High aspect / narrow pitch substrate wiring and bump formation using imprinting technology for low temperature flip chip bonding
Keyword(s):
2014 ◽
Vol 53
(4S)
◽
pp. 04EB04
◽
2012 ◽
Vol 22
(9)
◽
pp. 454-458
◽
2018 ◽
Vol 47
(10)
◽
pp. 5952-5958
◽