Technology Cost Modeling for the Manufacture of Printed Circuit Boards in New Electronic Products

1998 ◽  
Vol 120 (2) ◽  
pp. 368-375 ◽  
Author(s):  
S. G. Shina ◽  
A. Saigal

The rapid pace of technological and material advances has made it difficult to ascertain the most cost effective plan for manufacturing new products. The decision to identify the appropriate manufacturing methods and materials selection is most timely made during the initial design stage of the product. However, tradeoffs in manufacturing and materials technology are not easily discernible to the design team, while traditional cost accounting systems do not reflect the continuous improvements nor the opportunities in increasing quality and reducing cost. Systems that have recently been developed to assist in estimating new product cost, such as Activity Based Costing (ABC) and Technical Cost Modeling, focus on a stable manufacturing environment. They presume that production is either dedicated to the new product, or that utilization and/or yields of machines are at static levels. In most modern companies, the majority of new products introduced are evolutionary in nature, attempting to gain maximum advantage of current material and manufacturing technologies while continuing to be made alongside existing production. These new products can significantly change the current manufactured product and material mix, and hence their cost. A technology based modeling approach is presented in this paper to address the issues of changes in a dynamic manufacturing environment, where each design selection can be evaluated individually based on its production impact. Elements of this approach are described in the design of electronic products using printed circuit boards. The design team can select from a large combinations of technologies, materials and manufacturing steps, each with its particular cost, production rate and yield. A technology based cost modeling system can be developed to guide the team in the selection process by identifying the cost tradeoffs involved in each alternative design.

Author(s):  
Erik Jung ◽  
Dirk Wojakowski ◽  
Alexander Neumann ◽  
Rolf Aschenbrenner ◽  
Herbert Reichl

The demand to miniaturize products especially for mobile applications and autonomous systems is continuing to drive the evolution of electronic products and manufacturing methods. To further the miniaturization of future products the integration of functions on miniaturized subsystems, i.e. System-in-Package (SiP) is a promising approach. Here, use of recent manufacturing methods allows to merge the SiP concept with a volumetric integration of IC’s. Up to now, most of the systems make use of single- or double-sided populated system carriers. A new challenge is to incorporate not only passive components, but as well active circuitry (IC’s) and the necessary thermal management. Ultra thin chips (i.e. silicon dies thinned down to <50μm total thickness) lend themselves to reach these goals. Chips with that thickness can be embedded in the dielectric layers of modern laminate PCB’s. Micro via technology allows to contact the embedded chip to the outer faces of the system circuitry. The aspects of embedding and making the electrical contact as well as the thermal management are highlighted. Results on FEM simulations and technical achievements are presented.


Author(s):  
Sisir K. Padhy ◽  
S. N. Dwivedi

Abstract In this paper, Printed Circuit Board Assembly Advisor (PCAAD), an object-oriented knowledge-based system is described. The system aims to aid the designer by suggesting design modifications that will lead to a better design for assembly of the Printed Circuit Boards. To account for the new trends in the printed circuit board production, hybrid technology, i.e. combination of both the through-hole mounted technology and surface mounted technology, is taken into consideration in developing the knowledge base. The assembly constraints as well as various limitations of different techniques and processes are considered to formulate the rules and guidelines. Moreover, a hierarchical rule structure has been employed in creating the knowledge base. Smalltalk-80, the object-oriented language and Surface Percept Description Language (SPDL) are used for the creation of knowledge base. The system provides a high-level user interface and reasoning capability to solve complex problems. It is capable of ranking different designs and suggesting design modifications to the designer during the design stage to eliminate assembly problems in the latter phase of board production.


Author(s):  
M. S. Kostin ◽  
D. S. Vorunichev ◽  
D. A. Korzh

The paper presents the main results of scientific and practical research in the field of special design reengineering and counterreengineering of radioelectronic devices. Methods and means of special design reengineering of functional modules of multilayer printed circuit boards and case microcircuits are presented. The basic process design for the reengineering of multilayer printed circuits of radioelectronic products is presented. The design is based on the physical principles of destructive and non-destructive decomposing test: mechanical processing and chemical etching, stereolaser structuring, IR imaging electrothermics and X-ray analysis. The article formulates positions and methodology of the circuit analysis of the basic architecture of electrical circuits and signal processes of radio electronic products by the configuration of the printed circuit, its electronic component base and their connected topologies. The article considers methods and techniques for the reengineering of radiotechnical circuits and signals enabling to reproduce the list of the electronic component base and the essential circuit technique, as well as to study the basic circuit characteristics of the appliance in four main modes: functional, in-circuit, peripheral and identification visualization. The methods and means of authentic performance of radioelectronic devices for a number of constructive and radiotechnical identifiers are considered. Technical methods and solutions for counterreengineering of radioelectronic devices have been developed.


2020 ◽  
Vol 15 ◽  
pp. 01-07
Author(s):  
Kuo-Hsien Hsia ◽  
Jr-Hung Guo

Printed Circuit Boards (PCB) are an integral part of all electronic products, and the production process for printed circuit boards is quite complex. As the life cycle of electronic products becomes shorter and shorter, and the precision and signal bandwidth of electronic products become higher and higher, the manufacturing process of printed circuit boards is further complicated. Therefore, how to pre-evaluate the production difficulty before starting the production will effectively increase the efficiency and quality of printed circuit board production. Gerber file is the most commonly used data format for the printed circuit board industry. This file contains most of the parameters required for the manufacture of printed circuit boards. Therefore, this study uses a neural network to evaluate new PCB products before they are produced through the production parameters that are more influential in the PCB manufacturing process. This makes it possible to evaluate the difficulty and the required production process before the new PCB product is produced. This will be very beneficial for the PCB production schedule, quality control, and cost.


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