Research on Rheological Properties of Room-Temperature Curing Epoxy Adhesive
2013 ◽
Vol 639-640
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pp. 354-358
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Keyword(s):
C 30
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The rheological mechanical properties of two kinds of self-designed epoxy adhesive curing systems were studied in this paper through the dynamic and static thermodynamics instrument named EPLEXOR 500N made by GABO® company in Germany. Short-term creep tests were carried out under three different temperature conditions of 20°C, 30°C and 40°C and the rheological model is developed to describe the materials creep law. In addition, the test results from the two different epoxy adhesive are also compared and analyzed.
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2021 ◽
Vol 122
(10)
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pp. 981-990
2016 ◽
Vol 61
(2)
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pp. 701-704
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2002 ◽
Vol 84
(12)
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pp. 2308-2317
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2018 ◽
Vol 26
(3)
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pp. 243-250
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2008 ◽
Vol 385-387
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pp. 693-696
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