scholarly journals Diffusion-Controlled Liquid Bismuth Induced Intergranular Embrittlement of Copper

2005 ◽  
Vol 237-240 ◽  
pp. 683-688 ◽  
Author(s):  
V. Laporte ◽  
Krzysztof Wolski ◽  
Pascal Berger ◽  
A. Terlain ◽  
Gerard Santarini
Keyword(s):  
Grain Boundary ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Boundary Diffusion ◽  
Coupling Effect ◽  
Boundary Concentration ◽  
Liquid Bismuth ◽  
Intergranular Embrittlement ◽  
Diffusion Controlled ◽  
Grain Boundary Wetting

The consequences of the contact between liquid bismuth and a copper bicrystal are investigated at 500°C. Atoms of bismuth are shown to penetrate and embritlle the copper grain boundary. Grain boundary concentration profiles of bismuth are obtained on fracture surfaces by both Auger electron spectroscopy and He4+ Rutherford backscattering spectroscopy. The maximum bismuth intergranular concentration is calculated from experimental data to be about 1.7 monolayers (near the liquid bismuth / solid copper interface). The overall profiles are significantly different from typical erfc profiles and an interpretation is proposed, based on the coupling effect between grain boundary diffusion and non-linear segregation. These results allow us to conclude on the absence of grain boundary wetting for the Cu / Bi system at 500°C.

An Auger Electron Spectroscopic Study of the Diffusion of Sulfur and Carbon in α-Iron

1977 ◽  
Vol 31 (3) ◽  
pp. 210-213 ◽  
Author(s):  
W. E. Swartz ◽  
D. M. Holloway
Keyword(s):  
Activation Energy ◽  
Grain Boundary ◽  
Diffusion Process ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Boundary Diffusion ◽  
Carbon Migration ◽  
Sulfur Diffusion ◽  
Kinetics Of ◽  
Arrhenius Analysis

Auger electron spectroscopy has been employed to study the diffusion of sulfur and carbon in α-iron. In the temperature range 25 to 500°C carbon preferentially segregates to the surface. From 400 to 700°C sulfur segregates to the surface while carbon is thermally desorbed. An Arrhenius analysis of the sulfur diffusion data yields an activation energy of 14.5 kcal/mol, which is consistent with a grain boundary diffusion process. The kinetics of carbon migration is complicated by the thermal desorption which makes Arrhenius analysis impossible.

Investigation of Ta grain boundary diffusion in copper by means of Auger electron spectroscopy

2004 ◽  
Vol 459 (1-2) ◽  
pp. 303-307 ◽  
Author(s):  
G Erdélyi ◽  
G Langer ◽  
J Nyéki ◽  
L Kövér ◽  
C Tomastik ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Auger Electron Spectroscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion

Determination of grain-boundary diffusion coefficients by Auger electron spectroscopy

2000 ◽  
Vol 162-163 ◽  
pp. 213-218 ◽  
Author(s):  
Z. Erdélyi ◽  
Ch. Girardeaux ◽  
G.A. Langer ◽  
L. Daróczi ◽  
A. Rolland ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Auger Electron Spectroscopy ◽  
Diffusion Coefficients ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion

Investigation of grain-boundary diffusion of nickel in molybdenum by auger electron spectroscopy

1992 ◽  
Vol 35 (7) ◽  
pp. 611-614 ◽  
Author(s):  
I. V. Ratochka ◽  
V. B. Marvin ◽  
I. K. Zverev ◽  
V. M. Adeev ◽  
Yu. N. Ivashchenko ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Auger Electron Spectroscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion

Investigation of an additive remedy for temper brittleness

1980 ◽  
Vol 295 (1413) ◽  
pp. 301-301 ◽  
Keyword(s):  
Rare Earth ◽  
Grain Boundary ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Chemical Potential ◽  
Active Species ◽  
Temper Brittleness ◽  
Chemical Fixation ◽  
Boundary Concentration ◽  
Bulk Chemical

Analysis of engineering steels by Auger electron spectroscopy has identified phosphorus, and to a lesser extent tin, as the grain boundary segregating impurities that commonly cause temper brittleness (Hondros et al . 1976). In the theory of alloy design, a number of remedial procedures can be applied to minimize embrittling effects and thus to realize the natural strength of the alloy without recourse to expensive purification treatments (Hondros & Seah 1977). In the chemical ‘fixation’ route used here, the active species may be immobilized by a microprecipitate reaction, which reduces its bulk chemical potential and thus greatly reduces its grain boundary concentration. Following a thorough thermochemical assessment of the feasibility of ‘fixing’ residuals, the rare earth elements, lanthanum and (to a lesser extent) cerium, were selected as having the best promise because of their higher affinity for P and Sn than for the carbon of the steel

Grain Boundary Diffusion of Silver in Copper-Iron Alloys

2012 ◽  
Vol 323-325 ◽  
pp. 161-164 ◽  
Author(s):  
Danil V. Vaganov ◽  
Sergei Zhevnenko ◽  
Yuri Terentyev
Keyword(s):  
Grain Boundary ◽  
Auger Electron Spectroscopy ◽  
Grain Boundaries ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Boundary Diffusion ◽  
Alloy Composition ◽  
Electrochemical Etching ◽  
Triple Product ◽  
Sem Investigation

Grain boundary (GB) diffusion of Ag in Cu-based alloys with Fe (0, 0.14, 0.29, 0.43, 0.55 and 0.99 at. % Fe) was investigated. The experiments were performed at 600, 650 and 700 °C, which corresponded to B-regime. It was proved by the presence of diffusion wedges. The triple product of silver GB diffusion was obtained by measuring of angle at the top of isoconcentration profiles which was detected by electrochemical etching. It was shown that iron decreased the triple product at higher temperatures and didnt affect significantly at lower temperatures. SEM investigation showed the presence of small (10-100 nm) precipitates on the copper grain boundaries. Analysis of particles composition by Auger electron spectroscopy indicated higher concentration of iron comparing with the alloy composition.

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