scholarly journals In Situ Collection of Nanoparticles during Femtosecond Laser Machining in Air

Nanomaterials ◽  
2021 ◽  
Vol 11 (9) ◽  
pp. 2264
Author(s):  
Nithin Joy ◽  
Anne-Marie Kietzig

Nanoparticles generated during laser material processing are often seen as annoying side products, yet they might find useful application upon proper collection. We present a parametric study to identify the dominant factors in nanoparticle removal and collection with the goal of establishing an in situ removal method during femtosecond laser machining. Several target materials of different electrical resistivity, such as Cu, Ti, and Si were laser machined at a relatively high laser fluence. Machining was performed under three different charge conditions, i.e., machining without an externally applied charge (alike atmospheric pulsed laser deposition (PLD)) was compared to machining with a floating potential and with an applied field. Thereby, we investigated the influence of three different charge conditions on the behavior of laser-generated nanoparticles, in particular considering plume deflection, nanoparticle accumulation on a collector plate and their redeposition onto the target. We found that both strategies, machining under a floating potential or under an applied field, were effective for collecting laser-generated nanoparticles. The applied field condition led to the strongest confinement of the nanoparticle plume and tightest resulting nanoparticle collection pattern. Raster-scanning direction was found to influence the nanoparticle collection pattern and ablation depth. However, the laser-processed target surface remained unaffected by the chosen nanoparticle collection strategy. We conclude that machining under a floating potential or an applied field is a promising setup for removing and collecting nanoparticles during the machining process, and thus provides an outlook to circular waste-free laser process design.

2016 ◽  
Vol 43 (3) ◽  
pp. 0303005 ◽  
Author(s):  
刘斌 Liu Bin ◽  
戴玉堂 Dai Yutang ◽  
殷广林 Yin Guanglin ◽  
李涛 Li Tao

Author(s):  
M. Park ◽  
S.J. Krause ◽  
S.R. Wilson

Cu alloying in Al interconnection lines on semiconductor chips improves their resistance to electromigration and hillock growth. Excess Cu in Al can result in the formation of Cu-rich Al2Cu (θ) precipitates. These precipitates can significantly increase corrosion susceptibility due to the galvanic action between the θ-phase and the adjacent Cu-depleted matrix. The size and distribution of the θ-phase are also closely related to the film susceptibility to electromigration voiding. Thus, an important issue is the precipitation phenomena which occur during thermal device processing steps. In bulk alloys, it was found that the θ precipitates can grow via the grain boundary “collector plate mechanism” at rates far greater than allowed by volume diffusion. In a thin film, however, one might expect that the growth rate of a θ precipitate might be altered by interfacial diffusion. In this work, we report on the growth (lengthening) kinetics of the θ-phase in Al-Cu thin films as examined by in-situ isothermal aging in transmission electron microscopy (TEM).


Author(s):  
Andreas Benjamin Kaufmann ◽  
Marina Lazarov ◽  
Stefan Kiefer ◽  
Juraj Majzlan ◽  
Stefan Weyer

Here we present a method for in-situ determination of stable antimony (Sb) isotope compositions by ultraviolet (UV)-femtosecond-laser-ablation-multi-collector-ICP-MS (fs-LA-MC-ICP-MS). Metallic antimony and a number of Sb minerals (stibnite, senarmontite, chalcostibite, tetrahedrite,...


2007 ◽  
Vol 15 (24) ◽  
pp. 16061 ◽  
Author(s):  
Xin Zhu ◽  
Tissa C. Gunaratne ◽  
Vadim V. Lozovoy ◽  
Marcos Dantus

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