Studies on a Qualification Method (OSAT) of Microchip Al Bondpads in Wafer Fabrication

Author(s):  
Hua Younan ◽  
Nistala Ramesh Rao ◽  
Ng Adrian ◽  
Tsai Tony

Abstract Non-stick on pad (NSOP) is a yield limiting factor that can occur due to various reasons such as particle contamination, galvanic corrosion, Fluorine-induced corrosion, process anomalies, etc. The problem of NSOP can be mitigated through a careful process characterization and optimization. In this paper, a bondpad qualification methodology (OSAT) will be discussed. It will be argued that by employing different physical analysis techniques in a failure analysis of wafer fabrication, it is possible to perform comprehensive characterization studies of the Aluminum bondpad so as to develop a robust far backend of line process. A good quality Al bondpad must meet the following four conditions-OSAT: (i) it should be no discoloration (using Optical inspection); (ii) should be defect free (using SEM inspection); (iii) should be with low contamination level (such as fluorine and carbon contamination should be within a control limit) (using Auger analysis) and (iv) should have a protective layer on bondpad surface so as to prevent bondpad corrosion (using TEM).

Author(s):  
Hua Younan

Abstract In wafer fabrication (Fab), Fluorine (F) based gases are used for Al bondpad opening process. Thus, even on a regular Al bondpad, there exists a low level of F contamination. However, the F level has to be controlled at a lower level. If the F level is higher than the control/spec limits, it could cause F-induced corrosion and Al-F defects, resulting in pad discoloration and NSOP problems. In our previous studies [1-5], the theories, characteristics, chemical and physical failure mechanisms and the root causes of the F-induced corrosion and Al-F defects on Al bondpads have been studied. In this paper, we further study F-induced corrosion and propose to establish an Auger monitoring system so as to monitor the F contamination level on Al bondpads in wafer fabrication. Auger monitoring frequency, sample preparation, wafer life, Auger analysis points, control/spec limits and OOC/OOS quality control procedures are also discussed.


Author(s):  
Hua Younan

Abstract A failure analysis flow is developed for surface contamination, corrosion and underetch on microchip Al bondpads and it is applied in wafer fabrication. SEM, EDX, Auger, FTIR, XPS and TOF-SIMS are used to identify the root causes. The results from carbon related contamination, galvanic corrosion, fluorine-induced corrosion, passivation underetch and Auger bondpad monitoring will be presented. The failure analysis flow will definitely help us to select suitable methods and tools for failure analysis of Al bondpad-related issues, identify rapidly possible root causes of the failures and find the eliminating solutions at both wafer fabrication and assembly houses.


Author(s):  
Daniel Cavasin ◽  
Abdullah Yassine

Abstract Bond pad metal corrosion was observed during assembly process characterization of a 0.13um Cu microprocessor device. The bond pad consisted of 12kÅ of Al-0.5%Cu atop 9kÅ of Cu, separated by a thin Ta diffusion barrier. The corrosion was first noted after the wafer dicing process. Analysis of the pad surface revealed pitting-type corrosion, consistent with published reports of classic galvanic cell reactions between Al2Cu (theta phase) particles and the surrounding Al pad metal. Analysis of the bond pads on samelot wafers which had not been diced showed higher-thanexpected incidence of hillock and pit hole defects on the Al surface. Statistically designed experiments were formulated to investigate the possibility that the observed pre-saw pad metal defects act as nucleation sites for galvanic corrosion during the sawing process. Analyses of the experimental samples were conducted using optical and scanning electron microscopy, along with focused ion beam deprocessing and energy dispersive X-ray. This paper explores the relationship between the presence of these pre-existing defects and the propensity for the bond pads to corrode during the dicing process, and reviews the conditions under which pit hole defects are formed during the final stages of the Cu-metallized wafer fabrication process. Indications are that strict control of wafer fab backend processes can reduce or eliminate the incidence of such defects, resulting in elimination of bond pad corrosion in the wafer dicing process.


2021 ◽  
Vol 1 (50) ◽  
pp. 188-197
Author(s):  
KRZEMIŃSKI A ◽  
◽  
SZYMCZUK P ◽  

During the production, transportation, distribution, use or storage of diesel fuel, liquid and solid substances get into it, negatively affecting their operational properties. These substances are called pollutants. At the same time, impurities are removed from the fuel by filtration, dehydration and settling. The total amount is the result of the cleaning process. The performance of the aforementioned tasks of the fuel system is mainly determined by the corresponding physicochemical properties of the diesel fuel. The properties of the fuel that affect the functioning of the fuel system are as follows: masticity, viscosity, density, rheological indicators at low temperatures. Failure to comply with the requirements for oil and the content of impurities in diesel fuel can quickly damage injection equipment, which is sensitive to changes in fuel quality. By nature, contaminants of diesel fuel include: dust particles, water, corrosion products of pipelines and tanks, microorganisms, resinous substances. The requirements for diesel oils contained in the PN-EN 590 standard determine the permissible contamination level. The maximum content of solid pollutants for diesel engines is 24 mg / kg. This value is the amount of solids released when filtering a given amount of fuel through a nitrocellulose filter, the pore size of which is less than 0.8 microns. The fifth edition of the World Fuel Charter, September 2013, contains an additional criterion for the particle size of particulate pollutants. A section introduced concerns particles larger than 4 µm, 6 µm and 14 µm. According to the assumption of the division of molecules into corresponding groups of sizes, the purity of diesel fuel is determined by three numbers. These, in turn, correspond to the number of molecules contained in the above size ranges. TDue to the possibility of microbial growth, filter blocking or increased galvanic corrosion, it is assumed that the water in diesel fuel should not be in a separate phase. The permitted water content in diesel fuel is 200 mg / kg. The release of sulfur compounds into the atmosphere increases the concentration of other toxic components in the exhaust gases of vehicles with compression inflammation engines. Sulfur improves the masticability of diesel fuel, but due to environmental protection, its content is systematically reduced. Modern standards for these fuels allow sulfur content up to 10 mg / kg. The content of impurities can be defined as the volume (v / v) or mass (w / m) fraction of impurities contained in a unit volume or mass of the test liquid. There are many methods for determining the content of various types of impurities, from the simplest - visual, through quantitative and qualitative tests, to chemical tests. Four samples of diesel fuel were tested. Diesel (ON) was the baseline. The rest of the samples underwent an accelerated contamination procedure. The pollutants used in the study were: water, gasoline, solid powder abrasive substances consisting of silicon carbide grains SiC (95 - 98%) and impurities Fe2O3, Al2O3, CaO, SiO2, MnO2, granulation 4.5 μm ± 1%. In a baseline test of unstained diesel fuel, a capture force Poz of 930 N was obtained. Capture occurred after 2 s of the test. The sample, a mixture of diesel and gasoline, showed a slight decrease in Poz strength compared to baseline breakdown. The difference was 3%. The time over which the entrainment was observed was similar to the time taken for the baseline sample. During the examination of a diesel fuel sample contaminated with solid particles of abrasive powder, there was a sharp decrease in the gripping force by as much as 97% relative to the result obtained for the base sample, and the beginning of gripping was less than 0.5 s. Tests with a mixture of diesel fuel and water showed a 15% decrease in gripping force, and the time was also 2 s. After comparing the results obtained, it can be concluded that all the impurities used influenced the force of the gripping load. Different results indicate different degrees of influence of certain pollutants on the makability of diesel oil. KEY WORDS: DIESEL, POLLUTANTS, LUBRICANT PROPERTIES, GRIP, GRIP STRENGTH.


2019 ◽  
Vol 25 (3) ◽  
pp. 219-223 ◽  
Author(s):  
Younan Hua ◽  
Lee Yuan Ping ◽  
Nistala R. Rao ◽  
Tian Qinghua

Author(s):  
Y. N. Hua ◽  
E. C. Low ◽  
L. H. An ◽  
Shailesh Redkar

Abstract In our previous paper [1], discolored bondpads due to galvanic corrosion were studied. The results showed that the galvanic corrosion occurred in 0.8 ìm wafer fabrication (fab) process with cold Al alloy (Al-Si, 0.8 wt%-Cu, 0.5 wt%) metallization. Galvanic corrosion is also known as a two-metal corrosion and it could be due to either wafer fab process or assembly process. Our initial suspicion was that it was due to a DI water problem during wafer sawing at assembly process. After that, we did further failure analysis and investigation work on galvanic corrosion of bondpads and further found that galvanic corrosion might be due to longer rinsing time of DI water during wafer sawing. The rinsing time of DI water is related to the cutting time of wafer sawing. Therefore, some experiments of wafer sawing process were done by using different sizes of wafer (1/8 of wafer, a quadrant of wafer and whole of wafer) and different sawing speed (feed-rate). The results showed that if the cutting time was longer than 25 minutes, galvanic corrosion occurred on bondpads. However, if the cutting time was shorter than 25 minutes, galvanic corrosion was eliminated. Based on the experimental results, it is concluded that in order to prevent galvanic corrosion of bondpads, it is necessary to select higher feed-rate during wafer sawing process at assembly houses. In this paper, we will report the details of failure analysis and simulation experimental results, including the solution to eliminate galvanic corrosion of bondpads during wafer sawing at assembly houses.


2012 ◽  
Vol 84 (3) ◽  
pp. 807-822 ◽  
Author(s):  
Luiz F.S. Magnago ◽  
Sebastião V. Martins ◽  
Carlos E.G.R. Schaefer ◽  
Andreza V. Neri

The aim of this study was to determine changes in composition, abundance and richness of species along a forest gradient with varying soils and flood regimes. The forests are located on the left bank of the lower Jucu River, in Jacarenema Natural Municipal Park, Espírito Santo. A survey of shrub/tree species was done in 80 plots, 5x25 m, equally distributed among the forests studied. We included in the sampling all individuals with >3.2 cm diameter at breast height (1.30 m). Soil samples were collected from the surface layer (0-10 cm) in each plot for chemical and physical analysis. The results indicate that a significant pedological gradient occurs, which is influenced by varying seasonal groundwater levels. Restinga forest formations showed significant differences in species richness, except for Non-flooded Forest and Non-flooded Forest Transition. The Canonical Correlation Analysis (CCA) showed that some species are distributed along the gradient under the combined influence of drainage, nutrient concentration and physical characteristics of the soil. Regarding the variables tested, flooding seems to be a more limiting factor for the establishment of plant species in Restinga forests than basic soil fertility attributes.


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