Investigation of Micro Cutting Tool for Diffractive Optical Elements Using FEM Analysis

2013 ◽  
Vol 378 ◽  
pp. 444-448
Author(s):  
Seung Yub Baek
Keyword(s):  
Cutting Tool ◽  
Cutting Tools ◽  
Optical Systems ◽  
Diffractive Optical Elements ◽  
Diamond Cutting ◽  
Optical Elements ◽  
Micro Cutting ◽  
Diamond Cutting Tools ◽  
Single Crystal Diamond ◽  
Ultra Precision

Diffractive optical elements (DOE) can be used to simplify optical systems such as lightening its mass, reducing elements numbers and so on. Single-crystal diamond is considered as the preferred tool materials in ultra-precision and nanometer-scale cutting operation. Due to the well known and exceptional difficulty in shaping, the fabrication of diamond cutting tools requires special processing method. As a highly efficient and cost-effective solution, the mechanical lapping process has been extensively applied in tool-making industry. In this paper, the key enabling technologies to design and fabricate the diamond-cutting tools for ultra-precision and submicronic machining are presented and reviewed. The paper describes the shape of micro cutting tool that is based on the finite element method of calculation of relief angle and rake angle.

Ultra-Precision Cutting of Single Crystal Silicon Using Diamond Tool with Large Top Corner Radius

2012 ◽  
Vol 523-524 ◽  
pp. 81-86 ◽  
Author(s):  
Yuya Kobaru ◽  
Eiji Kondo ◽  
Ryuichi Iwamoto
Keyword(s):  
Single Crystal ◽  
Feed Rate ◽  
Cutting Tools ◽  
Single Crystal Silicon ◽  
Depth Of Cut ◽  
Diamond Cutting ◽  
Crystal Silicon ◽  
Diamond Cutting Tools ◽  
Single Crystal Diamond ◽  
Ultra Precision

A lot of studies on the ultra-precision cutting of single crystal silicon have been reported and they used the single crystal diamond cutting tools having the sharp cutting edge. However, the diamond cutting tools having small chamfer at the cutting edge are usually used in practical machining shops. In addition, studies on the relationship between the tool wear and the machined surface have been reported little although the relationship is important in practical applications. In this study, ultra-precision cutting of single crystal silicon, using cutting fluids, feed rate, and depth of cut as experimental parameters, were carried out by using the single crystal diamond cutting tools having small chamfer and large nose radius, and effects of the cutting fluids, the feed rate, and the depth of cut on the machining accuracy and tool wear were studied. As a result, the optimum cutting conditions was obtained as follows: the cutting fluid was kerosene, the feed rate was 2.0μm/rev, and the depth of cut was 1.0μm.

The Factors Influencing on Cutting Edge Radius of Ultra-Precision Diamond Cutting Tools in Mechanical Lapping

2006 ◽  
Vol 304-305 ◽  
pp. 345-349 ◽  
Author(s):  
Wen Jun Zong ◽  
Dan Li ◽  
T. Sun ◽  
K. Cheng ◽  
Ying Chun Liang
Keyword(s):  
Influencing Factor ◽  
Cutting Tools ◽  
Cutting Edge ◽  
Diamond Cutting ◽  
Cutting Edge Radius ◽  
Brittle Ductile Transition ◽  
Edge Radius ◽  
Diamond Cutting Tools ◽  
Ultra Precision ◽  
Lapping Machine

A brittle-ductile transition lapping mechanism is proposed for the mechanical lapping of ultra-precision diamond cutting tools, and then the critical depths of cut for brittle-ductile transition in different orientations and on different planes are deduced in theory. Combined the critical lapping depth with the contact accuracy between rotating scaife and lapped tool surface, the influences of processing factors on cutting edge radius are studied. Both the theoretical analyses and experimental results indicate that the vibration of lapping machine tool and surface quality of scaife have enormous influences on the sharpened cutting edge. And lapping compression force has an optimal value. Lapping rate should be considered when lapping velocity is selected. But the smaller the lapping velocity is, the littler the cutting edge radius sharpened. Finally, the optimal selections are performed for each influencing factor and a perfect diamond tool is lapped in ductile mode with a cutting edge radius of 30~40nm and a surface roughness Ra of 0.7nm.

Lapping Process of Diamond Cutting Tool by Molecular Dynamics Simulating

2007 ◽  
Vol 359-360 ◽  
pp. 249-253
Author(s):  
Zeng Qiang Li ◽  
Tao Sun ◽  
Yong Da Yan ◽  
Jun Jie Zhang ◽  
Ying Chun Liang ◽  
...  
Keyword(s):  
Molecular Dynamics ◽  
Potential Energy ◽  
Cutting Tool ◽  
Cutting Tools ◽  
Three Dimensional ◽  
Strong Support ◽  
Diamond Cutting ◽  
Distribution Maps ◽  
Diamond Cutting Tools ◽  
Diamond Cutting Tool

Molecular dynamics is a rapidly developing field of science and has become an established tool for studying the dynamic behavior of material machining. A three-dimensional molecular dynamics (MD) model about the atoms of the diamond cutting tools and the diamond grits is built by using the molecular dynamics. The Tersoff potential function is used to calculate the force and potential energy among the atoms of the diamond tools and the atoms of the diamond grits. The lapping processes at a special cutting depth are simulated. The variety of the specimen potential energy in the lapping process is observed. The mechanism of the diamond micro machining and the form of the surface formation are given by comparing the distribution maps of atoms in initial and cutting states. This study will give a strong support to the diamond cutting tools’ lapping.

Manufacturing Process of Terahertz Radar Reflector Based on Ultra-Precision Machining Technology

2015 ◽  
Vol 713-715 ◽  
pp. 633-636
Author(s):  
Di Li ◽  
Song Bao Luo ◽  
Jian Ming Zhang ◽  
Chang Yu Xu ◽  
Chang Tao Pang
Keyword(s):  
Single Point ◽  
Cutting Tools ◽  
Diamond Turning ◽  
Precision Machining ◽  
Diamond Cutting Tools ◽  
Single Crystal Diamond ◽  
Aluminum Sample ◽  
Ultra Precision ◽  
The Cost ◽  
Better Than

This paper presents a technique for processing Terahertz radar reflector by SPDT (Single Point Diamond Turning) based on LODTM (Large Optics Diamond Turning Machine). This technique applies single crystal diamond cutting tools for ultra-precision machining, and thus could obtain high-precision optical mirror, which could be used as the Terahertz radar reflectors. An experiment for aluminum sample had been done to demonstrate the availability of the technique, and a pair of Terahertz radar reflectors were obtained. The precision of the reflectors, detected through precision coordinate measuring technology, was better than the designed requirement. The experiment results showed that Terahertz radar reflectors generated by deterministic ultra-precision machining technique based on LODTM would have advantages in figure accuracy and roughness and so on, which could be helpful to improve the precision and low the cost of Terahertz radar system.

Fast Polishing of Single Crystal Diamond

2010 ◽  
Vol 97-101 ◽  
pp. 4096-4099 ◽  
Author(s):  
Yi Qing Chen ◽  
Liang Chi Zhang
Keyword(s):  
Single Crystal ◽  
Cutting Tools ◽  
Polishing Process ◽  
Diamond Cutting ◽  
Diamond Cutting Tools ◽  
Single Crystal Diamond ◽  
Friction Method ◽  
Polishing Pressure ◽  
Very High ◽  
Quality Surface

This paper investigates the polishing of single crystal diamond using the dynamic friction method. It was found that by selecting a proper polishing pressure and sliding speed, a very high polishing rate at 10,300 µm/h (or 2.8 X 10-2 mg/s) with a high quality surface finish can be reached, which is hundreds times faster than the other polishing process reported in the literature. This method can be used to manufacture diamond products and to repair worn diamond components such as diamond cutting tools and diamond dressers for grinding wheels.

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