The Chemical Plating Copper of the SiC Particles and Thermal Expansion Behavior of the SiCp/Cu Composites

2013 ◽  
Vol 544 ◽  
pp. 334-338
Author(s):  
Ming Hu ◽  
Yun Long Zhang ◽  
You Jin Liu ◽  
Jing Gao
Keyword(s):  
Thermal Expansion ◽  
Pure Copper ◽  
Copper Matrix ◽  
Copper Plating ◽  
Chemical Plating ◽  
Thermal Expansion Coefficients ◽  
Sic Particles ◽  
Expansion Behavior ◽  
The Matrix

In this paper, the chemical copper plating technology was utilized to modify the SiC particles and the SiCp/Cu composites were fabricated by the pressure-less sintering technology. The effect of pretreatment solution on the coating quality of the SiC particles was discussed in details. The pure copper and copper- coated SiC particles or SiC particles without coated copper were used to fabricate the SiCp/Cu composites. At the same time, the microstructures and thermal expansion coefficients of the SiCp/Cu composites were studied. The results showed that the uniform and continuous Cu coating on the SiC particles can be obtained after chemical copper plating, and the copper-coated SiC particles can distributed continuously in the matrix of the SiCp/Cu composites. The chemical copper plating technology could improve the wettability between SiC particles and copper matrix obviously. The addition of the SiC particle could reduce the CTE of the SiCp/Cu composites.

scholarly journals Theoretical Investigation of Thermal Expansion Coefficients of SiC Reinforced Copper Matrix Composites

2020 ◽  
Vol 2 (2) ◽  
pp. 22
Keyword(s):  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Theoretical Investigation ◽  
Pure Copper ◽  
Copper Matrix ◽  
Electronics Industry ◽  
Matrix Composites ◽  
Thermal Expansion Coefficients ◽  
Turner Model ◽  
Expansion Coefficients

The thermal expansion coefficient (CTE) of the copper element, which is widely used in the electronics industry, is quite high. It is of great importance to decrease the CTE value in order not to deform against the heat it is exposed to. In this study, it is aimed to theoretically examine the changes in CTE value when SiC supplement is applied to pure copper. For this purpose, CTE value calculations were made according to Kerner and Turner's models for composites that were reinforced at different rates by volume. Sample studies in the literature have been utilized for percent component ratios. In this context, the amount of reinforcement was adjusted to be 5, 10, 15, and 20vol.% by volume. According to the findings, it was observed that there was ̴ %4-17 decrease in CTE value based on the Kerner model and ̴ %7-26 decrease based on the Turner model.

Study of the Technology of Chemical Copper Plating on Al-CuO Agglomerated Powders

2007 ◽  
Vol 280-283 ◽  
pp. 591-592
Author(s):  
Jun Yan ◽  
Jian Zheng Yi ◽  
Hai Ping Cui ◽  
Xin Kang Du ◽  
Jian Jiang Wang
Keyword(s):  
Orthogonal Design ◽  
Copper Plating ◽  
Research Focus ◽  
Chemical Plating

This research focus on the technology of copper chemical plating on Al-CuO agglomerated powders with the size of 150-200µm. Orthogonal design is employed to gain the optimized formula, and the quality of the cladding was analyzed by means of SEM and EPMA. The results show that the cladding is uniform and the Al-CuO powders are primarily coated by copper.

Structure and Thermal Expansion Behavior of Dy2-xGdxMo4O15 Solid Solution

2008 ◽  
Vol 368-372 ◽  
pp. 1665-1667
Author(s):  
M.M. Wu ◽  
X.L. Xiao ◽  
Y.Z. Cheng ◽  
J. Peng ◽  
D.F. Chen ◽  
...  
Keyword(s):  
Crystal Structure ◽  
Solid Solution ◽  
Thermal Expansion ◽  
Monoclinic Structure ◽  
X Ray Diffraction ◽  
X Ray ◽  
Thermal Expansion Coefficients ◽  
Expansion Behavior ◽  
Expansion Coefficients ◽  
Cell Volumes

A new series of solid solutions Dy2-xGdxMo4O15 (x = 0.0-0.9) were prepared. These compounds all crystallize in monoclinic structure with space group P21/c. The lattice parameters a, b, c and unit cell volumes V increase almost linearly with increasing gadolinium content. The intrinsic thermal expansion coefficients of Dy2-xGdxMo4O15 (x = 0.0 and 0.25) were obtained in the temperature range of 25 to 500°C with high-temperature X-ray diffraction. The correlation between thermal expansion and crystal structure was discussed.

Thermal Expansion Behavior of the Multiphase Composite System

2004 ◽  
Vol 449-452 ◽  
pp. 765-768
Author(s):  
Chong Sung Park ◽  
Hyun Seok Hong ◽  
Myung Ho Kim ◽  
Chong Mu Lee
Keyword(s):  
Thermal Expansion ◽  
Composite System ◽  
Welding Process ◽  
High Volume ◽  
Volume Percent ◽  
New Approach ◽  
Composite Systems ◽  
Expansion Behavior ◽  
The Matrix ◽  
Multiphase Composite

A new approach for the CTE on the basis of Ashelby.s cutting and welding process was made for the analysis of the thermal expansion behaviors of Al-Si alloys and composites. In this theoretical approach, it was considered that relaxation of residual stress could create an elastoplastic zone in the matrix around a particle during cooling. A comparison of the measured CTEs with the calculated ones for the Al-Si-SiCp and Al-Si-Al2O3 composite systems was performed in terms of the volume percent and the size of reinforced phases. The calculated results revealed that the linear CTE of the both composite depends on the size of the reinforce phases, especially at the composite systems with a low volume percent of the reinforce phases. The increase in the volume percentages of Al2O3, SiCp and Si phase lowers the linear CTEs of the systems. The measured CTEs was deviated less than about ten percents from the calculated ones at composites with a high volume percent. The deviations of the CTEs of reinforced phases are about 4 - 6 vol% from real composite systems.

Fabrication of MWCNT-Reinforced Copper Composite and Thermal Expansion Behavor

2011 ◽  
Vol 694 ◽  
pp. 713-717
Author(s):  
Z. F. Fan ◽  
X.H. Chen ◽  
L.S. Xu ◽  
Y. Q. Liu ◽  
W. B. Zhong ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Cuprous Oxide ◽  
Pure Copper ◽  
Solution Phase ◽  
Mwcnt Content ◽  
Multi Walled Carbon Nanotube ◽  
The Matrix ◽  
Unique Method ◽  
Copper Composite ◽  
Copper Bulk

A unique method for preparation of multi-walled carbon nanotube (MWCNT)- reinforced copper composite is reported. It involves solution phase systhesis MWCNT-implanted cuprous oxide composite spheres, formation of MWCNT/ copper composite spheres after reduction in H2 atmosphere and preparation of the MWCNT/copper bulk with vacuum hot pressing. Scanning Eelectron Microscope image (SEM) of the fracture surfaces indicate MWCNTs are homogeneously dispersed in the composite and bonded to the matrix. In addition, the thermal expansion of the composites at various MWCNTs (0wt%, 1wt%, 5wt%) were investigated. The coefficient of the thermal expansion (CTE) was decreased with increase of the MWCNT content, which are all much lower than that of pure copper.

Thermal Conductivity and Thermal Expansion of Copper Matrix Composites Reinforced with High Modulus C Fibres

2010 ◽  
Vol 297-301 ◽  
pp. 820-825
Author(s):  
Naďa Beronská ◽  
Pavol Štefánik ◽  
Karol Iždinský
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Pure Copper ◽  
Longitudinal Direction ◽  
Copper Matrix ◽  
Matrix Composites ◽  
High Modulus ◽  
Pressure Infiltration ◽  
Copper Matrix Composite ◽  
Infiltration Technique

Copper matrix composite with pure copper matrix reinforced with high modulus carbon fibres Thornel K 1100 was prepared by gas pressure infiltration technique. As-received composite was subjected to thermal expansion and thermal conductivity measurements in longitudinal and transversal directions. Large anisotropy of properties as well as surprisingly good structural stability has been observed. The mean coefficients of thermal expansion as low as 0.8 x 10-6 K-1 in longitudinal and as high as 23.5 x 10-6 K-1 in transversal directions were determined, the thermal conductivities as high as 650 Wm-1K-1 in longitudinal direction and as low as 60.7 Wm-1K-1in transversal directions were measured.

Residual Stresses Distributions within Thin-Walled Ceramic-Metal Seal

2012 ◽  
Vol 503-504 ◽  
pp. 428-431 ◽  
Author(s):  
Guo Liang Zhang ◽  
Lei Shi ◽  
Da Zhi Jin
Keyword(s):  
Thermal Expansion ◽  
Residual Stresses ◽  
Fem Simulation ◽  
Matrix Composites ◽  
Thermal Expansion Coefficients ◽  
Expansion Behavior ◽  
Metal Seal ◽  
Significant Difference ◽  
Thin Walled ◽  
Typical Configuration

Due to significant difference of thermal expansion coefficients between ceramic and metal, the residual stresses are deemed to be induced into the interior of matrix composites within the ceramic-metal seal systems. Many investigations of the residual stresses distributions on dissimilar solid materials joints so far have been carried out theoretically and experimentally, whereas ones of the residual stresses distributions within the thin-walled ceramic-metal seal systems are rarely performed. In order to obtain information for improving their seal structures in the future, the residual stresses distributions resulted from the thermal expansion behavior in the typical configuration of the thin-walled ceramic-metal seal are investigated by theoretical formulae, experimental observation and finite element method (FEM) simulation in this paper. The changing trends of the computational results of the residual stresses distributions agree with the experimental results of the measurement with X-ray diffractometer. The overall residual stresses are found to increase drastically near the welding interfaces. The highest tensile stress occurs at the outer surfaces of the ceramic near the welding interfaces.

scholarly journals Measurement of Residual Stresses in Metal Matrix Composites

1993 ◽  
Author(s):  
P. K. Wright
Keyword(s):  
Thermal Expansion ◽  
Residual Stresses ◽  
Metal Matrix Composites ◽  
Metal Matrix ◽  
Volume Fraction ◽  
Stress Measurement ◽  
Fiber Direction ◽  
Matrix Composites ◽  
Thermal Expansion Coefficients ◽  
The Matrix

Metal matrix composites (MMC) are expected to develop internal residual stresses on cooling from fabrication due to the large thermal expansion mismatch between reinforcing fibers and the matrix. This work was undertaken to experimentally measure these residual stresses and compare them with analytical calculations in order to clearly establish their levels and dependence on material parameters. Two techniques for residual stress measurement were investigated: 1) Xray diffraction (sin2 psi method) and 2) neutron diffraction. Both techniques gave results in good agreement with analytical predictions for several systems (SCS-6/Ti-24Al-11Nb, W/NiAl, and Al2O3NiAl). The results obtained showed a dependence of residual stresses on thermal expansion coefficients, elastic moduli, volume fraction fibers, and matrix yield strengths. The fibers showed compressive stress states, and the matrix, tension. Average stresses were higher in the fiber direction than transverse to fibers.

Preparation and Properties of Carbon Nanotubes Reinforced Cu Matrix Composites for Electronic Packaging Application

2013 ◽  
Vol 275-277 ◽  
pp. 1789-1793 ◽  
Author(s):  
Long Shan Xu ◽  
Xiao Hua Chen ◽  
Xing Jun Liu
Keyword(s):  
Carbon Nanotubes ◽  
Electronic Packaging ◽  
Pure Copper ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Composite Powders ◽  
Multi Walled Carbon Nanotube ◽  
The Matrix ◽  
Copper Composite ◽  
Copper Nanocomposites

Multi-walled carbon nanotube (MWCNT) reinforced copper nanocomposites were prepared using a unique spherical MWCNT-implanted copper composite powders. The MWCNTs are homogenously ‘locked’ in the composite and tightly bonded to the matrix, which makes them play excellent reinforcement role on the microhardness compared with the unreinforced pure copper. Although the thermal conductivity is not enhanced for the thermal resistance between the carbon nanotubes and the copper matrix; it is still high enough to be used as electronic packaging materials even the concentration of MWCNTS in the composite is up to 5 wt%. Furthermore, the thermal expansion of the composites decreased apparently with the addition of the carbon nanotubes.

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