scholarly journals Investigation of the Dynamic Recovery and Recrystallization of Near-β Titanium Alloy Ti-55511 during Two-Pass Hot Compression

Metals ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 359
Author(s):  
Hande Wang ◽  
Jinyang Ge ◽  
Xiaoyong Zhang ◽  
Chao Chen ◽  
Kechao Zhou
Keyword(s):  
Dynamic Recrystallization ◽  
Grain Growth ◽  
Dynamic Recovery ◽  
Peak Stress ◽  
Thermal Compression ◽  
Compression Behavior ◽  
Continuous Dynamic Recrystallization ◽  
First Pass ◽  
Restoration Mechanism ◽  
Continuous Dynamic

The two-pass thermal compression behavior of near-β Ti-55511 alloy was investigated. The first-pass restoration mechanisms changed from dynamic recrystallization (DRX) to dynamic recovery (DRV) as the first-pass deformation temperature increased from 700 °C to 850 °C. The occurrence of recrystallization reduced the dislocation density, resulting in a slower grain growth rate in the subsequent process. Because of the static recrystallization (SRX) and β grain growth, the β grain size increased and the morphology became less uniform during the subsequent β holding process, which also changed the restoration mechanism during second-pass compression. The level of continuous dynamic recrystallization (CDRX) and discontinuous dynamic recrystallization (DDRX) become weaker during second-pass deformation. The changes in the restoration mechanism and the microstructures slightly increased the peak stress during the second-pass deformation.

Hot Compression Deformation Behavior of Mg-Gd-Y-Zn-Zr Alloy

2014 ◽  
Vol 680 ◽  
pp. 15-22 ◽  
Author(s):  
Guang Lu ◽  
Zhi Ping Xie ◽  
Zhi Min Zhang ◽  
Yong Biao Yang ◽  
Bao Cheng Li
Keyword(s):  
Flow Stress ◽  
Magnesium Alloy ◽  
Dynamic Recrystallization ◽  
Strain Rate ◽  
Great Influence ◽  
Peak Stress ◽  
Maximum Error ◽  
Continuous Dynamic Recrystallization ◽  
Stress Behaviors ◽  
Continuous Dynamic

The deformation behaviors of as-cast Mg-11Gd-2Y-Zn-Zr magnesium alloy were investigated by compression test with Gleeble-1500 thermal simulator at temperature of 623-753K and strain rate of 0.01-0.5 s-1. The flow stress behaviors of the magnesium alloy were carried out at a strain of 0.7. The strain rate and deformation temperature had great influence on the flow stress behaviors. The flow stress increases with increasing strain rate and decreasing temperature. The flow stress has more than one peak stress at a strain rate of 0.5s-1showing continuous dynamic recrystallization (DRX) mechanism, while other flow stresses exhibited only one peak stress indicating discontinuous dynamic recrystallization (DDRX) mechanism. It was also found that the flow stress behavior could be described by the hyperbolic sine constitutive equation, in which the determined average activation energy is 273.426 kJ·mol-1. The maximum error value between calculated value and experimental value is 5.5%. The deformation map was also established, and the best parameter for hot working was found to be 0.1s-1/753k approximately.

Numerical Modeling of Continuous Dynamic Recrystallization in Sn-Based Solder Connection Under Cyclic Loading

2021 ◽  
Author(s):  
Marta Kuczynska ◽  
Ulrich Becker ◽  
Youssef Maniar ◽  
Steffen Weihe
Keyword(s):  
Grain Size ◽  
Dynamic Recrystallization ◽  
Cyclic Load ◽  
Fe Simulation ◽  
Operation Time ◽  
Inelastic Strain ◽  
Parameter Study ◽  
Continuous Dynamic Recrystallization ◽  
Gradual Evolution ◽  
Continuous Dynamic

Abstract The reoccurring cyclic load imposed onto soldered electronic components during their operation time leads to accumulation of inelastic strains in the structure. On a microscale level, the degree of plastic deformation is determined by the formation and annihilation of dislocations, leading to continuous refinement by creation of new grain boundaries, precipitates relocation and growth. This microstructure rearrangement, triggered by an increasing amount of inelastic deformation, is defined as dynamic recrystallization. This work presents a macroscale modelling approach for the description of continuous dynamic recrystallization observed in Sn-based solder connections. The model used in this work describes kinetics of macroscopic gradual evolution of equivalent grain size, where the initial grain size is continuously refined with increasing accumulated inelastic strain until a saturation grain size is reached. The rate and distribution of dynamic recrystallization is further numerically modelled dependent on the effective accumulated inelastic strain and governing stress multiaxiality. A parameter study of the presented model and its employment in finite element (FE) simulation is further described. Finally, FE simulation of the grain size evolution is demonstrated on an example of a bulky sample under isothermal cyclic mechanical loading, as well as a BGA-like structure under tensile, shear and mixed mode cyclic load.

scholarly journals In-situ characterization of continuous dynamic recrystallization during hot torsion of an Al–Si–Mg alloy

2020 ◽  
Vol 822 ◽  
pp. 153282 ◽  
Author(s):  
David Canelo-Yubero ◽  
Zsolt Kovács ◽  
J.F. Thierry Simonet Fotso ◽  
Domonkos Tolnai ◽  
Norbert Schell ◽  
...  
Keyword(s):  
Dynamic Recrystallization ◽  
Mg Alloy ◽  
In Situ Characterization ◽  
Continuous Dynamic Recrystallization ◽  
Hot Torsion ◽  
Continuous Dynamic

scholarly journals Investigation on Sub-Solvus Recrystallization Mechanisms in an Advanced γ-γ’ Nickel-Based Superalloy GH4151

Materials ◽  
2020 ◽  
Vol 13 (20) ◽  
pp. 4553
Author(s):  
Shaomin Lv ◽  
Jinbin Chen ◽  
Xinbo He ◽  
Chonglin Jia ◽  
Kang Wei ◽  
...  
Keyword(s):  
Dynamic Recrystallization ◽  
Hot Deformation ◽  
Energy Surface ◽  
Electron Backscatter Diffraction ◽  
True Strain ◽  
Continuous Dynamic Recrystallization ◽  
Nickel Based Superalloy ◽  
Transmission Electron ◽  
Continuous Dynamic ◽  
Backscatter Diffraction

Sub-solvus dynamic recrystallization (DRX) mechanisms in an advanced γ-γ’ nickel-based superalloy GH4151 were investigated by isothermal compression experiments at 1040 °C with a strain rate of 0.1 s−1 and various true strain of 0.1, 0.3, 0.5, and 0.7, respectively. This has not been reported in literature before. The electron backscatter diffraction (EBSD) and transmission electron microscope (TEM) technology were used for the observation of microstructure evolution and the confirmation of DRX mechanisms. The results indicate that a new dynamic recrystallization mechanism occurs during hot deformation of the hot-extruded GH4151 alloy. The nucleation mechanism can be described as such a feature, that is a primary γ’ (Ni3(Al, Ti, Nb)) precipitate embedded in a recrystallized grain existed the same crystallographic orientation, which is defined as heteroepitaxial dynamic recrystallization (HDRX). Meanwhile, the conventional DRX mechanisms, such as the discontinuous dynamic recrystallization (DDRX) characterized by bulging grain boundary and continuous dynamic recrystallization (CDRX) operated through progressive sub-grain merging and rotation, also take place during the hot deformation of the hot-extruded GH4151 alloy. In addition, the step-shaped structures can be observed at grain boundaries, which ensure the low-energy surface state during the DRX process.

Dynamic Recrystallization of Zircaloy-4 during Working within the Upper α-Range

2004 ◽  
Vol 467-470 ◽  
pp. 1151-1156 ◽  
Author(s):  
Cédric Chauvy ◽  
Pierre Barbéris ◽  
Frank Montheillet
Keyword(s):  
Dynamic Recrystallization ◽  
Large Strain ◽  
Large Angle ◽  
Rate Sensitivity ◽  
Large Strains ◽  
Strain Rates ◽  
Compression Tests ◽  
Continuous Dynamic Recrystallization ◽  
Ebsd Technique ◽  
Continuous Dynamic

Compression tests were used to simulate simple deformation paths within the upper a-range of Zircaloy-4 (i.e. 500°C-750°C). The mechanical behaviour reveals two different domains : at low temperatures and large strain rates, strain hardening takes place before flow softening, whereas this first stage disappears at lower flow stress levels. Strain rate sensitivity and activation energy were determined for both domains. Dynamic recrystallization was investigated using the Electron BackScattering Diffraction (EBSD) technique. It appears that the mechanism involved here is continuous dynamic recrystallization (CDRX), based on the increasing misorientation of subgrain boundaries and their progressive transformation into large angle boundaries. At low strains (e £ 0.3), CDRX kinetics are similar whatever the deformation conditions, while higher temperatures and lower strain rates promote recrystallization at large strains.

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