scholarly journals A Sensitive and Versatile Thickness Determination Method Based on Non-Inflection Terahertz Property Fitting

Sensors ◽  
2019 ◽  
Vol 19 (19) ◽  
pp. 4118 ◽  
Author(s):  
Xuequan Chen ◽  
Emma Pickwell-MacPherson

The accuracy of thin-film characterization in terahertz spectroscopy is mainly set by the thickness uncertainty. Physical thickness measurement has limited accuracy for thin-film samples thinner than a few hundreds of micrometers and is sometimes even impossible. The temporal resolution of time-domain terahertz spectrometers is not sufficient to resolve such thin films. Previously reported numerical methods mainly only work for materials with low dispersion and absorption. Here, we propose a novel method for thickness determination by fitting a non-inflection offset exponential function to the material optical properties. Theoretical analysis predicts the best fitting to only be achieved when the correct thickness is given. Transmission measurements on a thin-film polymer, water, and a lactose pallet verify the theory and show the accurate thickness determination and property characterization on materials which are either achromatic or dispersive, transparent or absorptive, featureless or resonant. The measurements demonstrate the best versatility and sensitivity compared to the state-of-art. The method could be widely adapted to various types of research and industrial applications.

1991 ◽  
Vol 01 (03) ◽  
pp. 259-270 ◽  
Author(s):  
J. MIRANDA ◽  
A. OLIVER ◽  
F.J. RUIZ ◽  
J.M. SANTANA

The resolution of several methods for thin film thickness measurement using PIXE, based on the variation of the proton beam incident energy, is discussed. In order to evaluate the resolution, sputtering of copper films, deposited on aluminum and titanium substrates by argon ions is used. Sputtering yields are obtained through thickness changes, and then compared to other experimental and theoretical values. Good agreement is found, thus confirming the accuracy of PIXE as a method for film thickness determination.


2009 ◽  
Vol 1195 ◽  
Author(s):  
Henning Heuer ◽  
Susanne Hillmann ◽  
Marcus Klein ◽  
Norbert Meyendorf

AbstractBy launching new processes introduced by nano science into much more conventional industrial applications fast, robust and economical reasonable inspection methods are required for process control and quality assurance. Coming from high tech industries e.g. semiconductor industries the methods available for thin film characterization and quality control are complex and often require scientific skilled personal. High frequency eddy current spectroscopy in reflection or transmission configuration allows a contactless measurement of e.g. copper thin films on silicon with a thickness resolution better that 5 nm. Due to the insensitivity of the transmission mode to dislocations or slight tilting of the sample the high frequency eddy current method is a practicable method for thin film characterization under industrial environment.


2008 ◽  
Author(s):  
Augustin J. Hong ◽  
Kang L. Wang ◽  
Wei Lek Kwan ◽  
Yang Yang ◽  
Dayanara Parra ◽  
...  

Author(s):  
Prong Kongsubto ◽  
Sirarat Kongwudthiti

Abstract Organic solderability preservatives (OSPs) pad is one of the pad finishing technologies where Cu pad is coated with a thin film of an organic material to protect Cu from oxidation during storage and many processes in IC manufacturing. Thickness of OSP film is a critical factor that we have to consider and control in order to achieve desirable joint strength. Until now, no non-destructive technique has been proposed to measure OSP thickness on substrate. This paper reports about the development of EDS technique for estimating OSP thickness, starting with determination of the EDS parameter followed by establishing the correlation between C/Cu ratio and OSP thickness and, finally, evaluating the accuracy of the EDS technique for OSP thickness measurement. EDS quantitative analysis was proved that it can be utilized for OSP thickness estimation.


1979 ◽  
Vol 19 (9) ◽  
pp. 651-659 ◽  
Author(s):  
James M. McKelvey ◽  
G. Vincent Sharps

1995 ◽  
Vol 8 (8) ◽  
pp. 667-672 ◽  
Author(s):  
D P Almond ◽  
A K Barker ◽  
A C Bento ◽  
S K Singh ◽  
N J Appleyard ◽  
...  

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