Scanning Electron Microscope Induced Electrical Breakdown of Tungsten Windows in Integrated Circuit Processing
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Abstract Interaction of inline SEM inspections with tungsten window-1 integrity were investigated. Multiple SEMs were utilized and various points in the processing were inspected. It was found that in certain circumstances inline SEM inspection induced increased window-1 contact resistance in both source/drain and gate contacts, up to and including electrical opens for the source/drain contacts.
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1992 ◽
1974 ◽
Vol 121
(2)
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pp. 307
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1986 ◽
Vol 4
(2)
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pp. 493
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