A quantitative analysis of solid state bonding process based on fundamental bonding mechanisms. Part 1. Modeling and numerical analysis of bonding process.
1985 ◽
Vol 3
(2)
◽
pp. 303-309
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Keyword(s):
1985 ◽
Vol 3
(2)
◽
pp. 309-315
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Keyword(s):
1986 ◽
Vol 4
(2)
◽
pp. 311-316
◽
2005 ◽
Vol 2005
(0)
◽
pp. 26
2007 ◽
Vol 544-545
◽
pp. 183-186
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2011 ◽
Vol 409
◽
pp. 871-876
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Keyword(s):
1987 ◽
Vol 53
(496)
◽
pp. 2724-2728
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Keyword(s):
2013 ◽
Vol 3
(1)
◽
pp. 126-132
◽
2007 ◽
pp. 183-186