scholarly journals Cellular automaton approach for carrier degeneracy effects on the electron mobility of high electron mobility transistors (HEMT's)

Author(s):  
Koichi Fukuda ◽  
Junichi Hattori ◽  
Hidehiro Asai ◽  
Mariko Ninomiya ◽  
Junya Yaita ◽  
...  

Abstract GaN-based high electron mobility transistors (HEMTs) are expected to have high performance in base station applications. Recently, it was reported that the combination of the Poisson-Schrodinger method and cellular automaton method is effective for predicting the mobility of channel two-dimensional electron gas (2DEG) of GaN HEMTs. In the operation condition of HEMT, the surface electron density of the channel is on the order of 1013 cm-2, and the effect of degeneracy cannot be ignored in calculating the mobility. Since the electron distribution function is always stably obtained by the cellular automaton method, the degeneracy effect can be considered stably. In this paper, through the comparison of different degeneracy evaluation methods, the anisotropy of the electron distribution function under the electric field acceleration is clarified to affect the HEMT mobility prediction significantly.

2021 ◽  
pp. 108050
Author(s):  
Maria Glória Caño de Andrade ◽  
Luis Felipe de Oliveira Bergamim ◽  
Braz Baptista Júnior ◽  
Carlos Roberto Nogueira ◽  
Fábio Alex da Silva ◽  
...  

Author(s):  
Yu-Chen Lai ◽  
Yi-Nan Zhong ◽  
Ming-Yan Tsai ◽  
Yue-Ming Hsin

AbstractThis study investigated the gate capacitance and off-state characteristics of 650-V enhancement-mode p-GaN gate AlGaN/GaN high-electron-mobility transistors after various degrees of gate stress bias. A significant change was observed in the on-state capacitance when the gate stress bias was greater than 6 V. The corresponding threshold voltage exhibited a positive shift at low gate stress and a negative shift when the gate stress was greater than 6 V, which agreed with the shift observation from the I–V measurement. Moreover, the off-state leakage current increased significantly after the gate stress exceeded 6 V during the off-state characterization although the devices could be biased up to 1000 V without breakdown. The increase in the off-state leakage current would lead to higher power loss.


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