Preparation of PVAc/CNT/Carbon Black Composite Particles

2013 ◽  
Vol 457-458 ◽  
pp. 262-265
Author(s):  
Gu Qin Wang ◽  
Yang Cui

Conductive PVAc/CNT/CB composite particles were prepared through emulsion polymerization. To get the good dispersity and chemical reactivity in the polymerization system, CNT was first modified with high concentrated nitric acid and sulfuric acid. And then in the polymerization process CNT and CB were evenly dispersed into the poly (vinyl acetate) matrix and a uniform and stable conductive network was obtained finally. A series of composite particle were prepared by changing the content of CNT. And the resistivity and structure of composite particles were determined by four-probe method and FTIR. Furthermore, the kinetics of emulsion polymerization was also investigated.

Coatings ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 672
Author(s):  
Ryuta Watanabe ◽  
Kakeru Izaki ◽  
Kazuya Yamamoto ◽  
Jun-ichi Kadokawa

In this study, we investigate the Pickering emulsion polymerization of styrene using scaled-down chitin nanofibers (SD-ChNFs) as stabilizers to produce nanochitin/polystyrene composite particles. Prior to emulsion polymerization, an SD-ChNF aqueous dispersion was prepared by disintegrating bundles of the parent ChNFs with an upper hierarchical scale in aqueous acetic acid through ultrasonication. After styrene was added to the resulting dispersions, the mixtures at the desired weight ratios (SD-ChNFs to styrene = 0.1:1–1.4:1) were ultrasonicated to produce Pickering emulsions. Radical polymerization was then conducted in the presence of potassium persulfate as an initiator in the resulting emulsions to fabricate the composite particles. The results show that their average diameters decreased to a minimum of 84 nm as the weight ratios of SD-ChNFs to styrene increased. The IR and 1H-NMR spectra of the composite particle supported the presence of both chitin and polystyrene in the material.


2018 ◽  
Vol 28 (1) ◽  
pp. 186-192 ◽  
Author(s):  
Hong-ying YANG ◽  
Xue-jiao LI ◽  
Lin-lin TONG ◽  
Zhe-nan JIN ◽  
Lu YIN ◽  
...  

e-Polymers ◽  
2005 ◽  
Vol 5 (1) ◽  
Author(s):  
Kiyoshi Suzuki ◽  
Yasutaka Yamada ◽  
Kazumi Fujita ◽  
Mamoru Nomura ◽  
Hideya Saito

AbstractIn order to clarify the kinetics and mechanism of miniemulsion polymerization of a sparingly water-soluble monomer, the miniemulsion polymerization of 1,1,2,2-tetrahydroperfluorodecyl acrylate was conducted at 50°C using potassium persulfate as initiator and sodium dodecyl sulfate as emulsifier, respectively. It was found that the rate of polymerization was proportional to the 0.65 power of the initial initiator concentration and to the 0.30 power of the number of miniemulsion droplets (latex particles). It is pointed out that the kinetics of this polymerization system may be subject to the modified case III kinetics of emulsion polymerization with predominant bimolecular termination in the aqueous phase.


Alloy Digest ◽  
2001 ◽  
Vol 50 (11) ◽  

Abstract Titanium shows outstanding resistance to seawater and marine atmospheres. It is also resistant to attack by hot metallic chloride solutions, sodium and potassium hypochlorite, and chlorine dioxide. The metal is resistant to attack by hot nitric acid at concentrations up to 80% and is not attacked by sulfuric acid. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and bend strength as well as fatigue. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: TI-122. Producer or source: Timet.


2018 ◽  
Author(s):  
Harold Jeffrey M. Consigo ◽  
Ricardo S. Calanog ◽  
Melissa O. Caseria

Abstract Gallium Arsenide (GaAs) integrated circuits have become popular these days with superior speed/power products that permit the development of systems that otherwise would have made it impossible or impractical to construct using silicon semiconductors. However, failure analysis remains to be very challenging as GaAs material is easily dissolved when it is reacted with fuming nitric acid used during standard decapsulation process. By utilizing enhanced chemical decapsulation technique with mixture of fuming nitric acid and concentrated sulfuric acid at a low temperature backed with statistical analysis, successful plastic package decapsulation happens to be reproducible mainly for die level failure analysis purposes. The paper aims to develop a chemical decapsulation process with optimum parameters needed to successfully decapsulate plastic molded GaAs integrated circuits for die level failure analysis.


2000 ◽  
Vol 2000 (3) ◽  
pp. 106-107 ◽  
Author(s):  
C. Waterlot ◽  
B. Haskiak ◽  
D. Couturier

Various alkyl-substituted p-dimethoxybenzenes (ArH) react readily with nitric acid and sulfuric to form nitro-products (ArNO2). When the nitric acid is used in excess, the nitro-product react via either nitration to dinitro-compound (Ar(NO2)2) or via oxidative demethylation to nitro- p-quinone (Q). As such, the competition between the nitration, polynitration and oxidative dealkylation is effectively modulated by the added nitric acid and the alkyl-substituted p-dimethoxybenzenes.


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