Influence of Residual Stress on the Thermal Expansion Behavior of Electroformed Nickel Layers

2013 ◽  
Vol 662 ◽  
pp. 511-514
Author(s):  
Yi Chun Liu ◽  
Jia Min Zhang ◽  
Jian Hong Yi

Nickel layers with tensile or pressure residual stress were prepared by electroforming technique from two kinds of electrolyte. Subsequent heat treatment was adopted to get the stress released. The coefficients of thermal expansion (CTEs) were measured with a thermal dilatometer and the relationship between residual stress and the measured CTEs was revealed both from experimental results and theoretical analysis.

1999 ◽  
Vol 75 (21) ◽  
pp. 3294-3296 ◽  
Author(s):  
X.-L. Wang ◽  
C. M. Hoffmann ◽  
C. H. Hsueh ◽  
G. Sarma ◽  
C. R. Hubbard ◽  
...  

Holzforschung ◽  
2014 ◽  
Vol 68 (5) ◽  
pp. 567-574 ◽  
Author(s):  
Tsunehisa Miki ◽  
Hiroyuki Sugimoto ◽  
Yuzo Furuta ◽  
Ichinori Shigematsu ◽  
Kozo Kanayama

Abstract The thermal expansion behavior of dry solid wood was investigated by dynamic dilatometry and thermal mechanical analysis. Anomalous thermal expansion behavior was observed concerning the displacement change under a constant compression pressure, which was not previously reported. Wood submitted to temperatures below 0°C under dry conditions exhibited a large increment in the linear thermal expansion coefficient (CLTE) and a sudden drop in the CLTE around 50°C as well as above 130°C during heating. In subsequent cooling/heating processes, these anomalous behaviors remained at temperatures below 100°C, although less pronounced, and disappeared at temperatures above 100°C. These behaviors were clearly perceptible in the radial and tangential directions but not in the longitudinal direction. The CLTE depended strongly on the heat and moisture history of the samples and the effects are species-specific.


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