Rheological Properties and Thermal Conductivity of Epoxy Resins Filled with a Mixture of Alumina and Boron Nitride

Electronic packaging materials with high thermal conductivity and suitable viscosity are necessary in the manufacturing of highly integrated electronic devices for efficient heat dissipation during operation. This study looked at the effect of boron nitride (BN) platelets on the rheology and thermal conductivity of composites based on alumina (Al2O3) and epoxy resin (EP) for the potential application as electronic packaging. The viscosity and thermal conductivity of the composite were increased upon increasing filler content. Furthermore, thermal conductivity of the BN/Al2O3/EP was much higher than that of Al2O3/EP at almost the same filler loadings. These unique properties resulted from the high thermal conductivity of the BN and the synergistic effect of the spherical and plate shapes of these two fillers. The orientation of BN platelets can be controlled by adjusting their loading to facilitate the formation of higher thermally conductive pathways. The optimal content of the BN in the Al2O3/EP composites was confirmed to be 5.3 vol %, along with the maximum thermal conductivity of 4.4 W/(m·K).

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Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

Materials ◽

10.3390/ma13163634 ◽

2020 ◽

Vol 13 (16) ◽

pp. 3634

Author(s):

John M. Hutchinson ◽

Sasan Moradi

Keyword(s):

Thermal Conductivity ◽

Boron Nitride ◽

Thermal Management ◽

Filler Content ◽

Electronic Devices ◽

Cure Kinetics ◽

The Matrix ◽

Thermally Conductive ◽

Filler Particles ◽

Kinetics Of

Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely used fillers is boron nitride (BN). In this review we concentrate specifically on epoxy-BN composites for high thermal conductivity applications. First, the cure kinetics of epoxy composites in general, and of epoxy-BN composites in particular, are discussed separately in terms of the effects of the filler particles on cure parameters and the cured composite. Then, several fundamental aspects of epoxy-BN composites are discussed in terms of their effect on thermal conductivity. These aspects include the following: the filler content; the type of epoxy system used for the matrix; the morphology of the filler particles (platelets, agglomerates) and their size and concentration; the use of surface treatments of the filler particles or of coupling agents; and the composite preparation procedures, for example whether or not solvents are used for dispersion of the filler in the matrix. The dependence of thermal conductivity on filler content, obtained from over one hundred reports in the literature, is examined in detail, and an attempt is made to categorise the effects of the variables and to compare the results obtained by different procedures.

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Development of Thermally Conductive Polyurethane Composite by Low Filler Loading of Spherical BN/PMMA Composite Powder

Scientific Reports ◽

10.1038/s41598-019-50985-5 ◽

2019 ◽

Vol 9 (1) ◽

Cited By ~ 5

Author(s):

Kai-Han Su ◽

Cherng-Yuh Su ◽

Cheng-Ta Cho ◽

Chung-Hsuan Lin ◽

Guan-Fu Jhou ◽

...

Keyword(s):

Thermal Conductivity ◽

Heat Dissipation ◽

Three Dimensional ◽

Filler Loading ◽

High Thermal Conductivity ◽

Heat Diffusion ◽

Composite Powders ◽

Polyurethane Composite ◽

Uniform Dispersion ◽

Thermally Conductive

Abstract The issue of electronic heat dissipation has received much attention in recent times and has become one of the key factors in electronic components such as circuit boards. Therefore, designing of materials with good thermal conductivity is vital. In this work, a thermally conductive SBP/PU composite was prepared wherein the spherical h-BN@PMMA (SBP) composite powders were dispersed in the polyurethane (PU) matrix. The thermal conductivity of SBP was found to be significantly higher than that of the pure h-BN/PU composite at the same h-BN filler loading. The SBP/PU composite can reach a high thermal conductivity of 7.3 Wm−1 K−1 which is twice as high as that of pure h-BN/PU composite without surface treatment in the same condition. This enhancement in the property can be attributed to the uniform dispersion of SBP in the PU polymer matrix that leads to a three-dimensional continuous heat conduction thereby improving the heat diffusion of the entire composite. Hence, we provide a valuable method for preparing a 3-dimensional heat flow path in polyurethane composite, leading to a high thermal conductivity with a small amount of filler.

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Surface modification of a BN/ETDS composite with aniline trimer for high thermal conductivity and excellent mechanical properties

RSC Advances ◽

10.1039/c8ra03875a ◽

2018 ◽

Vol 8 (40) ◽

pp. 22846-22852 ◽

Cited By ~ 7

Author(s):

Seokgyu Ryu ◽

Taeseob Oh ◽

Jooheon Kim

Keyword(s):

Mechanical Properties ◽

Thermal Conductivity ◽

Surface Modification ◽

Boron Nitride ◽

Polymer Composites ◽

Conductive Polymer ◽

High Thermal Conductivity ◽

Conductive Polymer Composites ◽

Thermally Conductive

Boron nitride (BN) particles surface-treated with different amounts of aniline trimer (AT) were used to prepare thermally conductive polymer composites with epoxy-terminated dimethylsiloxane (ETDS).

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Enhanced thermal conductivity of graphene nanoplatelets epoxy composites

Materials Science-Poland ◽

10.1515/msp-2017-0028 ◽

2017 ◽

Vol 35 (2) ◽

pp. 382-389 ◽

Cited By ~ 16

Author(s):

Lukasz Jarosinski ◽

Andrzej Rybak ◽

Karolina Gaska ◽

Grzegorz Kmita ◽

Renata Porebska ◽

...

Keyword(s):

Thermal Conductivity ◽

Heat Dissipation ◽

Electronic Devices ◽

Graphene Nanoplatelets ◽

Electrical Insulation ◽

Graphene Nanocomposites ◽

Thermally Conductive ◽

Conductive Particles ◽

Proper Performance ◽

Enhanced Thermal Conductivity

Abstract Efficient heat dissipation from modern electronic devices is a key issue for their proper performance. An important role in the assembly of electronic devices is played by polymers, due to their simple application and easiness of processing. The thermal conductivity of pure polymers is relatively low and addition of thermally conductive particles into polymer matrix is the method to enhance the overall thermal conductivity of the composite. The aim of the presented work is to examine a possibility of increasing the thermal conductivity of the filled epoxy resin systems, applicable for electrical insulation, by the use of composites filled with graphene nanoplatelets. It is remarkable that the addition of only 4 wt.% of graphene could lead to 132 % increase in thermal conductivity. In this study, several new aspects of graphene composites such as sedimentation effects or temperature dependence of thermal conductivity have been presented. The thermal conductivity results were also compared with the newest model. The obtained results show potential for application of the graphene nanocomposites for electrical insulation with enhanced thermal conductivity. This paper also presents and discusses the unique temperature dependencies of thermal conductivity in a wide temperature range, significant for full understanding thermal transport mechanisms.

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High thermal conductivity in soft elastomers with elongated liquid metal inclusions

Proceedings of the National Academy of Sciences ◽

10.1073/pnas.1616377114 ◽

2017 ◽

Vol 114 (9) ◽

pp. 2143-2148 ◽

Cited By ~ 187

Author(s):

Michael D. Bartlett ◽

Navid Kazem ◽

Matthew J. Powell-Palm ◽

Xiaonan Huang ◽

Wenhuan Sun ◽

...

Keyword(s):

Thermal Conductivity ◽

Liquid Metal ◽

Heat Dissipation ◽

Dielectric Materials ◽

Phonon Transport ◽

High Thermal Conductivity ◽

Stretchable Electronics ◽

Mechanical Stiffness ◽

Mechanical Coupling ◽

Thermally Conductive

Soft dielectric materials typically exhibit poor heat transfer properties due to the dynamics of phonon transport, which constrain thermal conductivity (k) to decrease monotonically with decreasing elastic modulus (E). This thermal−mechanical trade-off is limiting for wearable computing, soft robotics, and other emerging applications that require materials with both high thermal conductivity and low mechanical stiffness. Here, we overcome this constraint with an electrically insulating composite that exhibits an unprecedented combination of metal-like thermal conductivity, an elastic compliance similar to soft biological tissue (Young’s modulus < 100 kPa), and the capability to undergo extreme deformations (>600% strain). By incorporating liquid metal (LM) microdroplets into a soft elastomer, we achieve a ∼25× increase in thermal conductivity (4.7 ± 0.2 W⋅m−1⋅K−1) over the base polymer (0.20 ± 0.01 W⋅m−1·K−1) under stress-free conditions and a ∼50× increase (9.8 ± 0.8 W⋅m−1·K−1) when strained. This exceptional combination of thermal and mechanical properties is enabled by a unique thermal−mechanical coupling that exploits the deformability of the LM inclusions to create thermally conductive pathways in situ. Moreover, these materials offer possibilities for passive heat exchange in stretchable electronics and bioinspired robotics, which we demonstrate through the rapid heat dissipation of an elastomer-mounted extreme high-power LED lamp and a swimming soft robot.

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Antimicrobial hexagonal boron nitride nanoplatelet composites for the thermal management of medical electronic devices

Materials Chemistry Frontiers ◽

10.1039/c9qm00411d ◽

2019 ◽

Vol 3 (11) ◽

pp. 2455-2462 ◽

Cited By ~ 6

Author(s):

Si-Wei Xiong ◽

Pan Zhang ◽

Yu Xia ◽

Pei-Gen Fu ◽

Jing-Gang Gai

Keyword(s):

Thermal Conductivity ◽

Boron Nitride ◽

Thermal Management ◽

Hexagonal Boron Nitride ◽

Electronic Devices ◽

E Coli ◽

Thermally Conductive ◽

Medical Electronic

We developed a thermally conductive and antimicrobial QACs@h-BN/LLDPE composites for thermal management of medically electronic devices, it was approximately 100% against both E. coli and S. aureus and its thermal conductivity can reach 1.115 W m−1 K−1.

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Flexible polyurethane/boron nitride composites with enhanced thermal conductivity

High Performance Polymers ◽

10.1177/0954008319862044 ◽

2019 ◽

Vol 32 (3) ◽

pp. 324-333 ◽

Cited By ~ 2

Author(s):

Ting Fei ◽

Yanbao Li ◽

Baocheng Liu ◽

Chengbo Xia

Keyword(s):

Thermal Conductivity ◽

Boron Nitride ◽

Thermal Management ◽

High Stability ◽

Heat Dissipation ◽

Thermoplastic Polyurethane ◽

Thermally Conductive ◽

Mechanical Bending ◽

Flexible Polyurethane ◽

Enhanced Thermal Conductivity

Polymer-based composites with high thermal conductivity have great potential application as thermal management materials. This study was devoted to improving the thermal conductivity of the flexible thermoplastic polyurethane (TPU) by employing boron nitride (BN) as heat filler. We prepared flexible and thermally conductive TPU/BN composite via solution mixing and hot pressing. The thermal conductivity of the TPU/BN composite with 50 wt% BN (32.6 vol%) reaches 3.06 W/m·K, approximately 1290% enhancement compared to that of pure TPU (0.22 W/m·K). In addition, the thermal conductivity of our flexible TPU/BN composite with 30 wt% BN is almost not varied (a decrease of only 2.5%) after 100 cycles of mechanical bending, which indicates the high stability of heat conduction of our flexible TPU/BN composite under mechanical bending. The maximum tensile strength of the TPU/BN composite with 5 wt% BN is 48.9 MPa, 14% higher than that of pure TPU (43.2 MPa). Our flexible and highly thermally conductive TPU/BN composites show promise for heat dissipation in various applications in the electronics field.

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High thermal conductivity liquid metal pad for heat dissipation in electronic devices

Applied Physics A ◽

10.1007/s00339-018-1778-z ◽

2018 ◽

Vol 124 (5) ◽

Cited By ~ 3

Author(s):

Zuoye Lin ◽

Huiqiang Liu ◽

Qiuguo Li ◽

Han Liu ◽

Sheng Chu ◽

...

Keyword(s):

Thermal Conductivity ◽

Liquid Metal ◽

Heat Dissipation ◽

Electronic Devices ◽

High Thermal Conductivity

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Enhancement of thermal conductivity in polyamide-6/graphene composites via a “bridge effect” of silicon carbide whiskers

RSC Advances ◽

10.1039/c7ra09094c ◽

2017 ◽

Vol 7 (73) ◽

pp. 46306-46312 ◽

Cited By ~ 7

Author(s):

Na Song ◽

Haidong Pan ◽

Xingshuang Hou ◽

Siqi Cui ◽

Liyi Shi ◽

...

Keyword(s):

Mechanical Properties ◽

Thermal Conductivity ◽

Silicon Carbide ◽

Polymer Composite ◽

Heat Dissipation ◽

Electronic Devices ◽

Polyamide 6 ◽

High Thermal Conductivity ◽

Silicon Carbide Whiskers ◽

Plane Direction

It is urgent to manufacture a polymer composite that has high thermal conductivity (especially in the through-plane direction) and mechanical properties simultaneously to meet the heat dissipation requirement of electronic devices.

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