Evaluation of an electrical method for detection of die attach imperfections in Smart Power Switches using transient thermal FEM simulations

2008 ◽  
Author(s):  
V. Kosel ◽  
M. Glavanovics ◽  
E. Scheikl
Keyword(s):  
Smart Power ◽  
Electrical Method ◽  
Fem Simulations ◽  
Die Attach ◽  
Power Switches ◽  
Transient Thermal

Methodology to Quantify Impact of Package Delamination on Performance of High-Side Smart Power Switch Design

2020 ◽  
Vol 2020 (1) ◽  
pp. 000015-000020
Author(s):  
Min Chu ◽  
Jie Chen ◽  
Abidur Rahman ◽  
Rajen Murugan
Keyword(s):  
Electrical Performance ◽  
Diagnostic Feature ◽  
Electromagnetic Modeling ◽  
Smart Power ◽  
Modeling Methodology ◽  
Power Switch ◽  
High Side ◽  
Die Attach ◽  
Power Switches ◽  
The Impact

Abstract Generally, IC packages with exposed pads have excellent thermal and electrical performance – assuming high fidelity and integrity of die attach material. However, reliability challenges associated with die attach impacts electrical performance of vertical power FETs for high-side power switches. As such, it is critical to quantify the impact of these challenges on high-side power switches operation, so that their protection and diagnostic feature circuitries can be properly designed for mission critical applications. In this paper we present on a package and PCB co-modeling methodology that was developed to assess impact of die attach integrity on performance of high-side power switch designs. We explain how electrical co-optimization of the system (viz. FET-Package-PCB) interactions, was achieved through a coupled circuit-to-electromagnetic modeling, simulation, and analysis methodology. Silicon laboratory measurements data that validate the modeling methodology will be presented.

scholarly journals DESIGN AND TECHNOLOGICAL FEATURES OF CERAMIC-METAL TO-247 AND TO-220 SEMICONDUCTOR PACKAGES

2020 ◽  
Vol 257 (2) ◽  
pp. 22-27
Author(s):  
V.A. Sidorov ◽  
A.G. Chuprunov ◽  
S.V. Kataev ◽  
K.V. Sidorov
Keyword(s):  
Pulsed Current ◽  
Operating Voltage ◽  
Smart Power ◽  
Power Switches ◽  
Semiconductor Packages ◽  
Glass Metal

In this paper we introduce the design of sealed ceramic-metal TO-247 and TO-220 packages, which are intended for the same applications as plactic-metal and glass-metal alternatives. Packages could be used for epitaxial Si and SiC multi-die assemblies, for GaN smart power switches, etc., with operating voltage up to 2500 V and pulsed current up to 350 A.

High-Temperature Transient Thermal Analysis for SiC Power Modules

2016 ◽  
Vol 858 ◽  
pp. 1078-1081 ◽  
Author(s):  
Fumiki Kato ◽  
Hiroshi Nakagawa ◽  
Hiroshi Yamaguchi ◽  
Hiroshi Sato
Keyword(s):  
Thermal Analysis ◽  
Heat Capacity ◽  
High Temperature ◽  
Thermal Resistance ◽  
Junction Temperature ◽  
Stable Operation ◽  
Transient Thermal Analysis ◽  
Die Attach ◽  
Power Modules ◽  
Transient Thermal

Transient thermal analysis is a very useful tool for thermal evaluation to realize the stable operation of SiC power modules which are operated at higher temperatures than conventional Si power modules. A transient thermal analysis system to investigate the thermal characteristics of SiC power modules at high temperature is presented. We have found that precise temperature measurement at the initial stage of the junction temperature decay curve is necessary in order to evaluate the thermal resistance and heat capacity of the die attach, since the thermal diffusivity of SiC is larger than that of Si and the temperature distribution of SiC die was considered. Using the proposed transient thermal analysis method, the thermal resistance and heat capacity of the AuGe die attach under the SiC-SBD was successfully evaluated at temperatures up to 250 °C.

Investigation of smart power DMOS devices under repetitive stress conditions using transient thermal mapping and numerical simulation

2010 ◽  
Vol 50 (9-11) ◽  
pp. 1427-1430 ◽  
Author(s):  
S. Bychikhin ◽  
G. Haberfehlner ◽  
J. Rhayem ◽  
D. Vanderstraeten ◽  
R. Gillon ◽  
...  
Keyword(s):  
Numerical Simulation ◽  
Stress Conditions ◽  
Smart Power ◽  
Thermal Mapping ◽  
Repetitive Stress ◽  
Transient Thermal

Twenty-First Century Truck Electronics—Today's Global Challenge

1989 ◽  
Vol 203 (1) ◽  
pp. 1-9
Author(s):  
G D Aravosis
Keyword(s):  
Fuel Economy ◽  
Geographic Area ◽  
The United States ◽  
Electronic Systems ◽  
Smart Power ◽  
Global Challenge ◽  
Regulatory Standards ◽  
Future System ◽  
Power Switches ◽  
The Cost

The main catalyst for use of state-of-the-art electronics in commercial trucks in the United States is the need to meet EPA emission standards for the 1990s. Important secondary catalysts are fuel economy, anti-lock brake systems and fleet/driver expectations. There are also myriad other forces related to safety, maintainability, servicing and communication which will be satisfied once electronic systems are installed in trucks. The principal economic justification for incurring the cost of electronics at this time is to satisfy these more stringent gaseous emission and particulate regulatory standards. Using electronics, these standards can be met without producing a severe reduction in fuel economy while, as a by-product, interfacing with other truck components, such as brakes, transmissions, safety controls etc. This paper will address the applications of electronics today for diesel engine controls as well as the applications of electronics in areas such as smart power switches, anti-jackknife controls, voice-recognition systems and other future system applications. The exploding use of electronics in trucks will require solutions to many complex problems which are not unique to any one company, geographic area, country or technical society.

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