Words for the “Whys”

2012 ◽  
Author(s):  
Richard J. Ross
Keyword(s):  
Human Brain ◽  
Failure Analysis ◽  
State Of The Art ◽  
Intellectual Curiosity ◽  
Basic Tool ◽  
Cause Analysis ◽  
Root Cause ◽  
Analysis Process ◽  
Tools And Techniques ◽  
Attention To Detail

Abstract In an era where the complexity and cost of Failure Analysis tools and techniques is rapidly expanding, it is easy sometimes to lose sight of the basic tool and technique required for successful root-cause analysis. That technique is intellectual curiosity and the tool is the human brain. This paper will describe a simple methodology to insure that this tool and technique are properly engaged either concomitant with or in the absence of state-of-the-art instrumentation and computation. Two simple case studies will be used to illustrate where the Failure Analysis process can easily go awry without proper attention to detail, and, conversely, from too much attention to detail.

Root Cause Analysis for Pin Leakage

2016 ◽  
Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala
Keyword(s):  
Failure Analysis ◽  
Root Cause Analysis ◽  
Advanced Technology ◽  
Process Step ◽  
Cause Analysis ◽  
Hard Mask ◽  
Technology Node ◽  
Root Cause ◽  
Tools And Techniques

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.

A Logical Problem Solving Process for High Via Resistance Root Cause Analysis

2008 ◽  
Author(s):  
K. Li ◽  
P. Liu ◽  
J. Teong ◽  
M. Lee ◽  
H. L. Yap
Keyword(s):  
Problem Solving ◽  
Failure Analysis ◽  
Failure Mechanism ◽  
High Resistance ◽  
Cause Analysis ◽  
Logical Problem ◽  
Root Cause ◽  
Analysis Process ◽  
Problem Solving Process

Abstract This paper presents a case study on via high resistance issue. A logical failure analysis process EDCA (Effect, Defect, Cause, and Action) is successfully applied to find out the failure mechanism, pinpoint the root cause and solve the problem. It sets up a very good example of how to do tough failure analysis in a controllable way.

SEM-Based Nanoprobing on 40, 32 and 28 nm CMOS Devices Challenges for Semiconductor Failure Analysis

2013 ◽  
Author(s):  
Erik Paul ◽  
Holger Herzog ◽  
Sören Jansen ◽  
Christian Hobert ◽  
Eckhard Langer
Keyword(s):  
Electron Microscope ◽  
High Resolution ◽  
Scanning Electron Microscope ◽  
Failure Analysis ◽  
Case Studies ◽  
State Of The Art ◽  
Root Cause ◽  
Highly Efficient ◽  
Technology Nodes ◽  
Scanning Electron

Abstract This paper presents an effective device-level failure analysis (FA) method which uses a high-resolution low-kV Scanning Electron Microscope (SEM) in combination with an integrated state-of-the-art nanomanipulator to locate and characterize single defects in failing CMOS devices. The presented case studies utilize several FA-techniques in combination with SEM-based nanoprobing for nanometer node technologies and demonstrate how these methods are used to investigate the root cause of IC device failures. The methodology represents a highly-efficient physical failure analysis flow for 28nm and larger technology nodes.

scholarly journals Early Engagement of Residents Into the Root Cause Analysis Process

2016 ◽  
Vol 8 (3) ◽  
pp. 459-460 ◽  
Author(s):  
Miriam Bar-on ◽  
Ross P. Berkeley
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause ◽  
Analysis Process

scholarly journals Employing a Root Cause Analysis Process to Improve Examination Quality

2019 ◽  
Vol 94 (1) ◽  
pp. 71-75 ◽  
Author(s):  
Sally A. Santen ◽  
Karri L. Grob ◽  
Seetha U. Monrad ◽  
Caren M. Stalburg ◽  
Gary Smith ◽  
...  
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause ◽  
Analysis Process ◽  
Examination Quality

Root Cause Analysis of Glovebox Glove Failure

2007 ◽  
Author(s):  
Y. H. Park ◽  
Michael Cournoyer
Keyword(s):  
Safety Concern ◽  
National Laboratory ◽  
Root Cause Analysis ◽  
Nuclear Materials ◽  
Alamos National Laboratory ◽  
Cause Analysis ◽  
Los Alamos National Laboratory ◽  
Root Cause ◽  
Analysis Process

The Nuclear Materials Technology (NMT) Division has the largest inventory of glovebox gloves at Los Alamos National Laboratory (LANL). Consequently, the minimization of unplanned breaches of the glove material, typically resulting in glove failures, is a significant safety concern in the daily operations in NMT Division facilities. To investigate processes and procedures that minimize unplanned breaches in the glovebox, information on glovebox glove failures has been compiled from formal records and analyzed using statistical methods. Based on these research results, the next step of the research is to identify root causes of glove failures and the actions adequate to prevent recurrence. In this paper, root cause analysis was conducted for a cleanup breach case study to demonstrate the computerized root cause analysis process. Based on analysis results, effective recommendations were generated.

Hamilton Acute Pain Service Safety Study

2014 ◽  
Vol 120 (1) ◽  
pp. 97-109 ◽  
Author(s):  
James E. Paul ◽  
Norman Buckley ◽  
Richard F. McLean ◽  
Karen Antoni ◽  
David Musson ◽  
...  
Keyword(s):  
Acute Pain ◽  
Root Cause Analysis ◽  
Acute Pain Service ◽  
Patient Controlled Analgesia ◽  
Cause Analysis ◽  
Root Cause ◽  
Analysis Process ◽  
Severe Hypotension ◽  
Before And After ◽  
Address System

Abstract Background: Although intravenous patient-controlled analgesia opioids and epidural analgesia offer improved analgesia for postoperative patients treated on an acute pain service, these modalities also expose patients to some risk of serious morbidity and even mortality. Root cause analysis, a process for identifying the causal factor(s) that underlie an adverse event, has the potential to identify and address system issues and thereby decrease the chance of recurrence of these complications. Methods: This study was designed to compare the incidence of adverse events on an acute pain service in three hospitals, before and after the introduction of a formal root cause analysis process. The “before” cohort included all patients with pain from February 2002 to July 2007. The “after” cohort included all patients with pain from January 2009 to December 2009. Results: A total of 35,384 patients were tracked over the 7 yr of this study. The after cohort showed significant reductions in the overall event rate (1.47 vs. 2.35% or 1 in 68 vs. 1 in 42, the rate of respiratory depression (0.41 vs. 0.71%), the rate of severe hypotension (0.78 vs. 1.34%), and the rate of patient-controlled analgesia pump programming errors (0.0 vs. 0.08%). Associated with these results, the incidence of severe pain increased from 6.5 to 10.5%. To achieve these results, 26 unique recommendations were made of which 23 being completed, 1 in progress, and 2 not completed. Conclusions: Formal root cause analysis was associated with an improvement in the safety of patients on a pain service. The process was effective in giving credibility to recommendations, but addressing all the action plans proved difficult with available resources.

Root Cause Analysis: Simplified Tools and Techniques

Technometrics ◽  
2007 ◽  
Vol 49 (3) ◽  
pp. 364-364
Author(s):  
Norman Bresky
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause ◽  
Tools And Techniques
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