New Approach of Laser-SQUID Microscopy to LSI Failure Analysis

2009 ◽  
Vol E92-C (3) ◽  
pp. 327-333 ◽  
Author(s):  
Kiyoshi NIKAWA ◽  
Shouji INOUE ◽  
Tatsuoki NAGAISHI ◽  
Toru MATSUMOTO ◽  
Katsuyoshi MIURA ◽  
...  
Keyword(s):  
Failure Analysis ◽  
New Approach

An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages

2009 ◽  
Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai
Keyword(s):  
Thermal Stress ◽  
Failure Analysis ◽  
Deformation Measurement ◽  
Stress Conditions ◽  
Analysis Approach ◽  
New Approach ◽  
Reliability Improvement

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.

scholarly journals Parameters Assessment of the FMEA Method by Means of Fuzzy Logic

2018 ◽  
Vol 2 (Special edition 2) ◽  
pp. 123-132
Author(s):  
Jasminka Bonato ◽  
Martina Badurina ◽  
Julijan Dobrinić
Keyword(s):  
Fuzzy Logic ◽  
Failure Analysis ◽  
Failure Mode ◽  
Mathematical Function ◽  
Analysis Method ◽  
Effect Analysis ◽  
New Approach ◽  
System Failures ◽  
Numerical Indicator ◽  
Fmea Method

The paper aims at presenting the FMEA method based on the fuzzy technique, representing a new approach to the failure analysis and its effects on the observed system. The FMEA (Failure Mode and Effect Analysis) method has assigned the risks a coefficient i.e. a numerical indicator that very clearly defines the degree of risk. The risk is calculated as a mathematical function of RPN which depends on the effects S, probability O that some case will lead to a failure and to a probability that a failure D can not be detected before its effects are realized. RPN = S O D. The FMEA method, based on the fuzzy logic, makes a more reliable evaluation of the observed system failures possible.

Applying Interval Fuzzy Petri Net to Failure Analysis

2020 ◽  
Vol 11 (1) ◽  
pp. 14-30
Author(s):  
Lajmi Fatma ◽  
Jalel Ghabi ◽  
Hedi Dhouibi
Keyword(s):  
Fuzzy Logic ◽  
Failure Analysis ◽  
Petri Nets ◽  
Graphical Representation ◽  
Logic Gate ◽  
New Approach ◽  
Novel Method ◽  
Definition Of ◽  
Fuzzy Logic Technique ◽  
The Relationship

In this article, the authors propose a new approach for modelling and failure analysis by combining the graphical representation provided by Petri nets and fuzzy logic. The graphical method is used for describing the relationship between conditions and events. The use of Petri nets in failure analysis enables replacing logic gate functions in fault trees. The Fuzzy logic technique allows natural language descriptions of process entities as well as an if-then rule-based definition of production. In addition, this study devises an alternative, a trapezoidal graph method in order to account for failure scenarios. Examples validating this novel method in dealing with failure analysis are also provided.

Innovative Nondestructive Compositional Mapping of Trace-Elements and Contaminants at Micron-Scale in Wafers and Packaging

2016 ◽  
Author(s):  
S.H. Lau ◽  
Wenbing Yun ◽  
Sylvia JY Lewis ◽  
Benjamin Stripe ◽  
Janos Kirz ◽  
...  
Keyword(s):  
Trace Elements ◽  
Failure Analysis ◽  
Process Monitoring ◽  
High Efficiency ◽  
Process Development ◽  
High Flux ◽  
Ray Optics ◽  
New Approach ◽  
X Ray ◽  
Analysis Process

Abstract We describe a technique for mapping the distribution and concentrations of trace elements, most notably with capabilities of achieving 1-10 parts per million sensitivities within 1 second and at <8 μm resolution. The technique features an innovative, high flux microstructured x-ray source and a new approach to x-ray optics comprising a high efficiency twin paraboloidal x-ray mirror lens. The resulting ability to acquire dramatically higher sensitivities and resolution than conventional x-ray fluorescence approaches, and at substantially higher throughput enables powerful compositional mapping for failure analysis, process development, and process monitoring.

A new approach for making electrically conductive interconnections between small contacts in failure analysis

2012 ◽  
Vol 52 (9-10) ◽  
pp. 2135-2138
Author(s):  
Andreas Rummel ◽  
Klaus Schock ◽  
Andrew Smith ◽  
Stephan Kleindiek
Keyword(s):  
Failure Analysis ◽  
Electrically Conductive ◽  
New Approach

Laser Voltage Tracing—A Novel Approach for Imaging Pulsed Signals

2016 ◽  
Author(s):  
Christopher Nemirow ◽  
Neel Leslie
Keyword(s):  
Failure Analysis ◽  
Test Pattern ◽  
Experimental Setup ◽  
New Approach ◽  
Voltage Imaging ◽  
Novel Approach

Abstract LVx, a workhorse in many failure analysis laboratories, consists of laser voltage imaging (LVI) and laser voltage probing. Laser voltage tracing (LVT) eliminates the inherent restrictions bestowed by LVI and reduces the need for costly probing. It monitors a distinct feature of the test pattern and creates a corresponding signal map. This weapon in the LVx arsenal significantly decreases debug time and will prove as invaluable as LVI. Beginning with an overview of the limitations of traditional LVx, this paper provides information on the process steps, experimental setup, and applications of LVT. LVT introduces a new approach to monitoring LVx signals. The most obvious LVT application is debugging problematic peripheral NAND circuitry.

Laser Voltage Imaging: New Perspective Using Second Harmonic Detection on Submicron Technology

2012 ◽  
Author(s):  
Guillaume Celi ◽  
Sylvain Dudit ◽  
Thierry Parrassin ◽  
Michel Vallet ◽  
Philippe Perdu ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Failure Analysis ◽  
Case Studies ◽  
Second Harmonic ◽  
New Approach ◽  
Voltage Imaging ◽  
Signal Degradation ◽  
New Perspective ◽  
Process Issue ◽  
The Impact

Abstract The Laser Voltage Imaging (LVI) technique [1], introduced in 2009, appears as a very promising approach for Failure Analysis application which allows mapping frequencies through the backside of integrated circuits. In this paper, we propose a new range of application based on the study of the LVI second harmonic for signal degradation analysis. After a theoretical study of the impact of signal degradation on the second harmonic, we will demonstrate the interest of this new approach on two case studies on ultimate technology (28nm). This technique is a new approach of failure analysis that maps timing degradation and duty cycle degradation. In order to confirm the degradations we will use the LVP Technique. The last part is two real case studies on which this LVI second harmonic technique was used to find the root cause of a 28nm process issue.

Improving Failure Analysis for Cell-Internal Defects through Cell-Aware Technology

2013 ◽  
Author(s):  
F. Hapke ◽  
M. Keim ◽  
T. Herrmann ◽  
T. Heidel ◽  
M. Reese ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Hot Spot ◽  
New Method ◽  
Internal Defects ◽  
Test Chip ◽  
New Approach ◽  
Electrical Failure ◽  
Diagnosis Method ◽  
A Cell ◽  
Standard Library

Abstract This paper describes a new approach for quickly ramping up the yield for new CMOS technologies by performing a cell-internal (CI) diagnosis based on the cell-aware (CA) methodology. We present results from carrying out this new method on a test chip of a 28-nm technology. After creating defect-oriented CA test patterns for this test chip, we tested various wafers with those CA patterns, selected fail data, conducted a normal electrical failure analysis, and used the new CI diagnosis method to guide the physical failure analysis (PFA) process to look specifically for hot-spot areas within standard library cells. This new approach can reduce the yield ramp-up time significantly.

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