Research on Heat Dissipation of Multi-Chip LED Filament Package

By studying the substrate material, structure, chip distribution, and array form of the multi-chip light-emitting diode (LED) package, the heat-dissipation capacity of the LED package is improved. Finite element analysis and steady-state thermal analysis are used to simulate and analyze LED packages with different materials and structures. Using the theory of LED illuminance and uniformity, the illuminance of some structures is computed. The results show that the change of substrate material and structure can greatly impact heat dissipation, while changing array forms has little effect on heat dissipation. By improving the spatial distribution of the chip, the temperature superposition problem of the substrate is solved, and the illuminance and uniformity are improved while dissipating heat. The LED filaments of the combined, equidistant, chip-distribution mode have improved heat dissipation. The S-type equal difference has the highest illumination and high illumination uniformity.

Rubber aging life prediction based on interpolation and improved time-temperature superposition principle

With focus on quickly and accurately predicting and evaluating the aging performance degradation of rubber at room temperature, the pseudo-failure life at each different acceleration temperature is proposed to be calculated by interpolation method based on indoor high temperature accelerated aging data, and on the basis of the obtained pseudo-failure life.By introducing the time–temperature equivalence principle, a shift factor obeying to an Arrhenius law is derived, and master curves are built as well for the compression set as for the ultimate mechanical properties.The concept of the sum of squares of dispersion coefficient errors is proposed to evaluate the prediction accuracy.Meanwhile a quantitative calculation method that considers the effect of temperature on the performance degradation curve and the shift factor is innovatively proposes.The results show that the proposed optimization method based on the traditional time-temperature superposition principle can quickly process the aging life at room temperature, and the prediction results are distributed within the 3-fold dispersion line, which can well meet the engineering requirements. The reduction of the DSC value from 1.4164 to 1.0828 further demonstrates the effectiveness of the proposed method above. This method can provide some reference for other related polymer materials accelerated aging data processing and life prediction.

Time-temperature superposition of flexural creep response of carbon fiber PEKK composites manufactured using different prepreg stacking sequence

In this work, the long-term creep response of high-performance carbon fiber PEKK (CF/PEKK) composites was evaluated by performing extrapolated short-term flexural creep tests at various temperatures. The time-temperature superposition principle (TTSP) with vertical as well as horizontal shifting was used to generate master curves at reference temperatures of 120°C. Satin weave-based CF/PEKK prepregs were used to manufacture eight-layer composites via compression molding, with three different stacking sequences: (a) zero-direction [0]8 (b) cross-ply [0, 90]4 and (c) quasi-isotropic [90, −45, 45, 0]2 s. The flexural properties under three-point bending arrangement in a universal testing machine were also evaluated. A dynamic mechanical thermal analyzer (DMTA) in three-point bending mode was used to evaluate the temperature-dependent viscoelastic properties of the three types of composites. The creep and creep-recovery behavior was evaluated at 40°C, 80°C, 120°C, 160°C and 200°C. To construct a master curve, extrapolated short-term isothermal creep tests were performed from 120°C to 180°C at the intervals of 10°C. The predicted master curve represents the creep behavior of composites over more than 10 years. It was shown that the quasi-isotropic CF/PEKK composites exhibited 27% and 12% higher creep resistance at 120°C as compared to zero-direction and cross-ply laminates, respectively. Higher flexural modulus (23%) and flexural strengths (33%) were also exhibited by the quasi-isotropic CF/PEKK composites. The final thickness of quasi-isotropic laminates was 8% lower than the 0o laminates. After analyzing the cross-sections of the composites, it was proposed that the superior mechanical properties of the quasi-isotropic laminates could be due to enhanced nesting between neighboring prepreg layers during the compression molding process, which resulted in closer packing of the fibers. It has been shown that the prepreg stacking sequence could affect the creep behavior and flexural properties of the compression-molded CF/PEKK composites.

Investigation of frequency dependent mechanical properties of porous materials using dynamic mechanical analyzer and frequency-temperature superposition theory

In acoustic design of engineering applications - such as in the acoustic analysis of passenger vehicles - poroelastic materials are of great importance. One of the most influencing properties in determining their noise-reduction potential is the storage modulus. The purpose of this study is to examine the frequency dependence of storage modulus of selected porous acoustic materials at least up to 1000 Hz. This is executed by using the combined use of dynamic mechanical analyzer and frequency-temperature superposition theory. All other methods for measuring the storage modulus fall short in determining frequency-dependence above 100 Hz: quasi-static mechanical analyzer is mostly used for determining an averaged constant value deduced from low-frequency measurements, while the usage of an electromagnetic shaker capable for high-frequency excitation may include effects of fluid motion inside the pores, thus significantly modifying the results. Frequency-temperature superposition enables to determine the storage modulus values in a wide frequency range, based on low-frequency measurements, where fluid-structure interaction is negligible. It was found that the modulus varied significantly up to and beyond 1000 Hz, and thus, acoustical characterization of these materials can be significantly improved using the proposed method. The work concludes with recommendations to improve the accuracy of the results.