Failure Localization of an Electrical Transient Behavior on a Mixed-Mode IC by Using Static Emission Microscopy Technique

2013 ◽  
Author(s):  
Magdalena Sienkiewicz ◽  
Estelle Huynh ◽  
Alain Vidal
Keyword(s):  
Mixed Mode ◽  
Transient Behavior ◽  
Microscopy Technique ◽  
Wafer Fab ◽  
Emission Microscopy ◽  
Failure Localization

Abstract This paper presents a case study on reliability reject on a Freescale mixed-mode IC. It focuses on a novel use of one of most frequently used failure localization techniques: static emission microscopy (EMMI) to localize a failure due to an electrical transient behavior. This work helped Freescale to identify a wafer fab process limitation and contributed to test improvement.

Case Study: Combined Dynamic Laser Stimulation and Static Emission Microscopy Techniques Applied to Scan Test Failure on Mixed Mode Device

2012 ◽  
Author(s):  
Magdalena Sienkiewicz ◽  
Philippe Rousseille
Keyword(s):  
Mixed Mode ◽  
Laser Stimulation ◽  
Scan Test ◽  
Silicon Bulk ◽  
Defect Localization ◽  
Emission Microscopy ◽  
Microscopy Techniques ◽  
Test Failure

Abstract This paper presents a case study on scan test reject in a mixed mode IC. It focuses on the smart use of combined mature FA techniques, such as Soft Defect Localization (SDL) and emission microscopy (EMMI), to localize a random scan test anomaly at the silicon bulk level.

Novel Application of the OBIRCh Amplifier for Timing Failure Localization

2008 ◽  
Author(s):  
M. Sienkiewicz ◽  
P. Perdu ◽  
S. Brule ◽  
A. Firiti ◽  
O. Crepel
Keyword(s):  
Failure Analysis ◽  
Mixed Mode ◽  
Flow Time ◽  
Real Case ◽  
Simple Application ◽  
Application Field ◽  
Laser Techniques ◽  
Mapping Techniques ◽  
Failure Localization

Abstract Soft defects localization by laser techniques on dynamically working ICs is widely used for Failure Analysis (FA). In this context, many AC signal-oriented analysis methods have been introduced to date (SDL, LADA…) or are under development (xVM…). Sophisticated tools are available to localize these kinds of failures but not every FA laboratory has them. By fully exploiting the capabilities of static localization tools, it is possible to deal with timing issues. In this paper, we propose a novel application of the OBIRCh amplifier related to the timing issues on a real case study (mixed-mode device). This novel and very simple application makes the analysis flow time-attractive and enlarges the application field of mapping techniques on the existing tools.

Analysis of Delta Iddq Soft Fails on Pass Chips

2006 ◽  
Author(s):  
I. Österreicher ◽  
S. Eckl ◽  
B. Tippelt ◽  
S. Döring ◽  
R. Prang ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Failure Mode ◽  
Photon Emission ◽  
Complete Analysis ◽  
Functional Tests ◽  
Analysis Techniques ◽  
Atomic Force ◽  
Current Consumption ◽  
Emission Microscopy ◽  
Failure Localization

Abstract Depending on the field of application the ICs have to meet requirements that differ strongly from product to product, although they may be manufactured with similar technologies. In this paper a study of a failure mode is presented that occurs on chips which have passed all functional tests. Small differences in current consumption depending on the state of an applied pattern (delta Iddq measurement) are analyzed, although these differences are clearly within the usual specs. The challenge to apply the existing failure analysis techniques to these new fail modes is explained. The complete analysis flow from electrical test and Global Failure Localization to visualization is shown. The failure is localized by means of photon emission microscopy, further analyzed by Atomic Force Probing, and then visualized by SEM and TEM imaging.

SRAM Failure Analysis Strategy

2003 ◽  
Author(s):  
P. Egger ◽  
C. Burmer
Keyword(s):  
Liquid Crystal ◽  
Failure Analysis ◽  
The Other ◽  
Other Hand ◽  
Analysis Strategy ◽  
Emission Microscopy ◽  
Metal Layers ◽  
Failure Localization

Abstract The area of embedded SRAMs in advanced logic ICs is increasing more and more. On the other hand smaller structure sizes and an increasing number of metal layers make conventional failure localization by using emission microscopy or liquid crystal inefficient. In this paper a SRAM failure analysis strategy will be presented independent on layout and technology.

Teaching mixed‐mode: a case study in remote delivery of computer science in Africa

2004 ◽  
Vol 41 (4) ◽  
pp. 297-306 ◽  
Author(s):  
Sheila Howell ◽  
Michael C. Harris ◽  
Simon A. Wilkinson ◽  
Catherine Zuluaga ◽  
Paul Voutier
Keyword(s):  
Computer Science ◽  
Mixed Mode ◽  
Mode A

Three Dimensional Modeling of Inclined Surface Cracks in FGM Coatings

2009 ◽  
Vol 631-632 ◽  
pp. 109-114
Author(s):  
Sadik Kosker ◽  
Serkan Dag ◽  
Boray Yildirim
Keyword(s):  
Stress Intensity ◽  
Stress Intensity Factors ◽  
Mixed Mode ◽  
Thermal Stresses ◽  
Three Dimensional ◽  
Transient Behavior ◽  
Correlation Technique ◽  
Mixed Mode Fracture ◽  
Intensity Factors ◽  
Parametric Analyses

This study presents a three dimensional finite element method for mixed-mode fracture analysis of an FGM coating-bond coat-substrate structure. The FGM coating is assumed to contain an inclined semi-elliptical crack at the free surface. The trilayer structure is examined under the effect of transient thermal stresses. Strain singularity around the crack front is simulated by utilizing collapsed wedge-shaped singular elements. The modes I, II and III stress intensity factors are computed by applying the displacement correlation technique and presented as a function of time. Four different FGM coating types are examined in the parametric analyses which are metal-rich, ceramic-rich, linear variation and homogeneous coatings. The results provided illustrate the influences of the FGM coating type and crack inclination angle on the transient behavior of the mixed-mode stress intensity factors.

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