Effect of hydrogen heat treatment on antifriction properties of nitrided VT6 titanium-based alloy

2016 ◽  
Vol 37 (3) ◽  
pp. 274-281 ◽  
Author(s):  
I. N. Pohrelyuk ◽  
S. V. Skvortsova ◽  
V. N. Fedirko ◽  
A. G. Lukyanenko ◽  
V. S. Spektor ◽  
...  
1968 ◽  
Vol 39 (7) ◽  
pp. 3499-3500 ◽  
Author(s):  
E. M. Gyorgy ◽  
J. P. Remeika ◽  
D. L. Wood

2010 ◽  
Vol 16 (S2) ◽  
pp. 1246-1247
Author(s):  
Y Zhang

Extended abstract of a paper presented at Microscopy and Microanalysis 2010 in Portland, Oregon, USA, August 1 – August 5, 2010.


Metallurgist ◽  
2015 ◽  
Vol 59 (3-4) ◽  
pp. 241-247 ◽  
Author(s):  
M. Yu. Kollerov ◽  
S. D. Shlyapin ◽  
K. S. Senkevich ◽  
A. A. Kazantsev ◽  
Yu. E. Runova

2017 ◽  
Vol 56 (7-8) ◽  
pp. 399-406
Author(s):  
I. A. Morozov ◽  
V. V. Skorokhod ◽  
R. O. Morozova ◽  
A. I. Itsenko ◽  
O. V. Bezdorozhev

Coatings ◽  
2020 ◽  
Vol 10 (2) ◽  
pp. 177 ◽  
Author(s):  
Xiyang Li ◽  
Kun Yang ◽  
Dezhi Wang ◽  
Chunming Deng ◽  
Yanzhe Zhou

Using TiO2-15MgAl2O4 mixed powder as spray-feed, an electrical-heating coating was successfully fabricated by atmospheric plasma spraying technology. The phase composition, microstructure, and electrical-heating performance of the coating were characterized by XRD, SEM, and cyclic electrification tests, respectively. The coating samples were heat-treated at 350 °C in a hydrogen atmosphere. The results show that TiO2-15MgAl2O4 coating can be heated over 300 °C within 30 m at 55.1 V which preserves heat for a long time. Before heat treatment, the available heating temperature of the coating decreases significantly with electrification cycles. The resistivity of coating rises rapidly during the cyclic electricity test. After hydrogen heat treatment, the electrical-heating property of coatings is significantly enhanced.


1976 ◽  
Vol 15 (6) ◽  
pp. 1147-1148
Author(s):  
Masanori Abe ◽  
Manabu Gomi ◽  
Yasumichi Mori ◽  
Shōichiro Nomura

Author(s):  
R. M. Anderson

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.


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