An Analytical Method for Modelling Pull-In Effect during Anodic Bonding
Keyword(s):
Pull-in effect is a common phenomenon during anodic bonding, a key step in thefabrication processes of capacitive sensors and actuators. To assist the designs and fabrications ofthese transducers, this paper presents an analytical method for modelling the pull-in effect duringanodic bonding. The pull-in effect model was verified by finite element analysis and a verificationexperiment respectively. The verification results indicate that the analytical method for modellingthe pull-in effect during anodic bonding is capable for predicting pull-in voltages of anodicallybonded capacitive sensors and actuators in a universal and practical manner without any additionalfabrication process.
Keyword(s):
1988 ◽
Vol 54
(502)
◽
pp. 1252-1256
2016 ◽
Vol 26
◽
pp. 1-10
◽
2004 ◽
Vol 218
(10)
◽
pp. 1223-1232
◽
2019 ◽
Vol 233
(14)
◽
pp. 5074-5084
◽