scholarly journals Improvement of Position Repeatability of a Linear Stage with Yaw Minimization

2022 ◽  
Vol 12 (2) ◽  
pp. 657
Author(s):  
Doo-Hyun Cho ◽  
Hyo-Chan Kwon ◽  
Kwon-Hee Kim
Keyword(s):  
Printed Circuit Boards ◽  
Test Equipment ◽  
Ball Screw ◽  
Linear Stage ◽  
Circuit Boards ◽  
Electronic Products ◽  
Position Errors ◽  
Short Circuits ◽  
Centers Of Mass ◽  
Ball Screw Drive

Recently, due to the miniaturization of electronic products, printed circuit boards (PCBs) have also become smaller. This trend has led to the need for high-precision electrical test equipment to check PCBs for disconnections and short circuits. The purpose of this study is to improve the position repeatability of the platform unit up to ±2.5 μm in linear stage type test equipment. For this purpose, the causes of the position errors of the platform unit are analyzed. The platform unit holding the PCB is driven by a single-axis linear ball screw drive system offset from its geometric center due to design constraints. The yaw rotation of the platform is found to have a dominant effect on position repeatability. To address this problem, adding balancing weights to the platform unit and adjusting the stiffness of the LM Guides are proposed. These methods reduce the yaw rotation by moving the centers of mass and stiffness closer to the linear ball screw actuator. In the verification tests, the position repeatability was decreased to less than ±1.0 μm.

scholarly journals Improvement of Position Repeatability of a Linear Stage with Yaw Minimization

2021 ◽  
Author(s):  
Doo Hyun Cho ◽  
Hyo Chan Kwon ◽  
Kwon Hee Kim
Keyword(s):  
Printed Circuit Boards ◽  
Test Equipment ◽  
Ball Screw ◽  
Linear Stage ◽  
Circuit Boards ◽  
Electronic Products ◽  
Position Errors ◽  
Short Circuits ◽  
Centers Of Mass ◽  
Ball Screw Drive

Recently, due to the miniaturization of electronic products, printed circuit boards (PCBs) have also become smaller. This trend has led to the need for high-precision electrical test equipment to check PCBs for disconnections and short circuits. The purpose of this study is to improve the position repeatability of the platform unit up to ±2.5 μm in a linear stage type test equipment. For this purpose, the causes of position errors of the platform unit are analyzed. The platform unit holding the PCB is driven by a single-axis linear ball screw drive system offset from its geometric center due to design constraints. The yaw rotation of the platform is found to have a dominant effect on position repeatability. To address this problem, the methods of adding balancing weights to the platform unit and adjusting the stiffness of LM Guides are proposed. This reduces the yaw rotation by moving the centers of mass and stiffness closer to the linear ball screw actuator. In the verification tests, the position repeatability was decreased to less than ±1.0 μm.

Three Dimensional Packaging of Bare IC Into Printed Circuit Boards for SIP

2003 ◽  
Author(s):  
Erik Jung ◽  
Dirk Wojakowski ◽  
Alexander Neumann ◽  
Rolf Aschenbrenner ◽  
Herbert Reichl
Keyword(s):  
Thermal Management ◽  
Printed Circuit Boards ◽  
Electrical Contact ◽  
Autonomous Systems ◽  
Three Dimensional ◽  
Circuit Boards ◽  
Passive Components ◽  
Electronic Products ◽  
Printed Circuit ◽  
Manufacturing Methods

The demand to miniaturize products especially for mobile applications and autonomous systems is continuing to drive the evolution of electronic products and manufacturing methods. To further the miniaturization of future products the integration of functions on miniaturized subsystems, i.e. System-in-Package (SiP) is a promising approach. Here, use of recent manufacturing methods allows to merge the SiP concept with a volumetric integration of IC’s. Up to now, most of the systems make use of single- or double-sided populated system carriers. A new challenge is to incorporate not only passive components, but as well active circuitry (IC’s) and the necessary thermal management. Ultra thin chips (i.e. silicon dies thinned down to <50μm total thickness) lend themselves to reach these goals. Chips with that thickness can be embedded in the dielectric layers of modern laminate PCB’s. Micro via technology allows to contact the embedded chip to the outer faces of the system circuitry. The aspects of embedding and making the electrical contact as well as the thermal management are highlighted. Results on FEM simulations and technical achievements are presented.

Technology Cost Modeling for the Manufacture of Printed Circuit Boards in New Electronic Products

1998 ◽  
Vol 120 (2) ◽  
pp. 368-375 ◽  
Author(s):  
S. G. Shina ◽  
A. Saigal
Keyword(s):  
Printed Circuit Boards ◽  
New Products ◽  
New Product ◽  
Cost Modeling ◽  
Design Stage ◽  
Design Team ◽  
Circuit Boards ◽  
Manufacturing Environment ◽  
Electronic Products ◽  
Printed Circuit

The rapid pace of technological and material advances has made it difficult to ascertain the most cost effective plan for manufacturing new products. The decision to identify the appropriate manufacturing methods and materials selection is most timely made during the initial design stage of the product. However, tradeoffs in manufacturing and materials technology are not easily discernible to the design team, while traditional cost accounting systems do not reflect the continuous improvements nor the opportunities in increasing quality and reducing cost. Systems that have recently been developed to assist in estimating new product cost, such as Activity Based Costing (ABC) and Technical Cost Modeling, focus on a stable manufacturing environment. They presume that production is either dedicated to the new product, or that utilization and/or yields of machines are at static levels. In most modern companies, the majority of new products introduced are evolutionary in nature, attempting to gain maximum advantage of current material and manufacturing technologies while continuing to be made alongside existing production. These new products can significantly change the current manufactured product and material mix, and hence their cost. A technology based modeling approach is presented in this paper to address the issues of changes in a dynamic manufacturing environment, where each design selection can be evaluated individually based on its production impact. Elements of this approach are described in the design of electronic products using printed circuit boards. The design team can select from a large combinations of technologies, materials and manufacturing steps, each with its particular cost, production rate and yield. A technology based cost modeling system can be developed to guide the team in the selection process by identifying the cost tradeoffs involved in each alternative design.

scholarly journals DIGITAL ELECTRONICS PRODUCTION MODELING AND PRODUCT QUALITY ASSURANCE

2019 ◽  
pp. 46-50
Author(s):  
A. A. Petrushevskaya
Keyword(s):  
Product Quality ◽  
Printed Circuit Boards ◽  
Quality Level ◽  
Circuit Boards ◽  
Electronic Products ◽  
Structural Framework ◽  
Digital Production ◽  
Production Concept ◽  
System Properties ◽  
Production Modeling

The introduction of elements of the concept of digital production is especially important in enterprises manufacturing electronic products that are in demand in all spheres of human activity. To create new objects representing the digital production concept, it is necessary to introduce technological innovations in the production of electronics. This is achieved by solving actual analyzing problems system properties means of production and ensuring product quality. Therefore, the article purpose is to ensure the quality of electronic products based on models and methods for analyzing the means and processes of electronic production. To achieve the goal, the digital production development in a structural framework, functional and informational description are considered. The results of the simulation stages of the production life cycle allowed us to estimate the achieved product quality level while improving the subsystems of automatic installation of printed circuit boards.

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