scholarly journals Optimal micro heat pipe configuration on high performance heat spreaders

2009 ◽  
Author(s):  
Seema Sandhaya Singh
2018 ◽  
Author(s):  
Zeyu Wang ◽  
Yanhua Diao ◽  
Yaohua Zhao ◽  
Chuanqi Chen ◽  
Lin Liang ◽  
...  

2021 ◽  
Vol 39 ◽  
pp. 102624
Author(s):  
Lincheng Wang ◽  
Yaohua Zhao ◽  
Zhenhua Quan ◽  
Jianan Liang

2011 ◽  
Vol 483 ◽  
pp. 603-606
Author(s):  
Tian Han ◽  
Xiao Wei Liu ◽  
Chao Wang

A kind of flat micro heat pipe with glass fiber wick structure is designed and fabricated. The structure of the wick is presented and also the excellence of the structure is described. For the glass fiber wick, the maximum heat transports is calculated by one-dimensional steady governing equations. Experimental testing is performed for the fabricated micro heat pipe in vacuum. The testing results is presented and analyzed.


Author(s):  
D. Sugumar ◽  
Kek Kiong Tio

A micro heat pipe will operate effectively by achieving its maximum possible heat transport capacity only if it is to operate at a specific temperature, i.e., design temperature. In reality, micro heat pipe’s may be required to operate at temperatures different from the design temperature. In this study, the heat transport capacity of an equilateral triangle micro heat pipe is investigated. The micro heat pipe is filled optimally with working fluid for a specific design temperature and operated at different operating temperatures. For this purpose, water, pentane and acetone was selected as the working fluids. From the numerical results obtained, it shows that the optimal charge level of the micro heat pipe is dependent on the operating temperature. Furthermore, the results also shows that if the micro heat pipe is to be operated at temperatures other than its design temperature, its heat transport capacity is limited by the occurrence of flooding at the condenser section or dryout at the evaporator section, depending on the operating temperature and type of working fluid. It is observed that when the micro heat pipe is operated at a higher temperature than its design temperature, the heat transport capacity increases but limited by the onset of dryout at the evaporator section. However, the heat transport capacity decreases if it is to be operated at lower temperatures than its design temperature due to the occurrence of flooding at condenser end. From the results obtained, we can conclude that the performance of a micro heat pipe is decreased if it is to be operated at temperatures other than its design temperature.


2017 ◽  
Vol 53 (11) ◽  
pp. 3241-3247 ◽  
Author(s):  
Mohammad Shahed Ahamed ◽  
Yuji Saito ◽  
Koichi Mashiko ◽  
Masataka Mochizuki

1995 ◽  
Vol 117 (1) ◽  
pp. 75-81 ◽  
Author(s):  
A. K. Mallik ◽  
G. P. Peterson

An experimental investigation of vapor deposited micro heat pipe arrays was conducted using arrays of 34 and 66 micro heat pipes occupying 0.75 and 1.45 percent of the cross-sectional area, respectively. The performance of wafers containing the arrays was compared with that of a plain silicon wafer. All of the wafers had 8 × 8 mm thermofoil heaters located on the bottom surface to simulate the active devices in an actual application. The temperature distributions across the wafers were obtained using a Hughes Probeye TVS Infrared Thermal Imaging System and a standard VHS video recorder. For wafers containing arrays of 34 vapor deposited micro heat pipes, the steady-state experimental data indicated a reduction in the maximum surface temperature and temperature gradients of 24.4 and 27.4 percent, respectively, coupled with an improvement in the effective thermal conductivity of 41.7 percent. For wafers containing arrays of 66 vapor deposited micro heat pipes, the corresponding reductions in the surface temperature and temperature gradients were 29.0 and 41.7 percent, respectively, and the effective thermal conductivity increased 47.1 percent, for input heat fluxes of 4.70 W/cm2. The experimental results were compared with the results of a previously developed numerical model, which was shown to predict the temperature distribution with a high degree of accuracy, for wafers both with and without the heat pipe arrays.


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