The Effect of Acetone Dilution towards the Surface Topography and Morphology of Micro Bearing Concept for Epoxy Filled UHMWPE Composite

Surface topography and morphological behaviours are the important aspects in the application of surface bearing as it deals with the contact area of objects upon motion. Improved surface bearing will be set as an indicator for tribology behaviour to reduce the possibility of wear rate and reduce the friction of objects, respectively. Thus, in this study, the fundamental of micro bearing concept was imparted as the Ultra High Molecular Weight Polyethylene (UHMWPE), which is a low density filler, will float onto the surface of the composite system to become a solid lubricant upon curing. UHMWPE filler, which is commonly known for its dominant properties of high tendency to resist wear and has low coefficient of friction were fabricated alongside epoxy resin in the composite system to achieve the desired strength and durability to perform over time. However, there are limitations of UHMWPE during processing upon the dispersion of the fillers with the matrix particles due to epoxy resin that has relatively high in viscosity. Therefore, acetone has been selected as a diluent with ratio of 1:1/4, 1:1/3, 1:1/2, 1:1 to dilute the high viscosity epoxy resin. The surface profile measurement were examined using Alicona Infinite Focus and Polarized Optical Microscope. Based on the results observed, EpUPE3 (epoxy and UHMWPE with acetone ratio of 1:1/2) showed better surface distribution and morphology with relatively low value of surface roughness (Ra) which is 1.41 µm and low pseuodocolour value of surface height which is around 6.76-6.77 cm compared to other formulation ratio. In near future, these surface topography and morphological analysis are important to relate with tribological, physical and mechanical properties of the micro bearing layers for bearing applications, specifically.

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Development of Epoxy Grout Containing Fine Waste from Production of Mineral Wool Board Insulation

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.878.275 ◽

2018 ◽

Vol 878 ◽

pp. 275-280 ◽

Cited By ~ 1

Author(s):

Jakub Hodul ◽

Tomáš Žlebek ◽

Rostislav Drochytka

Keyword(s):

Thermal Resistance ◽

Epoxy Resin ◽

Filler Content ◽

Physical And Mechanical Properties ◽

Optical Microscope ◽

Mechanical Analysis ◽

Mineral Wool ◽

Raw Material ◽

Strength Increase ◽

Economic Point

Within this work, it was experimentally verified that the waste from mineral wool board insulation production (WIRG) with high portion of glass recyclate (> 80%) and no organic material seems like ideal filler for polymer grouting materials. The main objective was to develop a progressive grout on epoxy basis with as high content of this secondary raw material as possible, while achieving physical and mechanical properties as e.g. very fast strength increase and high thermal resistance. With regard to the consistency of epoxy grout in the fresh state, three different filling were tested, namely 60%, 65% and 70%. The grout with lower filling is too fluid, and it is also disadvantageous from an economic point of view because a large amount of epoxy resin is used. On the other hand, at higher filing, it is not possible to mix the filler into epoxy resin properly. Setting of an optimal filler content in the mixture was performed mostly on the basis of the results of compressive and three-point flexural strength test. It was found out that the optimal amount of the filler is 65%. In case of the best formulation with optimal filler content (65% WIRG), the thermal resistance was monitored by determination of the glass transition temperature (Tg) by the dynamic mechanical analysis (DMA) method. Furthermore, the optical microscope with high resolution was used to monitor filler distribution and homogeneity of the hardened developed epoxy grout.

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Excimer Laser Micromachining of Silicon and On-Line Machining Depth Discovery Using Laser Interferometry

10.1115/imece2000-1795 ◽

2000 ◽

Author(s):

Senthil Theppakuttai ◽

Shaochen Chen

Keyword(s):

Excimer Laser ◽

Wave Length ◽

Michelson Interferometer ◽

Surface Profile ◽

Laser Micromachining ◽

Optical Microscope ◽

In Situ Monitoring ◽

Depth Information ◽

Profile Measurement

Abstract In this paper a parametric study on the excimer laser micromachining of silicon (Si) is conducted and a Michelson interferometer is used for the in-situ diagnostics of the machining depth on the sub-micron and micron scales. An excimer laser of wave length 308 nm is used for the micromachining process. A He-Ne laser of 632.8 nm wavelength is used as the light source for the interferometer and the setup consists of a beam splitter, beam expander and other optics. The interference patterns caused due to the change in the path length between the two interferometer arms gives the machined depth information. These interference patterns are captured by using a photodiode and an oscilloscope. Results from the interferometer are compared with the actual depth measurements obtained by using a surface profilometer in combination with an optical microscope. It is observed that the depths of machining obtained by the surface profile measurement are in accordance with the interferometer measurements with a very high accuracy. The experimental results demonstrate the feasibility of applying this system for the in-situ monitoring of the micromachining process.

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Intelligent Profile Measurement for Wide-Area Resist Surface Using Multi-Sensor AFM System

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.381-382.407 ◽

2008 ◽

Vol 381-382 ◽

pp. 407-410

Author(s):

Shu Jie Liu ◽

K. Watanabe ◽

Satoru Takahashi ◽

Kiyoshi Takamasu

Keyword(s):

Thin Film ◽

Semiconductor Industry ◽

Surface Profile ◽

Vertical Direction ◽

Profile Measurement ◽

Measuring Device ◽

Scanning Method ◽

Angle Measuring ◽

Experimental Apparatus ◽

Sensor Errors

In the semiconductor industry, a device that can measure the surface-profile of photoresist is needed. Since the photoresist surface is very smooth and deformable, the device is required to measure vertical direction with nanometer resolution and not to damage it at the measurement. We developed the apparatus using multi-cantilever and white light interferometer to measure the surface-profile of thin film. But, this system with scanning method suffers from the presence of moving stage and systematic sensor errors. So, in this paper, an error separation approach used coupled distance sensors, together with an autocollimator as an additional angle measuring device, was consulted the potentiality for self-calibration of multi-cantilever. Then, according to this method, we constructed the experimental apparatus and do the measurement on the resist film. The results demonstrated the feasibility that the constructed multi-ball-cantilever AFM system combined with an autocollimator could measure the thin film with high accuracy.

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