scholarly journals Research Progress of Ductile Removal Mechanism for Hard-brittle Single Crystal Materials

2019 ◽  
Vol 55 (3) ◽  
pp. 181
Author(s):  
Chen LI
2021 ◽  
pp. 103773
Author(s):  
Ruiwen Geng ◽  
Xiaojing Yang ◽  
Qiming Xie ◽  
Jianguo Xiao ◽  
Wanqing Zhang ◽  
...  

2006 ◽  
Vol 304-305 ◽  
pp. 232-235 ◽  
Author(s):  
Dao Hui Xiang ◽  
Y.P. Ma ◽  
Bo Zhao ◽  
Ming Chen

The crack extension course and ductile removal mechanism of nano ZrO2 ceramics were analyzed in this paper. On the basis of contrast tests with or without ultrasonic vibration, the influences of critical ductile grinding depth on grinding forces and surface quality were studied by dynamometer, SEM and AFM in different grinding condition. The reason for the increase of the critical grinding depth was discussed based on the analysis of grinding force and ultrasonic vibration course. At last, the formation mechanism of surface topography observed by AFM in ductile domain was analyzed. The research indicated that ultrasonic machining could obtain nano finished surface with high efficient.


2020 ◽  
Vol 861 ◽  
pp. 113-121
Author(s):  
Zhao Jun Jiang ◽  
Jun Wang ◽  
Dong Mei Cao

Nickel base single crystal superalloy is widely used in hot end parts of aeroengine because of its excellent creep, fatigue and oxidation resistance. In the face of strong market demand and the emergence of new technologies and methods, in 2019, nickel-based single crystal superalloys have made remarkable achievements in preparation and heat treatment processes, repair techniques, test methods, characterization methods, theoretical simulation analysis and composition design, which continuously promotes the development of nickel base single crystal superalloy to the direction of high performance and low cost. The present work reviews the progresses from preparation and heat treatment process, repair technology of service alloy structure, service evaluation of alloy, high flux composition design. The progress in the design, preparation and engineering application of superalloy materials will eventually promote the development of a new generation of aeroengine.


2018 ◽  
Vol 67 (12) ◽  
pp. 128102
Author(s):  
Yi Chang-Jiang ◽  
Wang Le ◽  
Feng Zi-Li ◽  
Yang Meng ◽  
Yan Da-Yu ◽  
...  

2011 ◽  
Vol 239-242 ◽  
pp. 2775-2778
Author(s):  
Jia Xuan Chen ◽  
Ying Chun Liang ◽  
Xia Yu ◽  
Zhi Guo Wang ◽  
Zhen Tong

To study the removal mechanism of materials during nano cutting, molecular dynamics method is adopted to simulate single crystal copper nanomachining processes, and subsurface defects evolvements and chip forming regulation are analyzed by revised centro-symmetry parameter method and the ratios of the tangential cutting forceand the normal cutting force. The results show that there are different defects under different cutting depths. When cutting depths is shallower, there are dislocation loop nucleation in the subsurface of the workpiece beneath the tool; however, when the cutting depths is deeper, there are dislocations nucleation and slipping along {101} plane and (111) plane. In addition, both tangential cutting forceand the normal cutting force decrease as the cutting depths decreasing. When the ratios of the normal cutting force and the tangential cutting force is below 0.9, the chip will be formed.


2019 ◽  
Vol 56 (17) ◽  
pp. 170611
Author(s):  
王涛 Tao Wang ◽  
张健 Jian Zhang ◽  
张娜 Na Zhang ◽  
武柏屹 Baiyi Wu ◽  
王思媛 Siyuan Wang ◽  
...  

2011 ◽  
Vol 487 ◽  
pp. 327-331 ◽  
Author(s):  
Cui Lian Che ◽  
Chuan Zhen Huang ◽  
Jun Wang ◽  
Hong Tao Zhu

In this paper, the influence of the incidence angle and abrasive mesh on the polishing quality is analyzed during AWJ polishing process. Through the study on the jet flow structure, it is obtained the standoff of AWJ polishing is chosen within the jet basic section. According to the experiments for AWJ Polishing quartz, it is better to remove material by ductile removal mechanism choosing small incidence angle, low pressure and small abrasive size. The ductile removal mechanism of the polished material is a necessary condition for the ideal polishing results


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