Isothermes of Surface and Grain Boundary Tension of Cu-Based Alloys with Sb, Sn, In

2008 ◽  
Vol 273-276 ◽  
pp. 608-615 ◽  
Author(s):  
Evgeny I. Gershman ◽  
Sergei Zhevnenko

Grain boundary and surface tension for pure copper and copper-based alloys with Sb, Sn and In are measured by zero creep method. On the base of these and literature data, using the Shyshkovsky equation for a dilute solution, the isothermes of surface tension and grain boundary tension are constructed in Cu-based alloys with Sb, Sn, In and also Bi and Au. It is shown that all solutes are active on the surface tension of copper. The free energies of adsorption are negative and decrease in a following consequence: Bi, Sb, Sn, In, and Au.

2006 ◽  
Vol 258-260 ◽  
pp. 427-432
Author(s):  
Danil V. Vaganov ◽  
Sergei Zhevnenko

Grain boundary surface tension and surface tension of free surface for pure copper and copper-tin alloys are measured. On the base of these data isothermes of grain boundary tension, free surface tension and isothermes of adsorption are constructed in assumption of a dilute solution.


2007 ◽  
Vol 264 ◽  
pp. 39-46
Author(s):  
Evgeny I. Gershman ◽  
Sergei Zhevnenko

Grain boundary and free surface tension for pure copper and copper-tin alloys are measured. On the base of these data isothermes of grain boundary tension, free surface tension and isothermes of adsorption are constructed in assumption of a dilute solution. Grain boundary diffusion coefficients of copper were calculated by using the relation of Borisov et. al. for copper and copper-tin alloys.


2000 ◽  
Vol 652 ◽  
Author(s):  
A. C. Lewis ◽  
A. B. Mann ◽  
D. van Heerden ◽  
D. Josell ◽  
T. P. Weihs

ABSTRACTLaminated composites with polycrystalline layers typically break down at high temperatures through grain boundary grooving and the pinch-off of individual layers. Such materials, when exposed to high temperatures, develop grooves where grain boundaries meet the interfaces between layers. The depths of the grooves are controlled by the ratios of grain boundary and interfacial free energies, γgb/γint. Depending on the dimensions of the grains, these grooves can extend through the entire layer, causing pinch-off at the grain boundary. This pinch-off destroys the layering and eventually leads to a gross coarsening of the microstructure. Because microstructural stability is critical to performance for most applications, the ability to understand and predict the stability of microlaminates is a necessary tool. An existing model of this capillarity-driven breakdown requires the interfacial free energies, γgb and γint, as input parameters. Both biaxial and uniaxial zero creep tests have been used in conjunction with transmission electron microscopy to measure these interfacial energies in Ag/Ni and Nb/Nb5Si3 microlaminates.


1987 ◽  
Vol 33 (114) ◽  
pp. 159-161 ◽  
Author(s):  
M.E.R. Walford ◽  
D.W. Roberts ◽  
I. Hill

AbstractThe dihedral angle of water at a grain boundary in ice is found, by measuring the optical focal length of lenticular water inclusions, to be 33.6 ± 0.7°. The new result leads to only minor revision of published experimental values of specific surface free energies in the ice–water system (Ketcham and Hobbs, 1969).


2018 ◽  
Vol 281 ◽  
pp. 918-933
Author(s):  
Wen Dong Luo ◽  
Hai Peng Qiu ◽  
Jing Zhe Pan

In the sintering of ceramics, cracks are inevitably encountered after sintering. But very few studies have been presented in the literature for qualifying and quantifying effects of inhomogeneity on sintering kinetics. Therefore, a series of detailed sintering variables such as grain size, surface tension and diffusivity are chosen to study the effects of their inhomogeneity on sintering kinetics through a computational model calculated by computer.Furthermore, there are two main achievements in this computational model that first one is providing a numerical solution for the curvature at triple junction (pore tip) of microscopic particles, and second one is considering the effect of surface diffusion on first-stage sintering where diffusion mechanism is coupled by grain-boundary and surface diffusion.


Sign in / Sign up

Export Citation Format

Share Document