scholarly journals The Effect of Substrate Dissolution in Brazing CP-Ti and Ti-15-3 Using Clad Ti–15Cu–15Ni Filler

2010 ◽  
Vol 50 (3) ◽  
pp. 450-454 ◽  
Author(s):  
Z.Y. Wu ◽  
T. Y. Yeh ◽  
R. K. Shiue ◽  
C. S. Chang
Keyword(s):  
Substrate Dissolution ◽  
Cp Ti

Grain-refining and strengthening mechanisms of bulk ultrafine grained CP-Ti processed by L-ECAP and MDF

2021 ◽  
Vol 83 ◽  
pp. 196-207
Author(s):  
Peng-Cheng Zhao ◽  
Guang-Jian Yuan ◽  
Run-Zi Wang ◽  
Bo Guan ◽  
Yun-Fei Jia ◽  
...  
Keyword(s):  
Grain Refining ◽  
Strengthening Mechanisms ◽  
Ultrafine Grained ◽  
Cp Ti

scholarly journals Comparison of Biocompatible Coatings Produced by Plasma Electrolytic Oxidation on cp-Ti and Ti-Zr-Nb Superelastic Alloy

Coatings ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 401
Author(s):  
Ruzil Farrakhov ◽  
Olga Melnichuk ◽  
Evgeny Parfenov ◽  
Veta Mukaeva ◽  
Arseniy Raab ◽  
...  
Keyword(s):  
Plasma Electrolytic Oxidation ◽  
Electrochemical Impedance ◽  
Pure Titanium ◽  
Commercially Pure Titanium ◽  
X Ray ◽  
Kinetic Coefficients ◽  
Electrolytic Oxidation ◽  
Plasma Electrolytic ◽  
Cp Ti ◽  
Peo Coatings

The paper compares the coatings produced by plasma electrolytic oxidation (PEO) on commercially pure titanium and a novel superelastic alloy Ti-18Zr-15Nb (at. %) for implant applications. The PEO coatings were produced on both alloys in the identical pulsed bipolar regime. The properties of the coatings were examined using scanning electron microscopy (SEM), X-ray diffraction (XRD), and energy-dispersive X-ray spectroscopy (EDX), potentiodynamic polarization (PDP), and electrochemical impedance spectroscopy (EIS). The PEO process kinetics was modeled based on the Avrami theorem and Cottrell equation using a relaxation method. The resultant coatings contain TiO2, for both alloys, and NbO2, Nb2O5, ZrO2 for Ti-18Zr-15Nb alloy. The coating on the Ti-18Zr-15Nb alloy has a higher thickness, porosity, and roughness compared to that on cp-Ti. The values of the kinetic coefficients of the PEO process—higher diffusion coefficient and lower time constant for the processing of Ti-18Zr-15Nb—explain this effect. According to the electrochemical studies, PEO coatings on Ti-18Zr-15Nb alloy provide better corrosion protection. Higher corrosion resistance, porosity, and roughness contribute to better biocompatibility of the PEO coating on Ti-18Zr-15Nb alloy compared to cp-Ti.

Kinetics-Based Modeling of Bond-Metal Dissolution and IMC During Soldering

2006 ◽  
Author(s):  
Mohammad Faizan ◽  
Guo-X. Wang
Keyword(s):  
Intermetallic Phase ◽  
Molten Solder ◽  
Lead Free ◽  
Joint Interface ◽  
Environment Friendly ◽  
Soldering Process ◽  
Substrate Dissolution ◽  
Soldering Reaction ◽  
Lead Free Solders ◽  
Kinetics Of

Soldering has become an indispensable joining process in the electronic packaging industry. The industry is aiming for the use of environment friendly lead-free solders. All the lead-free solders are high tin-containing alloys. During the soldering process, an intense interaction of metallization on PCB and tin from the solder occurs at the metallization/solder interface. Intermetallic compound (IMC) is formed at the interface and subsequently PCB bond-metal (substrate) is dissolved into the molten solder. In the present study the terms bond-metal and substrate will be used interchangeably and the term 'substrate' refers to the top layer of the PCB which comes in contact with the molten solder during soldering reaction. Thickness of the intermetallic phase formed at the joint interface and amount of substrate lost is critical in achieving reliable solder joints. During the wet phase of soldering process, the IMC does not grow as layered structure; rather it takes the shape of scallops. The growth of scalloped IMC during the solder/substrate interaction entails complicated physics. Understanding of the actual kinetics involved in the formation of IMC phase is important in controlling the process to achieve desired results. This paper presents theoretical analysis of the kinetics involved in the formation of the scalloped intermetallic phase. The intermetallic phase growth is experimentally investigated to support the underlying kinetics of the process. Numerical model has been suggested to translate the physics of the process. The model is based on the basic mass diffusion equations and can predict the substrate dissolution and IMC thickness as a function of soldering time.

The investigation of die-pressing and sintering behavior of ITP CP-Ti and Ti-6Al-4V powders

2012 ◽  
Vol 541 ◽  
pp. 440-447 ◽  
Author(s):  
W. Chen ◽  
Y. Yamamoto ◽  
W.H. Peter ◽  
M.B. Clark ◽  
S.D. Nunn ◽  
...  
Keyword(s):  
Sintering Behavior ◽  
Die Pressing ◽  
Cp Ti

Thermomechanical Response of Commercially Pure Titanium under Large Plastic Deformation at High Strain Rates

2012 ◽  
Vol 548 ◽  
pp. 174-178 ◽  
Author(s):  
Chong Yang Gao ◽  
Wei Ran Lu
Keyword(s):  
Pure Titanium ◽  
Optimal Solution ◽  
Optimization Method ◽  
Strain Rates ◽  
Commercially Pure Titanium ◽  
Thermomechanical Response ◽  
Commercially Pure ◽  
Different Temperatures ◽  
Cp Ti ◽  
Constitutive Parameters

By using a dislocation-based plastic constitutive model for hcp metals developed by us recently, the dynamic thermomechanical response of an important industrial material, commercially pure titanium (CP-Ti), was described at different temperatures and strain rates. The constitutive parameters of the material are determined by an efficient optimization method for a globally optimal solution. The model can well predict the dynamic response of CP-Ti by the comparison with experimental data and the Nemat-Nasser-Guo model.

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