A TXV-less Packaging Platform for the Era of IoTs

2015 ◽  
Vol 2015 (1) ◽  
pp. 1-5 ◽  
Author(s):  
Dyi-Chung Hu ◽  
Yu-Min Lin ◽  
Hsiang Hung Chang ◽  
Tao-Chih Chang ◽  
Wei-Chung Lo ◽  
...  
Keyword(s):  
Low Cost ◽  
High Density ◽  
The Other ◽  
Electrical Performance ◽  
Test Vehicle ◽  
Technology Infrastructure ◽  
Fine Line ◽  
Large Panel ◽  
Line Technology ◽  
Test Chips

A new concept of packaging platform calls eHDF (embedded high density film), that without any TXVs is been proposed. The eHDF uses the technology from two categories; one utilize the semiconductor fine line technology infrastructure and the other takes the advantage of laminate organic large panel process infrastructure. Hence, the fine line, better electrical performance and low cost requirements can be addressed at the same time by the eHDF packaging platform. In this paper, a test vehicle based on eHDF structure will be built and modules assembly with test chips on eHDF substrate will be performed.

Electrical performance analysis of fine line on high density package substrate

2015 ◽  
Author(s):  
Hung-Chun Kuo ◽  
Ming-Fong Jhong ◽  
Hung-Hsiang Cheng ◽  
Chen-Chao Wang ◽  
Chih-Pin Hung
Keyword(s):  
Performance Analysis ◽  
High Density ◽  
Electrical Performance ◽  
Fine Line

Low Cost Glass Interposer Development

2014 ◽  
Vol 2014 (1) ◽  
pp. 000397-000401 ◽  
Author(s):  
Yu-Hua Chen ◽  
Shaun Hsu ◽  
Urmi Ray ◽  
Ravi Shenoy ◽  
Kwan-Yu Lai ◽  
...  
Keyword(s):  
Low Cost ◽  
Organic Substrate ◽  
High Density ◽  
Organic Substrates ◽  
Test Vehicle ◽  
Thin Glass ◽  
Panel Size ◽  
Low Dielectric ◽  
Ic Packaging ◽  
Core Thickness

For high density interconnection IC packages of the future, the outlook is for thinner packages with higher routing densities. With that, managing the substrate warpage becomes critical. Traditional organic substrates may face several challenges for high density I/Os with very fine line interconnections. Glass is one of the candidates that can be used in substrate industry. The infrastructure of glass for LCD industry has already been developed for many years. Glass also has several superior properties than other substrate candidates, such as large panel size availability, adjustable CTE, high modulus, low dielectric constant, low dielectric loss and high insulating ability. In this paper, we successfully demonstrate early manufacturing feasibility of glass substrate with 4 build-up layers starting with a thin glass panel of thickness of 200μm in 508mm μ 508mm panel size format and under the IC substrate manufacturing environment. Fabrication and electrical results of a test vehicle are documented. The test vehicle includes daisy chains that are connected with 100μm diameter through glass via (TGV) in a 200μm thick glass. The laser via in via technology was adopted for double side electrical connection. The copper line width/space of 8/8μm was demonstrated. The total thickness of 4 layers test vehicle is about 390μm. The warpage of glass in comparison with an organic substrate (BT) with 200μm core thickness is 3X better. Further work is needed to develop, fine tune and assess the detailed manufacturability and reliability concerns. Based on this work, it is clear that the potential of glass in IC packaging and integration is tremendous in diverse applications for substrate warpage enhancement.

scholarly journals Fine Lines in a Three Dimensional Interconnect

1984 ◽  
Vol 11 (2) ◽  
pp. 109-115
Author(s):  
J. A. Scarlett
Keyword(s):  
Printed Circuit Boards ◽  
Low Cost ◽  
Three Dimensional ◽  
High Density ◽  
Circuit Boards ◽  
Fine Line ◽  
Printed Circuit ◽  
Flexible Printed Circuit ◽  
Planar Substrates

The techniques for the generation of fine lines on rigid and flexible printed circuit boards are reviewed, and it is shown how the tracking on the interconnect can be made to match the requirements of chip carriers, TAB chips or beam leaded or wire bonded chips directly mounted.The use of fine line techniques on planar substrates can be adapted to provide a low cost, high density interconnect which offers a truly three dimensional connection capability without the use of a “back wiring panel”. Such a three dimensional interconnect can offer opportunities for improvement in the removal of heat from high dissipation chips, thus offering significantly increased reliability.

SAE 1039

Alloy Digest ◽  
1977 ◽  
Vol 26 (2) ◽  
Keyword(s):  
Fracture Toughness ◽  
Low Cost ◽  
Manganese Content ◽  
Heat Treating ◽  
General Purpose ◽  
Carbon Steels ◽  
The Other ◽  
Steel Mills ◽  
Medium Strength ◽  
Hot Rolled

Abstract SAF 1039 steel can be used in the hot-rolled, normalized, oil-quenched-and-tempered or water-quenched-and-tempered condition for general-purpose construction and engineering. Its manganese content is a little higher than some of the other standard carbon steels with comparable carbon levels; this gives it slightly higher hardenability and hardness. It provides medium strength and toughness at low cost. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as fracture toughness. It also includes information on corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: CS-66. Producer or source: Carbon steel mills.

Using Low Temperature, Cost-effective and Green Methods to Carbon Nanohorn Synthesis

2019 ◽  
Vol 9 (2) ◽  
pp. 157-160
Author(s):  
Ali Hasani
Keyword(s):  
Laser Ablation ◽  
Melting Point ◽  
Palm Olein ◽  
Arc Discharge ◽  
Low Cost ◽  
The Other ◽  
High Yield ◽  
Reaction Field ◽  
Carbon Nanohorns ◽  
Graphite Rod

Background: Laser ablation method has high-yield and pure SWCNHs. On the other hand, arc discharge methods have low-cost production of SWCNHs. However, these techniques have more desirable features, they need special expertness to use high power laser or high current discharge that either of them produces very high temperature. As for the researches, the temperatures of these techniques are higher than 4727°C to vaporize the graphite. So, to become aware of the advantages of SWCNHs, it is necessary to find a new way to synthesize SWCNHs at a lower temperature. In other words, reaction field can be expandable at a moderate temperature. This paper reports a new way to synthesize SWCNHs at an extremely reduced temperature. Methods: According to this study, the role of N2 is the protection of the copper holder supporting the graphite rod by increasing heat transfer from the holder. After the current of 70 A was supplied to the system, the temperature of graphite rod was raised to 1600°C. It is obvious that this temperature is somehow higher than the melting point of palladium, 1555°C, and much lower than graphite melting point, 3497°C. Results: Based on the results, there are transitional precursors simultaneous with the SWCNHs. This composition can be created by distortion of the primary SWCNTs at the higher temperature. Subsequently, each SWCNTs have a tendency to be broken into individual horns. With increasing the concentration of the free horns, bud-like SWCNHs can be produced. Moreover, there are individual horns almost separated from the mass of single wall carbon nanohorns. This structure is not common in SWCNHs synthesized by the usual method such as arc discharge or laser ablation. Through these regular techniques, SWCNHs are synthesized as cumulative particles with diameters about 30-150 nm. Conclusion: A simple heating is needed for SWCNTs transformation to SWCNHs with the presence of palladium as catalyst. The well-thought-out mechanism for this transformation is that SWCNTs were initially changed to highly curled shape, and after that were formed into small independent horns. The other rout to synthesize SWCNHs is the pyrolysis of palm olein at 950°C with the assistance of zinc nitrate and ferrocene. Palm olein was used as a promising, bio-renewable and inexpensive carbon source for the production of carbon nanohorns.

scholarly journals A Local Oscillator Phase Compensation Technique for Ultra-Wideband Stepped-Frequency Continuous Wave Radar Based on a Low-Cost Software-Defined Radio

Sensors ◽  
2021 ◽  
Vol 21 (3) ◽  
pp. 780
Author(s):  
Kazunori Takahashi ◽  
Takashi Miwa
Keyword(s):  
Software Defined Radio ◽  
Initial Phase ◽  
Continuous Wave ◽  
Low Cost ◽  
Local Oscillator ◽  
The Other ◽  
Ultra Wideband ◽  
Single Frequency ◽  
Wave Radar ◽  
Stepped Frequency

The paper discusses a way to configure a stepped-frequency continuous wave (SFCW) radar using a low-cost software-defined radio (SDR). The most of high-end SDRs offer multiple transmitter (TX) and receiver (RX) channels, one of which can be used as the reference channel for compensating the initial phases of TX and RX local oscillator (LO) signals. It is same as how commercial vector network analyzers (VNAs) compensate for the LO initial phase. These SDRs can thus acquire phase-coherent in-phase and quadrature (I/Q) data without additional components and an SFCW radar can be easily configured. On the other hand, low-cost SDRs typically have only one transmitter and receiver. Therefore, the LO initial phase has to be compensated and the phases of the received I/Q signals have to be retrieved, preferably without employing an additional receiver and components to retain the system low-cost and simple. The present paper illustrates that the difference between the phases of TX and RX LO signals varies when the LO frequency is changed because of the timing of the commencement of the mixing. The paper then proposes a technique to compensate for the LO initial phases using the internal RF loopback of the transceiver chip and to reconstruct a pulse, which requires two streaming: one for the device under test (DUT) channel and the other for the internal RF loopback channel. The effect of the LO initial phase and the proposed method for the compensation are demonstrated by experiments at a single frequency and sweeping frequency, respectively. The results show that the proposed method can compensate for the LO initial phases and ultra-wideband (UWB) pulses can be reconstructed correctly from the data sampled by a low-cost SDR.

Understanding and Optimizing Hybrid SSD with High-Density and Low-Cost Flash Memory

2021 ◽  
Author(s):  
Liang Shi ◽  
Longfei Luo ◽  
Yina Lv ◽  
Shicheng Li ◽  
Changlong Li ◽  
...  
Keyword(s):  
Flash Memory ◽  
Low Cost ◽  
High Density

A comparative study of qualitative immunochemical screening assays for the combined measurement of T-2/HT-2 in cereals and cereal-based products

2011 ◽  
Vol 4 (4) ◽  
pp. 385-394 ◽  
Author(s):  
J. Meneely ◽  
F. Ricci ◽  
S. Vesco ◽  
M. Abouzied ◽  
M. Sulyok ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Low Cost ◽  
Ease Of Use ◽  
The Other ◽  
Accuracy And Precision ◽  
Cost Implications ◽  
Electrochemical Array ◽  
The Cost ◽  
Preparation Techniques ◽  
Speed Of Analysis

Many different immunochemical platforms exist for the screening of naturally occurring contaminants in food from the low cost enzyme linked immunosorbent assays (ELISA) to the expensive instruments such as optical biosensors based on the phenomenon of surface plasmon resonance (SPR). The primary aim of this study was to evaluate and compare a number of these platforms to assess their accuracy and precision when applied to naturally contaminated samples containing HT-2/T-2 mycotoxins. Other important factors considered were the speed of analysis, ease of use (sample preparation techniques and use of the equipment) and ultimately the cost implications. The three screening procedures compared included an SPR biosensor assay, a commercially available ELISA and an enzymelinked immunomagnetic electrochemical array (ELIME array). The qualitative data for all methods demonstrated very good overall agreements with each other, however on comparison with mass spectrometry confirmatory results, the ELISA and SPR assay performed slightly better than the ELIME array, exhibiting an overall agreement of 95.8% compared to 91.7%. Currently, SPR is more costly than the other two platforms and can only be used in the laboratory whereas in theory both the ELISA and ELIME array are portable and can be used in the field, but ultimately this is dependent on the sample preparation techniques employed. Sample preparative techniques varied for all methods evaluated, the ELISA was the most simple to perform followed by that of the SPR method. The ELIME array involved an additional clean-up step thereby increasing both the time and cost of analysis. Therefore in the current format, field use would not be an option for the ELIME array. In relation to speed of analysis, the ELISA outperformed the other methods.

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