scholarly journals Optimization of the thermal performance of multi-layer silicon microchannel heat sinks

2016 ◽  
Vol 20 (6) ◽  
pp. 2001-2013 ◽  
Author(s):  
Shanglong Xu ◽  
Yihao Wu ◽  
Qiyu Cai ◽  
Lili Yang ◽  
Yue Li
Keyword(s):  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Optimization Design ◽  
Heat Sinks ◽  
Structural Parameter ◽  
Microchannel Heat Sink ◽  
Total Thermal Resistance ◽  
Sqp Method ◽  
Resistance Network Model

The objective is to optimize the configuration sizes and thermal performance of a multilayer silicon microchannel heat sink by the thermal resistance network model. The effect of structural parameter on the thermal resistance is analyzed by numercal simulation. Taking the thermal resistance as an objective function, a nonlinear and multi-constrained optimization model are proposed for the silicon microchannel heat sink in electronic chips cooling. The sequential quadratic programming (SQP) method is used to do the optimization design of the configuration sizes of the microchannel. For the heat sink with the size of 20mm?20mm and the power of 400 W, the optimized microchannel number, layer, height and width are 40 and 2, 2.2mm and 0.2mm, respectively, and its corresponding total thermal resistance for whole microchannel heat sink is 0.0424 K/W.

Understanding the Impact of Flow Bypass on the Thermal Performance of Air Cooled Heat Sinks

2014 ◽  
Author(s):  
Krishna Kota ◽  
Mohamed M. Awad
Keyword(s):  
Energy Conservation ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Sinks ◽  
Laminar Regime ◽  
Flow Energy ◽  
Factor Α ◽  
The Impact ◽  
Fundamental Mass

In this effort, theoretical modeling was employed to understand the impact of flow bypass on the thermal performance of air cooled heat sinks. Fundamental mass and flow energy conservation equations across a longitudinal fin heat sink configuration and the bypass region were applied and a generic parameter, referred as the Flow Bypass Factor (α), was identified from the theoretical solution that mathematically captures the effect of flow bypass as a quantifiable parameter on the junction-to-ambient thermal resistance of the heat sink. From the results obtained, it was found that, at least in the laminar regime, the impact of flow bypass on performance can be neglected for cases when the bypass gap is typically less than 5% of the fin height, and is almost linear at high relative bypass gaps (i.e., usually for bypass gaps that are more than 10–15% of the fin height). It was also found that the heat sink thermal resistance is more sensitive to small bypass gaps and the effect of flow bypass decreases with increasing bypass gap.

Numerical Prediction of Thermal Performance of Water Cooled Multi-Stack Microchannel Heat Sink with Counterflow Arrangement

2011 ◽  
Vol 8 (1) ◽  
pp. 16-22 ◽  
Author(s):  
Pradeep Hegde ◽  
Mukesh Patil ◽  
K. N. Seetharamu
Keyword(s):  
Finite Element ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Element Model ◽  
Channel Length ◽  
Computational Time ◽  
Microchannel Heat Sink ◽  
Method Performance

Thermal performance of a water cooled multistack microchannel heat sink with counterflow arrangement has been analyzed using the finite element method. Performance parameters such as thermal resistance, pressure drop, and pumping power are computed for a typical counterflow heat sink with different number of stacks. The temperature distribution in a typical multistack counterflow microchannel heat sink is obtained for different numbers of stacks and plotted along the channel length. A parametric study involving the effects of number of stacks and channel aspect ratio on thermal resistance and pressure drop of the heat sink is done. The finite element model developed for the analysis is simple and consumes less computational time.

Optimization Design the Configuration Sizes of Multi-Layer Rectangle Micro-Channel Heat Sink

2013 ◽  
Vol 444-445 ◽  
pp. 1101-1106
Author(s):  
Li Feng Wang ◽  
Bao Dong Shao ◽  
He Ming Cheng ◽  
Ying He
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Optimization Design ◽  
High Heat ◽  
Micro Channel ◽  
Compact Structure ◽  
Total Thermal Resistance ◽  
High Heat Transfer ◽  
High Heat Transfer Coefficient

The configuration sizes of multi-layer rectangle micro-channel heat sink are optimized, which has been widely used to cool electronic chip for its high heat transfer coefficient and compact structure. Taking the thermal resistance and the pressure drop as goal functions, a binary-objective optimization model was proposed for the multi-layer rectangle micro-channel heat sink based on Sequential Quadratic Programming (SQP) method. The number of optimized micro-channel in width n1 and that in height n2 are 24 and 3, the width of optimized micro-channel Wc and fin Wf are 360 and 55μm, the height of optimized micro-channel Hc is 1000μm, and the corresponding total thermal resistance of the whole micro-channel heat sink is 1.5429 °C/W. The corresponding pressure drop is about 2.3454 Pa. When the velocity of liquid is larger than 0.3 m/s, the effect of change of velocity of liquid on the thermal resistance and pressure drop can be neglected.

S-Shaped Pin-Fins for Enhancement of Overall Performance of the Pin-Fin Heat Sink

2010 ◽  
Author(s):  
T. J. John ◽  
B. Mathew ◽  
H. Hegab
Keyword(s):  
Reynolds Number ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Sinks ◽  
Uniform Heat Flux ◽  
Pumping Power ◽  
Pin Fin ◽  
Pin Fins ◽  
Overall Performance

In this paper the authors are studying the effect of introducing S-shaped pin-fin structures in a micro pin-fin heat sink to enhance the overall thermal performance of the heat sinks. For the purpose of evaluating the overall thermal performance of the heat sink a figure of merit (FOM) term comprising both thermal resistance and pumping power is introduced in this paper. An optimization study of the overall performance based on the pitch distance of the pin-fin structures both in the axial and the transverse direction, and based on the curvature at the ends of S-shape fins is also carried out in this paper. The value of the Reynolds number of liquid flow at the entrance of the heat sink is kept constant for the optimization purpose and the study is carried out over a range of Reynolds number from 50 to 500. All the optimization processes are carried out using computational fluid dynamics software CoventorWARE™. The models generated for the study consists of two sections, the substrate (silicon) and the fluid (water at 278K). The pin fins are 150 micrometers tall and the total structure is 500 micrometer thick and a uniform heat flux of 500KW is applied to the base of the model. The non dimensional thermal resistance and nondimensional pumping power calculated from the results is used in determining the FOM term. The study proved the superiority of the S-shaped pin-fin heat sinks over the conventional pin-fin heat sinks in terms of both FOM and flow distribution. S-shaped pin-fins with pointed tips provided the best performance compared to pin-fins with straight and circular tips.

Multi-Objective Optimization Design of Multi-Layer Rectangle Micro-Channel Heat Sink for Single-Phase Flow and Heat Transfer

2013 ◽  
Vol 709 ◽  
pp. 286-291 ◽  
Author(s):  
Li Feng Wang ◽  
Bao Dong Shao ◽  
He Ming Cheng
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Optimization Design ◽  
High Heat ◽  
Micro Channel ◽  
Compact Structure ◽  
Total Thermal Resistance ◽  
High Heat Transfer

The purpose of this paper is to optimize the structural sizes of multi-layer rectangle micro-channel heat sink, which has been widely used to cool electronic chip for its high heat transfer coefficient and compact structure. Taking the thermal resistance and the pressure drop as goal functions, a binary-objective optimization model was proposed for the multi-layer rectangle micro-channel heat sink based on Sequential Quadratic Programming (SQP) method. The number of optimized micro-channel in width n1 and that in height n2 are 21 and 7, the width of optimized micro-channel Wc and fin Wf are 340 and 130μm, the height of optimized micro-channel Hc is 415μm, and the corresponding total thermal resistance of the whole micro-channel heat sink is 1.3354 °C/W. The corresponding pressure drop is about 1.3377 Pa. When the velocity of liquid is larger than 0.3 m/s, the effect of change of velocity of liquid on the thermal resistance and pressure drop can be neglected.

Experiments on the Flow and Heat Transfer in Fine Pitch Parallel Plate Heat Sinks With Top Inlet Side Exit Flow

2007 ◽  
Author(s):  
Felipe E. Ortega-Gutierrez ◽  
Alfonso Ortega
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Parallel Plate ◽  
Ad Hoc ◽  
Loss Coefficient ◽  
Heat Sinks ◽  
Pressure Measurements ◽  
Total Thermal Resistance ◽  
Fine Pitch ◽  
Jet Nozzle

Detailed temperature and pressure measurements in high aspect ratio parallel plate fin heat sinks were made in a Top Inlet Side Exit (TISE) experiment configuration without top bypass flow. Air flow was supplied to the top of the heat sink using a rectangular jet nozzle with three different jet nozzle widths, Wj. The study covered five jet velocities and three different jet nozzle width to heat sink length ratios. Static pressure measurements were made along the spanwise centerline inside the heat sink and on the mounting plate outside the heat sink. The measurements were used to study the influence of the jet impinging on the top of the heat sink on the loss coefficient of the heat sink. It was found that the overall loss coefficient was dependent on Re, Wj, the fin spacing, b, and the jet nozzle width relative to the heat sink length, Wj/L. Temperature measurements were made to study the total thermal resistance with no base heat spreading. An ad hoc model was used to predict the total thermal resistance of the heat sink in this complicated flow. The model modifies the total cooled area of the fin as a function of jet width and heat sink geometry. Good agreement was found with the experimental data for the cases of Wj/L = 1.0 and 0.5. The model does not work well in the case of Wj/L = 0.25.

scholarly journals Effect of Wall Resistance on the Total Thermal Resistance of a Stacked Microchannel Heat Sink

Evergreen ◽  
2021 ◽  
Vol 8 (1) ◽  
pp. 138-145
Author(s):  
H. S. Shamsuddin ◽  
U. Abidin ◽  
H. Abd-Zaidan ◽  
N. Mohd-Ghazali
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Microchannel Heat Sink ◽  
Total Thermal Resistance

Thermal Analysis and Experimental Validation of Laminar Heat Transfer and Pressure Drop in Serpentine Channel Heat Sinks for Electronic Cooling

2014 ◽  
Vol 136 (3) ◽  
Author(s):  
Xiaohong Hao ◽  
Bei Peng ◽  
Gongnan Xie ◽  
Yi Chen
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Reynolds Numbers ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Total Thermal Resistance ◽  
Serpentine Channel ◽  
Resistance Network ◽  
Aspect Ratios ◽  
Resistance Network Model

In this paper, a thermal resistance network analytical model is proposed to investigate the thermal resistance and pressure drop in serpentine channel heat sinks with 180 deg bends. The total thermal resistance is obtained using a thermal resistance network model based on the equivalent thermal circuit method. Pressure drop is derived considering straight channel and bend loss because the bends interrupt the hydrodynamic boundary periodically. Considering the effects of laminar flow development and redevelopment, the bend loss coefficient is obtained as a function of the Reynolds number, aspect ratios, widths of fins, and turn clearances, through a three-regime correlation. The model is then experimentally validated by measuring the temperature and pressure characteristics of heat sinks with different Reynolds numbers and different geometric parameters. Finally, the temperature-rise and pressure distribution of the thermal fluid with Reynolds numbers of 500, 1000, and 1500 are examined utilizing this model.

Thermal Performance Analysis of Fan-Heat Sinks for CPU Cooling

2003 ◽  
Author(s):  
Seo Young Kim ◽  
Ralph L. Webb
Keyword(s):  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Sinks ◽  
Operating Point ◽  
Pin Fin ◽  
Flow Impedance ◽  
Impedance Curve ◽  
Convective Thermal ◽  
Offset Strip Fin

The thermal performance of plate fin, round pin-fin and offset strip-fin heat sinks with a duct-flow type fan arrangement was analytically evaluated. Heat sinks of 65mm × 60mm plan area × 50 mm height with a 4300-RPM DC fan (60mm × 15mm) were chosen for the performance comparison. A constant temperature, 6 mm thick heat sink base plate is assumed so that thermal spreading resistance is not involved. The operating point on the fan curve is based on the flow pressure drop impedance curve through a heat sink using the friction factor correlation for the chosen heat sink. The loss coefficients at both the entrance and the exit of heat sink are included in the flow impedance curve. The operating point is defined by the balance point of the flow impedance curve and the fan performance curve. After determining the operating air velocity, the convective thermal resistance of heat sinks is evaluated from the Nusselt number correlation for the chosen heat sink. Results obtained show that optimized round pin-fin heat sinks provide 32.8%-to-46.4% higher convective thermal resistance compared to an optimized plate-fin heat sink. The optimized offset strip-fin heat sink shows a slightly lower convective thermal resistance than the plate-fin heat sink. As the offset strip length decreases, however, thermal performance seriously deteriorates.

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