The Influence of Total and Oxygen Partial Pressures on Structure and Hydrophilic Property of TiO2 Thin Films Deposited by Reactive DC Magnetron Sputtering

2008 ◽  
Vol 55-57 ◽  
pp. 465-468 ◽  
Author(s):  
Surasing Chaiyakun ◽  
A. Buranawong ◽  
T. Deelert ◽  
N. Witit-Anun

TiO2 thin films have been deposited by reactive DC magnetron sputtering technique to study the effect of total pressure and oxygen partial pressure on structure and hydrophilic properties. The crystal structure and hydrophilic property was measured by XRD and contact angle meter, respectively. The results showed that the films were composed of pure rutile and mixed of anatase/rutile structure dependent on the total pressure and oxygen partial pressure. It was found that all films can perform hydrophilic property. In case of high total pressure, the films showed superhydrophilic property, whereas the films deposited under various oxygen partial pressures with fixed total pressure were all films exhibit superhydrophilic property.

1999 ◽  
Vol 13 (07) ◽  
pp. 833-839 ◽  
Author(s):  
M. GHANASHYAM KRISHNA ◽  
A. K. BHATTACHARYA

Vanadium nitride thin films have been deposited on to quartz substrates by dc magnetron sputtering at two different total pressures and a series of nitrogen partial pressures. The spectral transmittance of these films, in the region 350 to 1500 nm, is strongly dependent on the nitrogen partial pressure during sputtering and relatively insensitive to total pressure. The films became more transparent as the nitrogen partial pressure was decreased at a constant total pressure. The optical constants, refractive index and extinction coefficient, exhibited a similar dependence on the nitrogen partial pressure. The sheet resistivity of the films decreased with increasing nitrogen partial pressure. The values of resistivity indicate that the films are semiconducting rather than metalic.


1998 ◽  
Vol 541 ◽  
Author(s):  
Li-jian Meng ◽  
M.P. dos Santos

AbstractRuthenium dioxide films have been prepared by rf reactive magnetron sputtering at different oxygen partial pressures and total sputtering pressures. The films have been characterized by scanning electron microscopy, X-ray diffraction and electrical conductivity. The films prepared at low oxygen partial pressure and total pressure show a strong preferred orientation along the [110] direction. As both pressures increased, the peak intensity decreases. All the films are subject to a compressive stress. As the total pressure is decreased and the oxygen partial pressure is increased, the stress increases. When the total pressure is lower than 6 × 10−3 mbar and the oxygen partial pressure is higher than 1 × 103 mbar, the films peeled off automatically from the substrate because of the high stress. The films prepared at high oxygen partial pressure and high total pressure have a rough surface and those prepared at low pressure show smooth surface. In this paper, these phenomena have been discussed. In addition, the electrical properties of the films are also discussed.


2012 ◽  
Vol 52 (6) ◽  
pp. 1131-1142 ◽  
Author(s):  
W.J. Yang ◽  
C.Y. Hsu ◽  
Y.W. Liu ◽  
R.Q. Hsu ◽  
T.W. Lu ◽  
...  

AIP Advances ◽  
2017 ◽  
Vol 7 (1) ◽  
pp. 015021 ◽  
Author(s):  
A. K. Kunti ◽  
K. C. Sekhar ◽  
Mario Pereira ◽  
M. J. M. Gomes ◽  
S. K. Sharma

2018 ◽  
Vol 455 ◽  
pp. 267-275 ◽  
Author(s):  
Davide Casotti ◽  
Valentina Orsini ◽  
Alessandro di Bona ◽  
Sandra Gardonio ◽  
Mattia Fanetti ◽  
...  

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