Contrast Test of KOH Solutions Jet-Assisted Laser Etching on Al2O3 Ceramics

2012 ◽  
Vol 472-475 ◽  
pp. 2476-2479 ◽  
Author(s):  
Gen Fu Yuan ◽  
Wei Zheng ◽  
Xue Hui Chen
Keyword(s):  
Surface Roughness ◽  
Cross Section ◽  
Laser Processing ◽  
Processing Parameters ◽  
Laser Etching ◽  
Composite Processing ◽  
Regular Shape ◽  
Material Sample ◽  
Melting Slag

An experimental device of KOH solutions jet-assisted laser etching is designed, Laser-chemical combined etching technology is combined with the Medium-jet erosion processing ,and the influence on the etching capacity and cross section quality of material sample of laser processing parameters,jet processing parameters are studied. The results show that the laser processing parameters and jet processing have a decisive impact on the quality of the workpiece, the composite processing technology can remove most of melting slag which are produced by the laser processing, the surface roughness are effectively reduced. The blind holes of the machined materials have the regular shape.

Observation in the Surface Roughness of Silicon Wafer during Semi-Fixed Abrasive Machining with Large Grains

2009 ◽  
Vol 69-70 ◽  
pp. 253-257
Author(s):  
Ping Zhao ◽  
Jia Jie Chen ◽  
Fan Yang ◽  
K.F. Tang ◽  
Ju Long Yuan ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Silicon Wafer ◽  
Processing Parameters ◽  
Wafer Surface ◽  
Abrasive Machining ◽  
Fixed Abrasive ◽  
Is Failure ◽  
Better Than

Semi-fixed abrasive is a novel abrasive. It has a ‘trap’ effect on the hard large grains that can prevent defect effectively on the surface of the workpiece which is caused by large grains. In this paper, some relevant experiments towards silicon wafers are carried out under the different processing parameters on the semi-fixed abrasive plates, and 180# SiC is used as large grains. The processed workpieces’ surface roughness Rv are measured. The experimental results show that the surface quality of wafer will be worse because of higher load and faster rotating velocity. And it can make a conclusion that the higher proportion of bond of the plate, the weaker of the ‘trap’ effect it has. Furthermore the wet environment is better than dry for the wafer surface in machining. The practice shows that the ‘trap’ effect is failure when the workpiece is machined by abrasive plate which is 4.5wt% proportion of bond in dry lapping.

Effect of Laser Processing Parameters on Microhole Quality of Aluminium Nitride Ceramics

2021 ◽  
Vol 871 ◽  
pp. 277-283
Author(s):  
Chun Yan Yang ◽  
Yun Hao ◽  
Bozhe Wang ◽  
Hai Yuan ◽  
Liu Hui Li
Keyword(s):  
Laser Processing ◽  
Laser Power ◽  
Picosecond Laser ◽  
Scanning Speed ◽  
Processing Parameters ◽  
Recast Layer ◽  
Aluminium Nitride ◽  
Obvious Effect ◽  
Nitride Ceramics

A picosecond laser in spin-cutting mode was used to drill 500μm diameter microholes on 150μm thick aluminium nitride ceramic. The effects of laser processing parameters such as the laser power, scanning speed, and defocus amount on the microhole quality were studied. The results show that as the laser power increases, the inlet and outlet diameters of the holes increase, the taper decreases slightly, and the thickness of the recast layer decreases evidently. The scanning speed has no obvious effect on the diameter and taper of the hole; however, the hole can not be drilled through when the speed is too large. Positive defocus can effectively reduce the taper of the hole. Under 28.5W laser power, 400Hz frequency, 200mm/s scanning speed, and zero defocus amount conditions, high-quality microholes with a taper of 0.85° were obtained.

Comparison of Processing Features between Semi Bonded Abrasive Lapping and Loose Abrasive Lapping

2009 ◽  
Vol 416 ◽  
pp. 439-442
Author(s):  
Xun Lv ◽  
Ju Long Yuan ◽  
Dong Hui Wen
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Processing Parameters ◽  
Good Surface ◽  
Ultra Precision ◽  
New Processing ◽  
Short Time

Semi bonded abrasive lapping is an effective ultra-precision lapping method. It can obtain good surface quality of workpiece in short time. This paper focused on the differences of processing features by comparing semi bonded abrasive lapping and loose abrasive lapping in several groups processing parameters. The results showed that the surface roughness of workpiece in semi bonded abrasive lapping was far superior to that of loose abrasive lapping in same processing parameters. And the MRR (material removal rate) of semi bonded abrasive lapping was slightly lower than that of loose abrasive lapping. For these features of semi bonded abrasive, a new processing flow would also be proposed in this paper.

Study on Surface Roughness Transformation during Metal Rolling

2012 ◽  
Vol 706-709 ◽  
pp. 2517-2522
Author(s):  
Saud Almotairy ◽  
Dong Bin Wei ◽  
Zheng Yi Jiang
Keyword(s):  
Surface Roughness ◽  
Quality Factor ◽  
Processing Parameters ◽  
Experimental Results ◽  
Thin Strip ◽  
Manufacturing Processes ◽  
Strip Surface ◽  
New Findings ◽  
Cold Rolled

Increasing the demand for cold rolled ultra thin strip as feedstock for miniaturized products has encouraged researchers to investigate the ways to increase the quality of such products, especially those related to strip surface roughness. Surface is known as quality factor in most of manufacturing processes. In this paper, the effect of the rolling parameters on the surface roughness transformation during metal rolling has been studied. The experimental results demonstrate that the surface roughness transformation during the metal rolling is highly affected by the designation of the processing parameters such as finishing temperature, reduction, rolling passes and lubrication. The results have been discussed to verify the validity of the new findings.

Study on Surface Roughness Transformation during Metal Rolling

2011 ◽  
Vol 418-420 ◽  
pp. 897-902
Author(s):  
Saud Almotairy ◽  
Dong Bin Wei ◽  
Zheng Yi Jiang
Keyword(s):  
Surface Roughness ◽  
Quality Factor ◽  
Processing Parameters ◽  
Experimental Results ◽  
Thin Strip ◽  
Manufacturing Processes ◽  
Strip Surface ◽  
New Findings ◽  
Cold Rolled

Increasing the demand for cold rolled ultra thin strip as feedstock for miniaturized products has encouraged researchers to investigate the ways to increase the quality of such products, especially those related to strip surface roughness. Surface is known as quality factor in most of manufacturing processes. In this paper, the effect of the rolling parameters on the surface roughness transformation during metal rolling has been studied. The experimental results demonstrate that the surface roughness transformation during metal rolling is highly affected by the designation of the processing parameters such as finishing temperature, reduction, rolling passes and lubrication. The results have been discussed to verify the validity of the new findings.

A New Method for Processing Ceramics with Cracked Glaze

2011 ◽  
Vol 418-420 ◽  
pp. 63-66
Author(s):  
Ji Wei Fan ◽  
Xiao Peng Li ◽  
Zhao Jun Zhang ◽  
Wang Xi Zhang ◽  
Zhi Qiang Jiao ◽  
...  
Keyword(s):  
Laser Processing ◽  
Ceramic Materials ◽  
Processing Parameters ◽  
Processing Method ◽  
New Method ◽  
Ceramic Surface ◽  
Laser Technique

Laser processing ceramic materials is a new application of laser technique. This paper presents the study of making cracked glaze surface by laser processing. Proposed the applicable the composition of glaze, the main processing parameters of laser processing, and discussed the factors which may affect the quality of cracked glazing surface. It indicates that laser processing could be a new and easy processing method to produce the cracked glazing on the ceramic surface.

Modelling the Processing Parameters of Rotary Curved Surface Grinding Using RSM

2011 ◽  
Vol 338 ◽  
pp. 130-135 ◽  
Author(s):  
Zhao Hui Deng ◽  
Lin Lin Wan ◽  
Xiao Hong Zhang ◽  
Sheng Chao Li
Keyword(s):  
Surface Roughness ◽  
Prediction Model ◽  
Feed Rate ◽  
Processing Parameters ◽  
Curved Surface ◽  
Experimental Conditions ◽  
Box Behnken Design ◽  
Wheel Radius ◽  
Nc Grinding

The NC grinding of Si3N4 ceramics rotary curved surface workpieces was carried on the CNC jig grinders, combining the nomal tracing grinding and the arc envelope forming grinding. According to the grinding track, a grinding surface scallop height model was built. The model analysis indicated that workpiece curvature, wheel radius and feed rate affected the surface roughness. A prediction model based on the response surface methodology (RSM) was built to study the influences of these processing parameters on the surface roughness, using the Box-Behnken design to design the grinding experiments. It was shown that the surface roughness of rotary curved surface workpieces grinding which increased with increasing workpiece curvature could be reduced by chosen larger radius wheel and lower feed rate. The confidence and practicality of the prediction model is high in experimental conditions. The process parameters can be selected to improve the quality of the surface based on the model of the paper.

LASER DICING OF SILICON WAFER

2008 ◽  
Vol 15 (01n02) ◽  
pp. 153-159 ◽  
Author(s):  
Y. TANG ◽  
J. Y. H. FUH ◽  
H. T. LOH ◽  
Y. S. WONG ◽  
Y. K. LIM
Keyword(s):  
Laser Processing ◽  
Pump Energy ◽  
Processing Parameters ◽  
Heat Affect Zone ◽  
Laser Repetition Rate ◽  
Cut Quality ◽  
Diamond Saw ◽  
Number Of Passes ◽  
Si Wafer

The effect of various laser processing parameters on the kerf width and cut quality of Si wafer as well as encapsulated Si wafer is investigated. The parameters are then optimized to minimize the heat affect zone and obtain the best possible cut quality. It has been found that oxygen is the most suitable assist gas for laser dicing and that the highest gas pressure may not produce the best cut quality. The effect of laser repetition rate, pump energy, feed rate, and number of passes are also studied. Under optimized parameters, the cut quality of Si wafer using laser dicing is found to be comparable to diamond saw dicing.

Influence of Nanosecond Laser Processing Parameters on the Titanium Alloy Surfaces Colorization

2017 ◽  
Vol 744 ◽  
pp. 223-227 ◽  
Author(s):  
Chun Ling Li ◽  
Chang Hou Lu
Keyword(s):  
Surface Roughness ◽  
Titanium Alloy ◽  
Focal Plane ◽  
Laser Processing ◽  
Color Space ◽  
Processing Parameters ◽  
B Value ◽  
Nanosecond Laser ◽  
Scanning Velocity ◽  
The Impact

Laser color marking experiments on titanium alloy substrates were carried out to investigate the impact of selected laser processing parameters on the resulting colors. The CIE L*a*b* color space was used to quantify these colors. The surface roughness of the marked color areas was measured by using a TR200 hand-held surface roughness instrument. The relationships between laser parameters and CIE L*a*b* values and surface roughness of the colors were obtained. Results clearly showed that different colors ranging from blue and gray to yellow were produced. Some colors can be obtained by different sets of parameters, while some colors can only be produced by a specific combination of process parameters due to the existence of different forms of heat input and thermal process. The b* value increased to the maximum which represented yellow then decreased. The surface roughness of color areas decreased with the increase of focal plane offset, scanning velocity, or hatch space.

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