Study on Mechanism for Material Removal and Surface Generation by Molecular Dynamics Simulation in Abrasive Processes

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.259-260.211 ◽

2004 ◽

Vol 259-260 ◽

pp. 211-215 ◽

Author(s):

Bin Lin ◽

Hui Wu ◽

Hong Tao Zhu ◽

S.Y. Yu

Keyword(s):

Molecular Dynamics ◽

Molecular Dynamics Simulation ◽

Material Removal ◽

Dynamics Simulation ◽

Surface Generation

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Molecular dynamics simulation of single discharge and dimensionless correlation with actual material removal in micro electrical discharge machining

Molecular Simulation ◽

10.1080/08927022.2019.1626988 ◽

2019 ◽

Vol 45 (13) ◽

pp. 985-995

Author(s):

T. Roy ◽

A. Sharma ◽

D. Datta ◽

R. Balasubramaniam

Keyword(s):

Molecular Dynamics ◽

Molecular Dynamics Simulation ◽

Electrical Discharge ◽

Material Removal ◽

Electrical Discharge Machining ◽

Dynamics Simulation ◽

Micro Electrical Discharge Machining ◽

Single Discharge ◽

Actual Material

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Effects of water molecules on material removal behavior in Vibration Assisted Nano Impact-machining by Loose Abrasives - A molecular dynamics simulation study

Procedia Manufacturing ◽

10.1016/j.promfg.2018.07.065 ◽

2018 ◽

Vol 26 ◽

pp. 552-559 ◽

Author(s):

Sagil James ◽

Murali Sundaram

Keyword(s):

Molecular Dynamics ◽

Molecular Dynamics Simulation ◽

Simulation Study ◽

Material Removal ◽

Dynamics Simulation ◽

Water Molecules

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Mechanism of material removal during nanofinishing of aluminium in aqueous KOH: A reactive molecular dynamics simulation study

Computational Materials Science ◽

10.1016/j.commatsci.2018.09.042 ◽

2019 ◽

Vol 156 ◽

pp. 35-46 ◽

Author(s):

Prabhat Ranjan ◽

R. Balasubramaniam ◽

V.K. Jain

Keyword(s):

Molecular Dynamics ◽

Molecular Dynamics Simulation ◽

Simulation Study ◽

Material Removal ◽

Dynamics Simulation ◽

Reactive Molecular Dynamics

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Molecular dynamics simulation of the material removal mechanism in micro-EDM

Precision Engineering ◽

10.1016/j.precisioneng.2010.09.005 ◽

2011 ◽

Vol 35 (1) ◽

pp. 51-57 ◽

Author(s):

Xiaodong Yang ◽

Jianwen Guo ◽

Xiaofei Chen ◽

Masanori Kunieda

Keyword(s):

Molecular Dynamics ◽

Molecular Dynamics Simulation ◽

Material Removal ◽

Dynamics Simulation ◽

Micro Edm ◽

Removal Mechanism ◽

Material Removal Mechanism

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220 Molecular Dynamics Simulation of Material Removal Mechanism beyond Propagation Speed of Plastic Wave

Proceedings of International Conference on Leading Edge Manufacturing in 21st century LEM21 ◽

10.1299/jsmelem.2003.309 ◽

2003 ◽

Vol 2003 (0) ◽

pp. 309-314 ◽

Author(s):

J. Shimizu ◽

L. Zhou ◽

H. Eda

Keyword(s):

Molecular Dynamics ◽

Molecular Dynamics Simulation ◽

Material Removal ◽

Propagation Speed ◽

Dynamics Simulation ◽

Plastic Wave ◽

Removal Mechanism ◽

Material Removal Mechanism

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Molecular dynamics simulation of silicon carbide nanoscale material removal behavior

Ceramics International ◽

10.1016/j.ceramint.2018.03.195 ◽

2018 ◽

Vol 44 (10) ◽

pp. 11910-11913 ◽

Author(s):

Yao Liu ◽

Beizhi Li ◽

Lingfei Kong

Keyword(s):

Molecular Dynamics ◽

Silicon Carbide ◽

Molecular Dynamics Simulation ◽

Material Removal ◽

Dynamics Simulation ◽

Nanoscale Material

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Material removal mechanism during porous silica cluster impact on crystal silicon substrate studied by molecular dynamics simulation

Applied Surface Science ◽

10.1016/j.apsusc.2012.09.147 ◽

2013 ◽

Vol 264 ◽

pp. 148-156 ◽

Author(s):

Ruling Chen ◽

Ranran Jiang ◽

Hong Lei ◽

Min Liang

Keyword(s):

Molecular Dynamics ◽

Molecular Dynamics Simulation ◽

Silicon Substrate ◽

Material Removal ◽

Porous Silica ◽

Dynamics Simulation ◽

Removal Mechanism ◽

Material Removal Mechanism ◽

Crystal Silicon

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Material removal and interactions between an abrasive and a SiC substrate: A molecular dynamics simulation study

Ceramics International ◽

10.1016/j.ceramint.2019.11.006 ◽

2020 ◽

Vol 46 (5) ◽

pp. 5623-5633 ◽

Author(s):

Van-Thuc Nguyen ◽

Te-Hua Fang

Keyword(s):

Molecular Dynamics ◽

Molecular Dynamics Simulation ◽

Simulation Study ◽

Material Removal ◽

Dynamics Simulation

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The effect of tool geometry on subsurface damage and material removal in nanometric cutting single-crystal silicon by a molecular dynamics simulation

Applied Physics A ◽

10.1007/s00339-016-0319-x ◽

2016 ◽

Vol 122 (9) ◽

Author(s):

Houfu Dai ◽

Genyu Chen ◽

Qihong Fang ◽

Jiu Yin

Keyword(s):

Molecular Dynamics ◽

Molecular Dynamics Simulation ◽

Single Crystal ◽

Material Removal ◽

Single Crystal Silicon ◽

Subsurface Damage ◽

Dynamics Simulation ◽

Tool Geometry ◽

Crystal Silicon ◽

Nanometric Cutting

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Investigation of material removal mechanism of silicon wafer in the chemical mechanical polishing process using molecular dynamics simulation method

Applied Physics A ◽

10.1007/s00339-009-5097-2 ◽

2009 ◽

Vol 95 (3) ◽

pp. 899-905 ◽

Author(s):

Xuesong Han ◽

Yuanzhong Hu ◽

Siyuan Yu

Keyword(s):

Molecular Dynamics ◽

Molecular Dynamics Simulation ◽

Chemical Mechanical Polishing ◽

Material Removal ◽

Simulation Method ◽

Dynamics Simulation ◽

Removal Mechanism ◽

Material Removal Mechanism ◽

Polishing Process ◽

Chemical Mechanical Polishing Process

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