Fin-type heat dissipation structure of light emitting diode lamp

2012 ◽  
Vol 24 (7) ◽  
pp. 1638-1640
Author(s):  
张心标 Zhang Xinbiao ◽  
严高师 Yan Gaoshi ◽  
匡云帆 Kuang Yunfan ◽  
李雨励 Li Yuli
Keyword(s):  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Light Emitting ◽  
Dissipation Structure

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Xin Li ◽  
Xu Chen ◽  
Guo-Quan Lu
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Temperature Cycling ◽  
Fluorescent Light ◽  
Light Sources ◽  
Light Emitting ◽  
Die Attach ◽  
Nanosilver Paste ◽  
Interconnection Material

As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.

Thermal Analysis of High Power Light Emitting Diodes Package

2011 ◽  
Vol 687 ◽  
pp. 215-221
Author(s):  
Yuan Yuan Han ◽  
Hong Guo ◽  
Xi Min Zhang ◽  
Fa Zhang Yin ◽  
Ke Chu ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Thermal Field ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Convective Heat Exchange ◽  
Input Power ◽  
Junction Temperature ◽  
Original Structure ◽  
Light Emitting

With increasing of the input power of the chips in light emitting diode (LED)， the thermal accumulation of LEDs package increases. Therefore solving the heat issue has become a precondition of high power LED application. In this paper, finite element method was used to analyze the thermal field of high power LEDs. The effect of the heatsink structure on the junction temperature was also investigated. The results show that the temperature of the chip is 95.8°C which is the highest, and it meets the requirement. The conductivity of each component affects the thermal resistance. Convective heat exchange is connected with the heat dissipation area. In the original structure of LEDs package the heat convected through the substrate is the highest, accounting for 92.58%. Three heatsinks with fin structure are designed to decrease the junction temperature of the LEDs package.

Improved Heat Dissipation in GaN-Based Thin-Film Light-Emitting Diode with Lateral-Electrode Configuration

2015 ◽  
Vol 7 (2) ◽  
pp. 283-286
Author(s):  
Jiang-Yong Zhang ◽  
Lei-Ying Ying ◽  
Ming Chen ◽  
Wen-Jie Liu ◽  
Jian Yu ◽  
...  
Keyword(s):  
Thin Film ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Electrode Configuration ◽  
Light Emitting

Thermal Performance Evaluation and Economic Analysis of LED Integrated with Thermoelectric Cooler Package

2011 ◽  
Vol 216 ◽  
pp. 106-110 ◽  
Author(s):  
Hong Qin ◽  
Da Liang Zhong ◽  
Chang Hong Wang
Keyword(s):  
Economic Analysis ◽  
Thermal Performance ◽  
Power Dissipation ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Vital Role ◽  
Junction Temperature ◽  
Total Power ◽  
Thermoelectric Cooler ◽  
Light Emitting

Thermal management is an important issue for light emitting diodes’ utilization. For high power light emitting diode (LED), active heat dissipation method plays a vital role. As a new cooling device, thermoelectric cooler (TEC) is applied in LED packaging for the precisely temperature controlled advantage. In order to evaluate the thermal performance of the TEC packaging designs in LED, experimental measurement is used to assess the chip’s junction temperature of three different cooling models, which include the heatsink model, the heatsink and fan model and the TEC, heatsink and fan model. Based on the research, it is better to apply TEC cooling methods with the power dissipation of LED less than 35 W and the wind speed is 3.6 m/s. However, the power dissipation of TEC itself plays a vital role of the total power dissipation of LED packaging. The results of economic analysis shows that the LED integrated with TEC package achieves 22.34% and 44.73% electric energy saving under the condition of 20 W and 30 W power dissipation of the LED chip contrasts to the fluorescent lamp, but sacrifices 2.71% electric power under the condition of 10 W power dissipation of the LED chip.

Numerical Analysis for Thermal Performance of High Power Multi-Chip LED Packaging

2010 ◽  
Vol 139-141 ◽  
pp. 1433-1437
Author(s):  
Kai Lin Pan ◽  
Jiao Pin Wang ◽  
Jing Liu ◽  
Guo Tao Ren
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Three Dimensional ◽  
Junction Temperature ◽  
Light Emitting ◽  
Die Attach ◽  
Dissipation Model ◽  
Key Issues

Heat dissipation and cost are the key issues for light-emitting diode (LED) packaging. In this paper, based on the thermal resistance network model of LED packaging, three-dimensional heat dissipation model of high power multi-chip LED packaging is developed and analyzed with the application of finite element method. Temperature distributions of the current multi-chip LED packaging model are investigated systematically under the different materials of the chip substrate, die attach, and/or different structures of the heat sink and fin. The results show that the junction temperature can be decreased effectively by increasing the height of the heat sink, the width of the fin, and the thermal conductivity of the chip substrate and die attach materials. The lower cost and higher reliability for LED source can be obtained through reasonable selection of materials and structure parameters of the LED lighting system.

The Cooling Principle of the LED Finned Radiator and its Heat Dissipation Theory Analysis

2015 ◽  
Vol 729 ◽  
pp. 234-239
Author(s):  
Ke Li ◽  
Jian Ming Liu ◽  
Xin Zhang
Keyword(s):  
Heat Pipe ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Fourth Generation ◽  
Photoelectric Conversion Efficiency ◽  
Theory Analysis ◽  
Photoelectric Conversion ◽  
Light Emitting ◽  
New Energy ◽  
Renewable Energy Storage

Human demand for energy is increasing, non-renewable energy storage on Earth drastic drop in the new energy is in exploring the application stage, humans had to find a way for existing energy saving. LED (Light Emitting Diode) as a fourth-generation light source and its high photoelectric conversion efficiency, environmental protection, long life, the application of many changes and other advantages of the various countries on the national lighting issues[1].This paper explore the cooling area, the material and Presence of heat pipe 's Influence on the heat sink effect. Length of the heat pipe 's affect on heat pipe fin type radiator cooling effect.

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