characterized and then, based on the fundamentals of flow in screw channels and circular tubes, a model is developed to represent the flow rate in the rotary screw dispensing process. Experiments and simulations were carried out to verify the model effectiveness as well as to investigate the performance of the rotary screw dispensing process.

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Failure Analysis of Electronic and Microelectronic Components with a New Automatic Target Preparation System

ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2005p0327 ◽

2005 ◽

Author(s):

Katja Reiter ◽

Hans Bundgaard

Keyword(s):

Failure Analysis ◽

Automatic System ◽

Material Removal ◽

Electronics Packaging ◽

Target Preparation ◽

Packaging Industry ◽

Short Time ◽

Microelectronic Components ◽

Automatic Preparation ◽

Excellent Reproducibility

Abstract Based on the requirements regarding target, reproducibility, and specimen surface quality, an automatic system for controlled material removal and target preparation has been developed. The tool is for metallographic failure analysis of electric and microelectronic components, and provides an accuracy of 5 micrometer. This article presents details of sample preparation and device evaluation methods. The images presented show typical objects of examination in the analysis of microstructures and materials in the electronics packaging industry with brief comments. For automatically controlled material removal and preparation, the tool offers alignment and measuring of the sample prior to the preparation. The desired preparation layers were achieved precisely and reproducibly with several specimens of the same kind. The automatic preparation system allowed the preparation of critical samples within a short time, with high precision and with excellent reproducibility.

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