Ultrafine Surface Finishing of Fused Silica Glass Using MCF (Magnetic Compound Fluid) Wheel

This paper aims to develop an alternative novel technique for the high efficiency and ultrafine surface finishing of fused silica glass. A semi-fixed abrasive tool named MCF (magnetic compound fluid) wheel is produced by distributing a certain volume of MCF slurry uniformly over the whole circumference surface of ring-shaped permanent magnets. An experimental rig is constructed in house followed by experimental investigations involving effects of the MCF wheel construction and process parameters on the material removal and work-surface roughness. As a result, the performance of the developed MCF wheel in the surface finishing of fused silica glass has been confirmed, and the appropriate wheel construction and process parameters have been determined in terms of the material removal rate, the flatness of polishing area and the surface roughness, showing an extremely smooth work-surface with surface roughness of Ra0.92nm has been achieved successfully in the current work.

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Welding Fused Silica Glass by Picosecond Pulsed Laser With Low Numerical Aperture

Journal of Micro and Nano-Manufacturing ◽

10.1115/1.4045467 ◽

2019 ◽

Vol 7 (4) ◽

Author(s):

Kai Zhao ◽

Han Wang ◽

Jingwen Yan ◽

Hong Shen

Keyword(s):

Process Parameters ◽

Silica Glass ◽

Ultrafast Lasers ◽

Numerical Aperture ◽

Welding Process ◽

Fused Silica ◽

Optical Systems ◽

Laser Material Processing ◽

Scanning Velocity ◽

Fused Silica Glass

Abstract Researches on glass welding using tightly focused ultrafast lasers have attracted much attention. However, optical systems with low numerical aperture (NA) in laser material processing are commonly used in industry applications. Transmission welding of two fused silica glass plates is performed by using picosecond laser irradiation with low NA in this study. The welding strength under different process parameters such as focal position, pulse energy, and scanning velocity is measured. The role of the modification in welding process is demonstrated through the interior morphology in single-piece glass samples. A model is presented to predict the position of the bottom tip of the modification (BTM). The model considers the propagation property of the laser beam and the incubation effect of modification threshold. The numerical and experimental positions of BTM are compared. The model can give an idea for selecting process parameters to the achievement of glass welding for low NA optical system in ultrafast laser welding.

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Analysis of Effecting Factors on Surface Finish of Fused Silica Glass Grinding with Inclined Ball-Headed Diamond Wheel

Solid State Phenomena ◽

10.4028/www.scientific.net/ssp.175.102 ◽

2011 ◽

Vol 175 ◽

pp. 102-106 ◽

Cited By ~ 1

Author(s):

Ming Jun Chen ◽

Ziang Li ◽

Kang Jun Luo ◽

Ying Chun Liang ◽

Zhen Fang ◽

...

Keyword(s):

Surface Roughness ◽

Grain Size ◽

Silica Glass ◽

Diamond Wheel ◽

Fused Silica ◽

Grinding Process ◽

Feed Speed ◽

Average Grain Size ◽

Fused Silica Glass ◽

Better Than

Fused silica glass is widely used on the manufacture of optical apparatus and resonators due to it’s interesting optical and vibration properties. In order to machining the complex structures in the resonators and optical apparatus, grinding process with inclined ball-headed diamond wheel is discussed. Analytical model of the grinding process with inclined ball-headed diamond wheel was built firstly. Afterwards grinding experiments were conducted by varying the feed speed, the rotation speed, the cutting depth and the average grain size of the ball-headed diamond wheel. The machining surfaces were characterized by surface profiler to investigate the effect of the grinding parameters on the surface roughness. The measurement result shows the average grain size of the diamond wheel has important influence on the machining surface and the surface roughness at the groove bottom is better than the groove edge due to the wheel axis tilt angle.

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Influence of parameters on the surface roughness of the CO2 laser polished fused silica glass

Optik ◽

10.1016/j.ijleo.2021.168044 ◽

2021 ◽

pp. 168044

Author(s):

Guanghua Lu ◽

Xiaopeng Li ◽

Dejun Yan ◽

Dasen Wang ◽

Yong Peng ◽

...

Keyword(s):

Surface Roughness ◽

Co2 Laser ◽

Silica Glass ◽

Fused Silica ◽

Fused Silica Glass

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Investigation on nanoscale material removal process of BK7 and fused silica glass during chemical mechanical polishing

International Journal of Applied Glass Science ◽

10.1111/ijag.15864 ◽

2020 ◽

Author(s):

Lin Wang ◽

Ping Zhou ◽

Ying Yan ◽

Dongming Guo

Keyword(s):

Chemical Mechanical Polishing ◽

Silica Glass ◽

Material Removal ◽

Fused Silica ◽

Mechanical Polishing ◽

Nanoscale Material ◽

Removal Process ◽

Fused Silica Glass

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Orthogonal Experimental Research on Dielectrophoresis Polishing (DEPP) of Silicon Wafer

Micromachines ◽

10.3390/mi11060544 ◽

2020 ◽

Vol 11 (6) ◽

pp. 544

Author(s):

Tianchen Zhao ◽

Qianfa Deng ◽

Cheng Zhang ◽

Kaiping Feng ◽

Zhaozhong Zhou ◽

...

Keyword(s):

Surface Roughness ◽

Electric Field ◽

Silicon Wafer ◽

Field Intensity ◽

Process Parameters ◽

Material Removal ◽

Electric Field Intensity ◽

High Efficiency ◽

Rotation Speed ◽

High Quality

Silicon wafer with high surface quality is widely used as substrate materials in the fields of micromachines and microelectronics, so a high-efficiency and high-quality polishing method is urgently needed to meet its large demand. In this paper, a dielectrophoresis polishing (DEPP) method was proposed, which applied a non-uniform electric field to the polishing area to slow down the throw-out effect of centrifugal force, thereby achieving high-efficiency and high-quality polishing of silicon wafers. The principle of DEPP was described. Orthogonal experiments on important polishing process parameters were carried out. Contrast polishing experiments of silicon wafer were conducted. The orthogonal experimental results showed that the influence ratio of electric field intensity and rotation speed on material removal rate (MRR) and surface roughness was more than 80%. The optimal combination of process parameters was electric field intensity 450 V/mm, rotation speed 90 rpm, abrasive concentration 30 wt%, size of abrasive particle 80 nm. Contrast polishing experiments indicated that the MRR and material removal uniformity of DEPP were significantly better than traditional chemical mechanical polishing (CMP). Compared with the traditional CMP, the MRR of DEPP was increased by 17.6%, and the final surface roughness of silicon wafer reached Ra 0.31 nm. DEPP can achieve high-efficiency and high-quality processing of silicon wafer.

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Effect of abrasive water jet turning process parameters on surface roughness and material removal rate of AISI 1050 steel

Materials Testing ◽

10.3139/120.110777 ◽

2015 ◽

Vol 57 (9) ◽

pp. 773-782 ◽

Cited By ~ 5

Author(s):

Fuat Kartal ◽

Hasan Gökkaya

Keyword(s):

Surface Roughness ◽

Process Parameters ◽

Material Removal Rate ◽

Material Removal ◽

Removal Rate ◽

Water Jet ◽

Abrasive Water Jet ◽

Turning Process

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Spectral Properties of Spatially and Spectrally Partially Coherent Pulsed Beams in Fused-Silica Glass Medium

Materials Science Forum ◽

10.4028/www.scientific.net/msf.663-665.108 ◽

2010 ◽

Vol 663-665 ◽

pp. 108-112

Author(s):

Chao Liang Ding ◽

Min Teng ◽

Zhi Guo Zhao ◽

Liu Zhan Pan

Keyword(s):

Spatial Correlation ◽

Correlation Length ◽

Silica Glass ◽

Coherence Length ◽

Spectral Properties ◽

Spectral Shift ◽

Fused Silica ◽

Partially Coherent ◽

Spatial Correlation Length ◽

Fused Silica Glass

Using the coherence theory of non-stationary fields and the method of Fourier transform, the spectral properties of spatially and spectrally partially coherent Gaussian Schell-model pulsed (GSMP) beams in fused-silica glass medium are studied and analyzed numerically. It is shown that the spectral shift takes place, which depends on the position of the field point, spatial correlation length, temporal coherence length and dispersive property of medium, as GSMP beams propagate in fused-silica glass medium. The on-axis spectrum is blue-shifted, and the relative spectral shift increases with increasing propagation distance, and decreases as the spatial correlation length and temporal coherence length increases, and then approaches an asymptotic value. The dispersive property of medium plays an important role in the spectral properties of spatially and spectrally partially coherent beams.

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