High-resolution solid state image sennsor. Trends of high-resolution and high-performance solid state imaging technology.

Abstract An advanced high-resolution acoustic imaging technology was deployed for well integrity and deformation assessments in both vertical and horizontal wells. This high frequency acoustic tool collected three-dimensional data quantifying deformation and wall thickness with resolution unobtainable by existing multi-finger caliper, magnetic flux leakage, and rotating single element ultrasonic systems. Several novel imaging methods are enabled by the high number of transducers (up to 512) on the imaging probe. These methods, including beam forming, beam steering and semi-stochastic multipulse imaging, are outlined and discussed in this paper. In addition, multiple types of standardized visualizations enabled by this high-resolution 3D data capture tool are introduced and examples of each are shown. Lab qualification and imagery generated by the high-resolution solid-state imaging technology, when applied to various precision machined geometric anomalies, are presented. In addition to lab validation results, several field studies are showcased including assessments of ovalized casing, complex downhole corrosion, and isolated minor pitting. Leak paths, splits, and damaged regions within threaded casing collars were also identified, imaged, and quantified using the acoustic technology. Until now, these collar regions have been very difficult to image using legacy downhole tools due to fundamental limitations at the threaded connection geometry. Lastly, various downhole completion equipment case studies are presented showcasing several applications of acoustic imaging used to validate the set-position or condition of specialty downhole equipment. This paper outlines the usage of the solid-state acoustic technology to generate three dimensional geometry and wall thickness datasets with sub-millimetric resolution, providing operators with a holistic and actionable assessment of their well integrity.

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High-resolution scanning electron microscopy of thin-film magnetic media of magnetic recording disk

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100131309 ◽

1992 ◽

Vol 50 (2) ◽

pp. 1334-1335

Author(s):

K. Ogura ◽

H. Nishioka ◽

N. Ikeo ◽

T. Kanazawa ◽

J. Teshima

Keyword(s):

Thin Film ◽

Fine Structure ◽

High Resolution ◽

Magnetic Recording ◽

High Performance ◽

Magnetic Hysteresis ◽

Grain Structure ◽

Magnetic Media ◽

Cross Sectional ◽

Resolution Observation

Structural appraisal of thin film magnetic media is very important because their magnetic characters such as magnetic hysteresis and recording behaviors are drastically altered by the grain structure of the film. However, in general, the surface of thin film magnetic media of magnetic recording disk which is process completed is protected by several-nm thick sputtered carbon. Therefore, high-resolution observation of a cross-sectional plane of a disk is strongly required to see the fine structure of the thin film magnetic media. Additionally, observation of the top protection film is also very important in this field.Recently, several different process-completed magnetic disks were examined with a UHR-SEM, the JEOL JSM 890, which consisted of a field emission gun and a high-performance immerse lens. The disks were cut into approximately 10-mm squares, the bottom of these pieces were carved into more than half of the total thickness of the disks, and they were bent. There were many cracks on the bent disks. When these disks were observed with the UHR-SEM, it was very difficult to observe the fine structure of thin film magnetic media which appeared on the cracks, because of a very heavy contamination on the observing area.

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The use of high-resolution FESEM to study solid-state phase transformations and reactions

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100172875 ◽

1994 ◽

Vol 52 ◽

pp. 1028-1029

Author(s):

P. G. Kotula ◽

D. D. Erickson ◽

C. B. Carter

Keyword(s):

Solid State ◽

High Resolution ◽

Phase Transformations ◽

High Efficiency ◽

Sol Gel ◽

Quantitative Information ◽

Solid State Reactions ◽

Critical Dimensions ◽

Backscattered Electrons ◽

Backscattered Electron

High-resolution field-emission-gun scanning electron microscopy (FESEM) has recently emerged as an extremely powerful method for characterizing the micro- or nanostructure of materials. The development of high efficiency backscattered-electron detectors has increased the resolution attainable with backscattered-electrons to almost that attainable with secondary-electrons. This increased resolution allows backscattered-electron imaging to be utilized to study materials once possible only by TEM. In addition to providing quantitative information, such as critical dimensions, SEM is more statistically representative. That is, the amount of material that can be sampled with SEM for a given measurement is many orders of magnitude greater than that with TEM.In the present work, a Hitachi S-900 FESEM (operating at 5kV) equipped with a high-resolution backscattered electron detector, has been used to study the α-Fe2O3 enhanced or seeded solid-state phase transformations of sol-gel alumina and solid-state reactions in the NiO/α-Al2O3 system. In both cases, a thin-film cross-section approach has been developed to facilitate the investigation. Specifically, the FESEM allows transformed- or reaction-layer thicknesses along interfaces that are millimeters in length to be measured with a resolution of better than 10nm.

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