scholarly journals Fourier Integral Implementation to Obtain the Velocity Signal and Displacement Signal from Digital Data of MEMS Accelerometer Sensor

Natural-B ◽  
2018 ◽  
Vol 004 (03) ◽  
pp. 153-159
Author(s):  
Wasis Wasis
Keyword(s):  
Fourier Integral ◽  
Digital Data ◽  
Accelerometer Sensor ◽  
Velocity Signal ◽  
Mems Accelerometer ◽  
Displacement Signal

scholarly journals Calibration Analysis of High-G MEMS Accelerometer Sensor Based on Wavelet and Wavelet Packet Denoising

Sensors ◽  
2021 ◽  
Vol 21 (4) ◽  
pp. 1231
Author(s):  
Yunbo Shi ◽  
Juanjuan Zhang ◽  
Jingjing Jiao ◽  
Rui Zhao ◽  
Huiliang Cao
Keyword(s):  
Wavelet Packet ◽  
Estimation Method ◽  
Likelihood Estimation ◽  
Parameter Extraction ◽  
Accelerometer Sensor ◽  
Oscillation Phase ◽  
Mems Accelerometer ◽  
Optimal Tree ◽  
Adaptive Decomposition ◽  
Entropy Criterion

High-G accelerometers are mainly used for motion measurement in some special fields, such as projectile penetration and aerospace equipment. This paper mainly explores the wavelet threshold denoising and wavelet packet threshold denoising in wavelet analysis, which is more suitable for high-G piezoresistive accelerometers. In this paper, adaptive decomposition and Shannon entropy criterion are used to find the optimal decomposition layer and optimal tree. Both methods use the Stein unbiased likelihood estimation method for soft threshold denoising. Through numerical simulation and Machete hammer test, the wavelet threshold denoising is more suitable for the dynamic calibration of a high-G accelerometer. The wavelet packet threshold denoising is more suitable for the parameter extraction of the oscillation phase.

Analysis and Application of the Impact Absorption Behavior of the Composite Tube

2013 ◽  
Vol 470 ◽  
pp. 510-515
Author(s):  
Zi Peng Zhang ◽  
Gui Fan Zhao ◽  
Tso Liang Teng ◽  
Yang Wang
Keyword(s):  
Energy Absorption ◽  
Absorption Characteristic ◽  
Beam Model ◽  
Velocity Signal ◽  
Composite Tube ◽  
Acceleration Signal ◽  
Displacement Signal ◽  
Drop Weight Tear Test ◽  
Composite Energy ◽  
The Impact

Composite tube is one new kind of multi-material shell structures. It has both of metal and composite energy absorption advantage. In order to find the energy absorption characteristic of composite tube and put it into use, the Drop-Weight Tear Test (DWTT) was carried out. The LD2Y aluminum was chosen as the inner metal material which was wrapped fiberglass epoxy composite outside. During the test, the displacement signal and velocity signal, acceleration signal were got by piezoelectric acceleration transducer. Furthermore, the DWTT test of the composite tube was simulated in LS-DYNA, and proved the validity of the model by comparing the simulation results with the experiment results. We established the vehicle front longitudinal beam model with the material type of the composite tube, and carried out the simulations of whole car collisions in LS-DYNA according to FMVSS 208. Through the analysis of occupant head injury got from the simulations, we got the result that using the composite tube material could not only elevate the cars safety but also reduce front longitudinal beam weight effectively.

scholarly journals Measuring and maintaining acceleration records obtained from 3D MEMS

2018 ◽  
Vol 7 (4.5) ◽  
pp. 530
Author(s):  
K. Ravali ◽  
Dr. ASR.Murty ◽  
V. Pavani ◽  
B. Prathyusha
Keyword(s):  
Steady State ◽  
Cloud Platform ◽  
Material Transfer ◽  
Accelerometer Sensor ◽  
Digital Integration ◽  
Displacement Signal ◽  
Real Time Applications ◽  
Acceleration Record ◽  
Mit App Inventor ◽  
Selection Of

Tracing or tracking of an object or a link is needed in many engineering applications. Achieving it in real time applications using MEMS or the traditional accelerometers is also a well-known method. Measuring acceleration in [3] directions is needed in handling equipment, material transfer and in manufacturing industry.In this work, Calibration of accelerometer sensor ADXL335 is carried out first to show the accurate values of „g‟. Then, the measurement of acceleration is carried out as per the code written in Arduino IDE. ADXL335 is interfaced with NODE MCU. NODE MCU uses HTTP protocol to send the measured acceleration values to cloud platform. ThingSpeak is the cloud platform chosen for this purpose. ThingSpeak requires selection of a number of fields. Here we have three values to be taken to cloud (X, Y and Z directions).For display purposes a mobile is used in conjunction with MIT App Inventor. Acceleration record files can be obtained that may be processed further. The application contains three buttons forward, side and vertical which displays the acceleration values across X, Y and Z directions respectively. The acceleration values are further integrated to obtain velocity and displacement .It can be done through 2 ways like ana- log integration and digital integration. But the analog integration is reliable only to measure the sinusoidal steady state values. So the digital integration is much better for obtaining a displacement signal from acceleration. It is possible to use these components for further processing and applications like ultrasonic applications, military devices namely mixers, elevators, mechanically handling equipment‟s and information handling devices like iPad, phones etc.  

scholarly journals A Novel All-Optical Sensor Design Based on a Tunable Resonant Nanocavity in Photonic Crystal Microstructure Applicable in MEMS Accelerometers

2020 ◽  
Author(s):  
Mojtaba Hosseinzadeh Sani ◽  
Hamed Saghaei ◽  
Mohammad Amin Mehranpour ◽  
Afsaneh Asgariyan Tabrizi
Keyword(s):  
Photonic Crystal ◽  
Optical Sensor ◽  
Free Spectral Range ◽  
Resonant Peak ◽  
Propagation Time ◽  
Navigation Systems ◽  
Accelerometer Sensor ◽  
Mems Accelerometer ◽  
All Optical ◽  
Technical Interest

Abstract In view of the large scientific and technical interest in the MEMS accelerometer sensor and the limitations of capacitive, resistive piezo, and piezoelectric methods, we focus on the measurement of the seismic mass displacement using a novel design of the all-optical sensor (AOS). The proposed AOS consists of two waveguides and a ring resonator in a two-dimensional rod-based photonic crystal (PhC) microstructure, and a holder which connects the central rod of a nanocavity to a proof mass. The photonic band structure of the AOS is calculated with the plane-wave expansion approach for TE and TM polarization modes, and the light wave propagation inside the sensor is analyzed by solving Maxwell’s equations using the finite-difference time-domain method. The results of our simulations demonstrate that the fundamental PhC has a free spectral range of about 730 nm covering the optical communication wavelength-bands. Simulations also show that the AOS has the resonant peak of 0.8 at 1.644µm, quality factor of 3288, full width at half maximum of 0.5nm, and figure of merit of 0.97. Furthermore, for the maximum 200nm nanocavity displacements in the x- or y-direction, the resonant wavelengths shift to 1.618µm and 1.547µm, respectively. We also calculate all characteristics of the nanocavity displacement in positive and negative directions of the x-axis and y-axis. The small area of 104.35 µm2 and short propagation time of the AOS make it an interesting sensor for various applications, especially in the vehicle navigation systems and aviation safety tools.

Optical MEMS accelerometer sensor relying on a micro‐ring resonator and an elliptical disk

2019 ◽  
Vol 13 (7) ◽  
pp. 1102-1106 ◽  
Author(s):  
Ali Kazemi Nasaban Shotorban ◽  
Kian Jafari ◽  
Kambiz Abedi
Keyword(s):  
Ring Resonator ◽  
Optical Mems ◽  
Accelerometer Sensor ◽  
Mems Accelerometer

The Influence of Die-Attach Adhesives on the Packaging of MEMS Accelerometer

2015 ◽  
Vol 645-646 ◽  
pp. 533-537 ◽  
Author(s):  
Peng Peng ◽  
Xiao Ping He ◽  
Lian Ming Du ◽  
Wu Zhou ◽  
Hui Jun Yu ◽  
...  
Keyword(s):  
Thermal Coefficient ◽  
Adhesive Material ◽  
Accelerometer Sensor ◽  
Element Analysis ◽  
Mems Accelerometer ◽  
Capacitive Accelerometer ◽  
Die Attach ◽  
Stress And Deformation ◽  
Output Characteristics ◽  
Significant Factors

The attachment of the micromechanical silicon die to the substrate is one of the most critical steps in the packaging of highly accurate MEMS (microelectro-mechanical systems) accelerometer. The stress and strains, induced during die-attach process because of TCE (thermal coefficient of expansion) mismatches between different materials, will adversely affect the output characteristics of the accelerometer sensor. In this paper, three different materials: OE138, DG-3S and H70E are selected as the die-attach adhesives of a MEMS comb capacitive accelerometer. The stress and deformation of the silicon die, after the accelerometer model is cured from 80 °C to 20 °C, are evaluated with the aid of finite element analysis (FEA). As the results show, Young’s modulus and the thickness of the adhesives are the most significant factors influencing the stress and deformation of the silicon die. Soft adhesive material (OE138) have better stress absorption, and the stress and deformation of the silicon die decrease with the increasing thickness of the adhesive. Consequently, a soft and thick adhesive is recommended for the die-attach packaging of MEMS accelerometer.

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