Thermal Deformation Analysis of Copper Microbridges with Speckle Interferometry and Finite Element
2007 ◽
Vol 353-358
◽
pp. 2871-2874
Keyword(s):
In this paper, a speckle microinterferometric system was employed to study the thermal deformation of the Cu microbridges with different dimensions. The deflections of the microbridges caused by the thermal loading were measured with real-time by the speckle microinterferometric system and the surface temperatures of the bridges were recorded using a digital thermometer. The deformation evaluation after microbridges buckling was also recorded with our testing system. Then, the experimental results were compared with the finite element analysis (FEA).
Thermal Deformation Analysis for the Guideway of Large-Type CNC Lathe Based on Finite Element Method
2011 ◽
Vol 58-60
◽
pp. 198-204
1995 ◽
Vol 117
(3)
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pp. 269-277
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2012 ◽
Vol 151
◽
pp. 716-720
2011 ◽
Vol 374-377
◽
pp. 2171-2175
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2012 ◽
Vol 433-440
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pp. 567-571
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2013 ◽
Vol 351-352
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pp. 760-764