Root Cause Analysis of High Input Offset Voltage in Mixed-Signal Design Through Nanoprobing and Cadence Simulation

2019 ◽  
Author(s):  
Zhenni Wan ◽  
Weikai Yin ◽  
Yining Zang ◽  
Madhukar Karigerasi ◽  
Saurabh Kulkarni ◽  
...  
Keyword(s):  
Failure Modes ◽  
Root Cause Analysis ◽  
Fault Isolation ◽  
The Body ◽  
Cause Analysis ◽  
Mixed Signal ◽  
Root Cause ◽  
Offset Voltage ◽  
Amplifier Gain ◽  
Mixed Signal Ic

Abstract Root cause analysis of parametric failures in mixed-signal IC designs has been a challenging topic due to the marginality of failure modes. This work presents two case studies of offset voltage (Vos) failures which are commonly seen in mixed-signal IC designs. Nanoprobing combined with Cadence simulation becomes a powerful methodology in fault isolation. Large Vos is typically caused by the mismatch of electrical properties of the components on two balanced rails. In our first case, we present a case-study of nanoprobing combined with bench test and Cadence simulation to debug the root cause of a class-D amplifier voltage offset related yield loss from mixedsignal design sensitivity. Bench electrical measurements confirm the dependency of offset voltage (Vos) on boost voltage (VBST) and amplifier gain settings, which isolates the root cause from mismatch in amplifier gain resistors. The bench measurements match extremely well when an extra parasitic resistance is added to the input of the amplifier in the Cadence simulation. Kelvin 4 points nanoprobing on the amplifier input matching resistors confirmed a 40% mismatch as a result of both layout sensitivity and fabrication. This case highlights that the role of nanoprobing combined with Cadence simulation is not only valuable in physical failure root cause analysis but also in providing guidance to a potential process fix for current and future designs. In our second case, a decrease in offset voltage (Vos) is found through bench validation by reducing the supply voltage (VDD), suggesting a new mismatch mechanism related to the body-source bias. Nanoprobing of the input PMOS transistors clearly shows humps in the subthreshold region of IV characteristics, and the severity of humps increases with body-source bias. Vos derived from the nanoprobing results aligns well with the bench data, suggesting hump effect to be the root cause of Vos deviation. This study suggests that by combining Cadence simulation and nanoprobing in the failure analysis process of parametric failures, suspicious problematic devices can be identified more easily, greatly reducing the need for trial and error.

Root Cause Analysis Techniques Using Picosecond Time Resolved LADA

2014 ◽  
Author(s):  
Dan Bodoh ◽  
Kent Erington ◽  
Kris Dickson ◽  
George Lange ◽  
Carey Wu ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Picosecond Laser ◽  
Root Cause Analysis ◽  
Fault Isolation ◽  
Time Resolved ◽  
Cause Analysis ◽  
Root Cause ◽  
Design And Manufacturing ◽  
Multiple Interactions ◽  
Established Technique

Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits of 1064nm time resolved LADA (TR-LADA) with a picosecond laser. It shows several examples of how picosecond TR-LADA has complemented the existing fault isolation toolset and has allowed for quicker resolution of design and manufacturing issues. The paper explains how TR-LADA increases the LADA localization resolution by eliminating the well interaction, provides the timing of the event detected by LADA, indicates the propagation direction of the critical signals detected by LADA, allows the analyst to infer the logic values of the critical signals, and separates multiple interactions occurring at the same site for better understanding of the critical signals.

Different Failure Modes of Non-Metallic Pipelines at Connections

2014 ◽  
Author(s):  
Alex Tatarov ◽  
Frank Gareau
Keyword(s):  
Failure Modes ◽  
Root Cause Analysis ◽  
Case Histories ◽  
Actual Case ◽  
Cause Analysis ◽  
Root Cause ◽  
Pipeline Failures

The article provides an overview of different modes of failures in composite pipeline connections. Non-metallic spoolable (SCP) and reinforced thermoplastic pipelines (RTP) of different makes will be addressed. The article is based on actual case histories of pipeline failures (root cause analysis). Numerous factors contributing to failures and recommendations are discussed.

Applications of Soft Defect Localization (SDL) on AMD Advanced SOI Microprocessors

2006 ◽  
Author(s):  
Yi-Xuan Seah ◽  
M. Palaniappan ◽  
J.M. Chin
Keyword(s):  
Failure Modes ◽  
Root Cause Analysis ◽  
Silicon On Insulator ◽  
Process Technology ◽  
Cause Analysis ◽  
Process Improvements ◽  
Root Cause ◽  
Higher Temperature ◽  
Structural Failures ◽  
Lower Temperature

Abstract In this paper, we present application of the SDL technique towards full root cause analysis of functional and structural failures from BIST, SCAN etc. on AMD’s advanced Silicon-on-Insulator (SOI) microprocessors based on a 90 nm process technology node. The devices were exercised at speed using production testers. SDL is used on these microprocessors with failure modes which pass at a lower temperature/voltage but fail at higher temperature/voltage or vice versa to isolate the failing logic/node. The SDL sites are examined for a full root cause analysis and possible process improvements.

Challenges of System Level Failure Analysis of Electronics in the Automotive Industry

2017 ◽  
Author(s):  
Bence Hevesi
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Automotive Industry ◽  
Root Cause Analysis ◽  
Fault Isolation ◽  
System Level ◽  
Cause Analysis ◽  
Root Cause ◽  
Analysis Workflow

Abstract In this paper, different failure analysis (FA) workflows are showed which combines different FA approaches for fast and efficient fault isolation and root cause analysis in system level products. Two case studies will be presented to show the importance of a well-adjusted failure analysis workflow.

Fault Isolation of Soft P-N Junction Break Down Due to Plasma Charging

2007 ◽  
Author(s):  
Dat Nguyen ◽  
Taras Dudar
Keyword(s):  
Fault Isolation ◽  
Fabrication Process ◽  
Differential Amplifier ◽  
Wafer Fabrication ◽  
Cause Analysis ◽  
Mixed Signal ◽  
The Real ◽  
Root Cause ◽  
Analysis Design ◽  
P Type

Abstract The P-N junctions are part of the construction of semiconductor devices. They are formed by the combination of P-type and N-type diffusions. This paper discusses a soft (small early conduction) P-N junction breakdown. The P-N junction in this work is a part of a differential amplifier, which is widely used in analog/mixed signal devices. The paper outlines the test techniques to detect the differential amplifier failure, the circuit analysis (design and simulation), the fault isolation, and the root cause analysis with data from the wafer fabrication process to support plasma charging on the emitter. The real physical defect was not observable. However, with the help of lab data, the failure can be explained as plasma charging.

AI-Supported Workflows for Chemical Batch Plants

atp magazin ◽  
2020 ◽  
Vol 62 (8) ◽  
pp. 84-88
Author(s):  
Martin Hollender
Keyword(s):  
Failure Modes ◽  
Low Cost ◽  
Principal Component ◽  
Root Cause Analysis ◽  
Test Plant ◽  
Cause Analysis ◽  
Batch Plants ◽  
Root Cause ◽  
Digital Services ◽  
Novel Approach

Digitalization, Internet of Things, Big Data, Artificial Intelligence and Smart Sensors are some examples of rapidly developing technology areas with high impact on how industrial processes will be operated in the future. Here, we present an AI supported solution for cross-application workflows in batch plants. Based on a digital virtual assistant, industrial digital services are connected in workflows and support users in making the best use of the digital infrastructure at hand. We present two digital services which allow for early detection of failures in the production and root cause analysis: (1) a novel approach to online identification of batch failures building on an adjusted form of multiway principal component analysis; (2) a low-cost sensing infrastructure to perform root cause analysis for different failure modes which occur in batch plants. A case study of the implementation of the installation in a test plant is reported together with insights into the benefits and limitations of the approach gained via several process executions.

Failure mode and effect analysis (FMEA) of radiotherapy

2020 ◽  
Vol 10 (4) ◽  
pp. 1-22
Author(s):  
Rajaram Govindarajan ◽  
Mohammed Laeequddin
Keyword(s):  
Health Care ◽  
Quality Management ◽  
Ethical Dilemma ◽  
Failure Modes ◽  
Root Cause Analysis ◽  
Effect Analysis ◽  
Cause Analysis ◽  
Content Type ◽  
Root Cause ◽  
Error Proofing

Learning outcomes Learning outcomes are as follows: students will discover the importance of process orientation in management; students will determine the root cause of the problem by applying root cause analysis technique; students will identify the failure modes, analyze their effect, score them on a scale and prioritize the corrective action to prevent the failures; students will analyze the processes and propose error-proof system/s; and students will analyze organizational culture and ethical issues. Case overview/synopsis Purpose: This case study is intended as a class-exercise, for students to discover the importance of process-orientation in management, analyze the ethical dilemma in health care and to apply quality management techniques, such as five-why, root cause analysis, failure mode and effect analysis (FMEA) and error-proofing, in the management of the health-care and service industry. Design/methodology/approach: A voluntary reporting of a case of “radiation overdose” in a hospital’s radio therapy treatment unit, which led to an ethical dilemma. Consequently, a study was conducted to establish the causes of the incident and to develop a fail-proof system, to avoid recurrence. Findings: After careful analysis of the process-flow and the root causes, 25 potential failure modes were detected and the team had assigned a risk priority number (RPN) for each potential incident, selected the top ten RPNs and developed an error-proofing system to prevent recurrence. Subsequently, the improvement process was carried out for all the 25 potential incidents and a new control mechanism was implemented. The question of ethical dilemma remained unresolved. Research limitations/implications: Ishikawa diagram, FMEA and Poka-Yoke techniques require a multi-disciplinary team with process knowledge in identifying the possible root causes for errors, potential risks and also the possible error-proofing method/s. Besides, these techniques need frank discussions and agreement among team members on the efforts for the development of action plan, implementation and control of the new processes. Practical implications: Students can take the case data to identify root cause analysis and the RPN (RPN = possibility of detection × probability of occurrence × severity), to redesign the protocols, through systematic identification of the deficiencies of the existing protocols. Further, they can recommend quality improvement projects. Faculty can navigate the case session orientation, emphasizing quality management or ethical practices, depending on the course for which the case is selected. Complexity academic level MBA or PG Diploma in Management – health-care management, hospital administration, operations management, services operations, total quality management (TQM) and ethics. Supplementary materials Teaching Notes are available for educators only. Subject code CSS 9: Operations and Logistics.

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