Recoverable test vehicle, an innovative approach to a low cost composite airframe for aerospace application

1989 ◽  
Author(s):  
THOMAS SKELLY
2018 ◽  
Vol 2018 (1) ◽  
pp. 000121-000124
Author(s):  
Scott Chen ◽  
Leander Liang ◽  
Pallas Hsu ◽  
Tim Tsai ◽  
Mason Liang ◽  
...  

Abstract In recent years, flip chip technology becomes more and more important with benefits of thin package profile, reduction of package outline, and excellent electrical and thermal performance by connection of copper pillar bumps (CuP) or C4 solder bumps. In order to fill the die gap to prevent voids problem, two encapsulated solutions could be applied: capillary underfill (CUF) and molded underfill (MUF). In general comparison, CUF means to dispense underfill first to fill in die gap then proceed over-molding afterward; and MUF is directly fill under and above die by mold compound. The advantages of MUF solution are low cost and high throughput, however, it will suffer other assembly issues such as solder extrusion and solder crack, and might result in potential function failure. To form these kinds of defects, we suspected that solder will plastically deform under thermal stress treatment, which comes from unbalance mold transfer pressure and material expansion stress during thermal process. In this article, we have tried to investigate the mechanism of solder crack through molding recipe DOE (Design of Experiment) and mold flow simulation. The test vehicle is 12 × 12 mm2 FCCSP, with 6 × 5 mm2 die size. The bump type is copper pillar bump and pitch/size are 126 um and 35 × 60 um2, respectively. The molding recipe has been evaluated by cross section, and it revealed that molding transfer time and molding temperature are directions toward improvement of solder crack issue.


2015 ◽  
Vol 2015 (1) ◽  
pp. 1-5 ◽  
Author(s):  
Dyi-Chung Hu ◽  
Yu-Min Lin ◽  
Hsiang Hung Chang ◽  
Tao-Chih Chang ◽  
Wei-Chung Lo ◽  
...  

A new concept of packaging platform calls eHDF (embedded high density film), that without any TXVs is been proposed. The eHDF uses the technology from two categories; one utilize the semiconductor fine line technology infrastructure and the other takes the advantage of laminate organic large panel process infrastructure. Hence, the fine line, better electrical performance and low cost requirements can be addressed at the same time by the eHDF packaging platform. In this paper, a test vehicle based on eHDF structure will be built and modules assembly with test chips on eHDF substrate will be performed.


2014 ◽  
Vol 2014 (1) ◽  
pp. 000397-000401 ◽  
Author(s):  
Yu-Hua Chen ◽  
Shaun Hsu ◽  
Urmi Ray ◽  
Ravi Shenoy ◽  
Kwan-Yu Lai ◽  
...  

For high density interconnection IC packages of the future, the outlook is for thinner packages with higher routing densities. With that, managing the substrate warpage becomes critical. Traditional organic substrates may face several challenges for high density I/Os with very fine line interconnections. Glass is one of the candidates that can be used in substrate industry. The infrastructure of glass for LCD industry has already been developed for many years. Glass also has several superior properties than other substrate candidates, such as large panel size availability, adjustable CTE, high modulus, low dielectric constant, low dielectric loss and high insulating ability. In this paper, we successfully demonstrate early manufacturing feasibility of glass substrate with 4 build-up layers starting with a thin glass panel of thickness of 200μm in 508mm μ 508mm panel size format and under the IC substrate manufacturing environment. Fabrication and electrical results of a test vehicle are documented. The test vehicle includes daisy chains that are connected with 100μm diameter through glass via (TGV) in a 200μm thick glass. The laser via in via technology was adopted for double side electrical connection. The copper line width/space of 8/8μm was demonstrated. The total thickness of 4 layers test vehicle is about 390μm. The warpage of glass in comparison with an organic substrate (BT) with 200μm core thickness is 3X better. Further work is needed to develop, fine tune and assess the detailed manufacturability and reliability concerns. Based on this work, it is clear that the potential of glass in IC packaging and integration is tremendous in diverse applications for substrate warpage enhancement.


2012 ◽  
Vol 81 ◽  
pp. 90-95 ◽  
Author(s):  
Stephan Klatt ◽  
Merle Allerdissen ◽  
René Körbitz ◽  
Brigtitte Voit ◽  
Karl Friedrich Arndt ◽  
...  

Over the last ten years, microfluidic technologies have gained considerable importance. However, realising highly integrated microsystems is a major challenge, which so far has only been solved insufficiently. Here, we present an innovative approach to fabricate low-cost, integrable mi- crofluidic platforms. As active elements, photopolymerised hydrogels based on Poly(N-isopropylacrylamide) (PNIPAAm) are introduced. PNIPAAm is temperature-sensitive. Heated in water above its lower crit- ical solution temperature (LCST), it reversibly changes from a swollen to a shrunken state (volume change in the order of 90%) and can, via an electrothermic interface, be employed as electrothermally switchable actuator. Varying specific parameters in the swelling agent, for example varying its alco- hol concentration, can shift the LCST. So not only micropumps or microvalves, but also valves with an appointed threshold value, so-called chemostats or chemical transistors, can be realised. Using the example of a microchip performing enzymatic endpoint analyses, we investigate characteristic be- haviour of active elements based on PNIPAAM and show the ability of integrating different fluidic operations like fluid transportation, metering, valving and mixing into one fully polymeric microchip.


Author(s):  
Michał Raczyński

The article presents the possibility of conducting remote laboratory classes in subjects that require the use of specialized equipment (which the student does not have at home). The article is based on the example of classes in microcontrollers programming and electronic circuits. The methods with the use of simulation programs and an innovative approach enabling work on real equipment are presented. The solutions presented in the article were practically and successfully implemented in connection with the coronavirus pandemic in spring 2020 at the Faculty of Electrical Engineering of West Pomeranian University of Technology in Szczecin. A very important feature of the presented ideas is the possibility to adapt the already existing stationary solutions to remote work and use free applications. The characteristic feature of the presented ideas is also simplicity. These two features make it possible to implement remote learning quickly and at a low-cost. Classes conducted using the described system for a group of about 50 students were positively evaluated by them. Their opinions were also included in the article.


Sign in / Sign up

Export Citation Format

Share Document