Research on the Topography Feature of the Diamond Grinding Wheel under Elliptical Ultrasonic Assisted Dressing with Diamond Stylus

2010 ◽  
Vol 42 ◽  
pp. 126-130
Author(s):  
Quan Cai Wang ◽  
Nan Fang He ◽  
Guo Fu Gao ◽  
Bo Zhao
Keyword(s):  
Ultrasonic Vibration ◽  
Feed Rate ◽  
Grinding Wheel ◽  
Diamond Grinding Wheel ◽  
Diamond Grinding ◽  
Abrasive Grain ◽  
Ultrasonic Assisted

In this paper, topography feature of the diamond grinding wheel under the diamond stylus elliptical ultrasonic vibration assisted dressing was studied experimentally. The results indicate that: the increase in dressing power of elliptical ultrasonic vibration will result in the increase in amplitude, and that can increase abrasive protrusion height of the dressing grinding wheel, and also increase the depth of chip pocket. With the increase of feed rate, surface peak and valley values of elliptical ultrasonic vibration dressing grinding wheel increase, that is the average protrusion height of abrasive grain increases. With the increase of dressing depth, surface peak and valley values of elliptical ultrasonic vibration dressing grinding wheel increases, while the number of static effective abrasive grain reduces. In comparison with the ordinary dressing grinding wheel, elliptical ultrasonic assisted dressing in the same parameters can bring about more static effective abrasive grain , more uniform abrasive distribution, a higher abrasive protrusion height and more chip space.

Research on Grinding Temperature of Nano ZrO2 Ceramics Using Diamond Grinding Wheel Dressed by Elliptic Ultrasonic Vibration

2010 ◽  
Vol 42 ◽  
pp. 313-316 ◽  
Author(s):  
Jin Xue Xue ◽  
Bo Zhao
Keyword(s):  
Comparative Analysis ◽  
Ceramic Material ◽  
Ultrasonic Vibration ◽  
Grinding Wheel ◽  
Grinding Temperature ◽  
Grinding Wheels ◽  
Vibration Method ◽  
Diamond Grinding Wheel ◽  
Diamond Grinding

In order to investigate the influence of dressing methods on grinding temperature, two kinds of diamond grinding wheels dressed by traditional dressing(TD) and elliptic ultrasonic vibration dressing(ED) respectively were used to grind the same nano-ceramic material. Through grinding experiments, the comparative analysis of the grinding temperature was conducted. The results show that diamond grinding wheel dressed by elliptical ultrasonic vibration method can decrease the grinding temperature.

Grinding Force and Surface Roughness in Ultrasonic Assisted Grinding of SiC Ceramics with Diamond Grinding Wheel

2013 ◽  
Vol 797 ◽  
pp. 234-239 ◽  
Author(s):  
Li Fei Liu ◽  
Fei Hu Zhang ◽  
Chun Hui Li ◽  
Jiang Chen ◽  
Min Hui Liu
Keyword(s):  
Surface Roughness ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Diamond Grinding Wheel ◽  
Ultrasonic Assisted Grinding ◽  
Diamond Grinding ◽  
Sic Ceramics ◽  
Force Ratio ◽  
Ultrasonic Assisted ◽  
Conventional Grinding

In this paper, experiments are conducted to study the characters of Ultrasonic Assisted Grinding (UAG) and Conventional Grinding (CG), diamond grinding wheel is used in experiments, grinding forces and surface roughness are measured in both UAG and CG. The effects of different parameters on grinding force, surface roughness and force ratio are discussed. The results show that the grinding force and surface roughness in UAG is smaller than those in CG. The force ratio in UAG is lower than that in CG, which reveals that the grinding wheel has a good wear-resistant property in UAG process.

Surface Quality Analysis in Mill-Grinding of SiCp/Al

2011 ◽  
Vol 299-300 ◽  
pp. 1060-1063 ◽  
Author(s):  
Y.X. Yao ◽  
Jin Guang Du ◽  
Jian Guang Li ◽  
H. Zhao
Keyword(s):  
Surface Roughness ◽  
Feed Rate ◽  
Surface Defect ◽  
Quality Analysis ◽  
Grinding Wheel ◽  
Grinding Wheels ◽  
Machined Surface ◽  
Diamond Grinding Wheel ◽  
Diamond Grinding ◽  
Machined Surface Roughness

Mill-grinding experiments were carried out on SiCp/Al to investigate effects of mill-grinding parameters and grinding wheel parameters on machined surface roughness in this paper. The machined surface topography was also analyzed. Experimental results show that surface roughness increases with increasing feed rate and the depth of the mill-grinding. The effect of mill-grinding speed on surface roughness is low. The machined surface reveals many defects. The fine grit diamond grinding wheel can reduce the surface roughness and decrease the machined surface defect. Compared to the vitrified bonded diamond and electroplated diamond grinding wheels used in the experiment, the resin-based diamond grinding wheel produces a better surface.

High Efficiency Abrasive Waterjet Dressing of Diamond Grinding Wheel

2014 ◽  
Vol 1017 ◽  
pp. 243-248 ◽  
Author(s):  
Peng Yao ◽  
Wei Wang ◽  
Chuan Zhen Huang ◽  
Jun Wang ◽  
Hong Tao Zhu ◽  
...  
Keyword(s):  
Feed Rate ◽  
High Efficiency ◽  
Water Jet ◽  
Surface Generation ◽  
Abrasive Waterjet ◽  
Grinding Wheel ◽  
Abrasive Water Jet ◽  
Diamond Grinding Wheel ◽  
Diamond Grinding ◽  
Wheel Topography

A grinding wheel wears rapidly during ultrasonic assisted surface generation of a large aperture aspherical RB-SiC mirror, which leads to an increase of grinding force and profile error. In this paper, different types of resinoid bonded diamond grinding wheel with a same grit size were dressed with high-pressure abrasive water jet. The dressing effects of abrasive water jet were assessed through comparing the 3D roughness of the grinding wheel topographies before and after dressing. The experimental results show that diamond grits of a worn grinding wheel are protruding from bond after dressing. The feed rate of nozzle and the bond materials have significant impact on the 3D surface roughness of the wheel and dressing efficient. The softer binder and the decrease of the feed rates and lead to deeper grooves during dressing of grinding wheel. However, too low feed rate will make a large number of abrasive particles drop from binder, which worsens the wheel topography. Therefore, to dress grinding wheel well and efficiently, optimized feed rate must be chosen.

Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers

2008 ◽  
Vol 389-390 ◽  
pp. 36-41
Author(s):  
Feng Wei Huo ◽  
Dong Ming Guo ◽  
Ren Ke Kang ◽  
Zhu Ji Jin
Keyword(s):  
Surface Topography ◽  
Sampling Interval ◽  
Grinding Wheel ◽  
Height Distribution ◽  
Wheel Surface ◽  
Diamond Grinding Wheel ◽  
Diamond Grinding ◽  
Cutting Surface ◽  
Ultra Precision ◽  
Cutting Direction

A 3D profiler based on scanning white light interferometry with a lateral sampling interval of 0.11μm was introduced to measure the surface topography of a #3000 diamond grinding wheel, and a large sampling area could be achieved by its stitching capability without compromising its lateral or vertical resolution. The protrusion height distribution of diamond grains and the static effective grain density of the grinding wheel were derived, and the wheel chatter and the deformation of the wheel were analyzed as well. The study shows that the grain protrusion height obeys an approximate normal distribution, the static effective grain density is much lower than the theoretical density, and only a small number of diamond grains are effective in the grinding process with fine diamond grinding wheel. There exists waviness on the grinding wheel surface parallel with the wheel cutting direction. The cutting surface of the grinding wheel is not flat but umbilicate, which indicates that the elastic deformation at the wheel edges is much larger than in the center region.

scholarly journals A study on dressing of resinoid bonded diamond grinding wheel.

1989 ◽  
Vol 55 (512) ◽  
pp. 1106-1109
Author(s):  
Yoongyo JUNG ◽  
Ichiro INASAKI ◽  
Satoshi MATSUl
Keyword(s):  
Grinding Wheel ◽  
Diamond Grinding Wheel ◽  
Diamond Grinding
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