An Experimental Study on Creep Deformation of PBX with Laser Moiré Interferometry Method

2006 ◽  
Vol 306-308 ◽  
pp. 1037-1042 ◽  
Author(s):  
Hui Min Xie ◽  
Hang Shi ◽  
Peng Wan Chen ◽  
Feng Lei Huang ◽  
Dai Ning Fang
Keyword(s):  
Experimental Study ◽  
Creep Deformation ◽  
Damage Mechanics ◽  
Moiré Interferometry ◽  
Experimental Results ◽  
Creep Process ◽  
Moire Interferometry ◽  
High Polymer ◽  
Interferometry Method

In this paper, the creep deformation of PBX was measured using the moiré interferometry. The experimental results show a different creep process compared with pure high polymer and this phenomenon is preliminary analyzed from damage mechanics.

The Creep Measurement of 475°C Pipeline Using Moire Interferometry

1998 ◽  
Vol 120 (2) ◽  
pp. 144-148 ◽  
Author(s):  
X. Huimin ◽  
Z. Daqing ◽  
D. Fulong ◽  
Z. Wei ◽  
P. Dietz ◽  
...  
Keyword(s):  
High Temperature ◽  
Power Plant ◽  
Experimental Method ◽  
Moiré Interferometry ◽  
Experimental Results ◽  
Measuring Error ◽  
Moire Interferometry ◽  
Interferometry Method ◽  
Main Steam ◽  
Creep Measurement

In this study, a new experimental method for measuring the creep of pipeline using moire interferometry was proposed. Curved-surface-deformed grating replicating technique was combined with the high-temperature-resistant grating and moire interferometry method, and was applied to measure the creep of a 475°C main steam pipeline in the Qinghe Power Plant for 3600 h. The measuring principle and experimental techniques are described. The measuring error and experimental results are discussed in detail.

An Experimental Study of Dropped Ply Region in Composite

2006 ◽  
Vol 326-328 ◽  
pp. 1769-1772
Author(s):  
Chun Wang Zhao ◽  
Yong Ming Xing
Keyword(s):  
Experimental Study ◽  
Stress Concentration ◽  
Failure Mechanisms ◽  
Experimental Results ◽  
Epoxy Composites ◽  
Moire Interferometry ◽  
Concentration Region ◽  
Micro Cracks ◽  
Stress Concentration Region ◽  
Mechanical Study

A micro mechanical study of Carbon/Epoxy composites with internally dropped plies has been made using micro-moiré interferometry. The experimental results show that there is a stress concentration region before the dropped ply. Micro cracks were initiated and propagated in this region. Two failure mechanisms in the dropped ply region were observed.

Techniques for Experimental Measurement of Fatigue Crack Closure

2007 ◽  
Vol 7-8 ◽  
pp. 3-9 ◽  
Author(s):  
David Nowell
Keyword(s):  
Fatigue Crack ◽  
Crack Propagation ◽  
Crack Closure ◽  
Experimental Measurement ◽  
Moiré Interferometry ◽  
Experimental Results ◽  
Moire Interferometry ◽  
Fatigue Crack Closure ◽  
Closure Models ◽  
Important Phenomenon

Fatigue crack closure is an important phenomenon which needs to be taken into account in the development of models for crack propagation. This paper presents an overview of techniques for measuring crack closure. The moiré interferometry approach is described in more detail and some experimental results are presented and compared with the predictions of closure models.

Effect of High Glass Transition Temperature on Reliability of Non-Conductive Film (NCF)

2006 ◽  
Vol 326-328 ◽  
pp. 517-520 ◽  
Author(s):  
Jin Hyoung Park ◽  
Chang Kyu Chung ◽  
Kyoung Wook Paik ◽  
Soon Bok Lee
Keyword(s):  
Glass Transition ◽  
Shear Strain ◽  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Effective Parameters ◽  
Conductive Film ◽  
Interferometry Method ◽  
Stress Free State

Among many factors that influence the reliability of a flip-chip assembly using NCF interconnections, the most effective parameters are often the coefficient of thermal expansion (CTE), the modulus (E), and the glass transition temperatures (Tg). Of these factors, the effect of Tg on thermal deformation and device reliability is significant; however, it has not been shown clearly what effect Tg has on the reliability of NCF. The Tg of a conventional NCF material is approximately 110°C. In this study, a new high Tg NCF material that has a 140oC Tg is proposed. The thermal behaviors of the conventional and new NCFs between -40oC to 150oC are observed using an optical method. Twyman-Green interferometry and the moiré interferometry method are used to measure the thermal micro-deformations. The Twyman-Green interferometry measurement technique is applied to verify the stress-free state. The stress-free temperatures of the conventional and new Tg NCF materials are approximately 100oC and 120oC respectively. A shear strain at a part of the NCF chip edge is measured by moiré interferometry. Additionally, a method to accurately measure the residual warpage and shear strain at room temperature is proposed. Through the analysis of the relationship between the warpage and the shear strain, the effect of the high-Tg NCF material on the reliability is studied.

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