Thermal Effects of Mechanical Polishing and Conditioning on Polishing Pads

2015 ◽  
Vol 642 ◽  
pp. 120-124
Author(s):  
Hung Jung Tsai ◽  
Chia Hao Chuang
Keyword(s):  
Material Surface ◽  
Test Rig ◽  
Polishing Process ◽  
Conditioning Process ◽  
Polishing Pad ◽  
End Point Detection ◽  
Pad Conditioning ◽  
Improved Design ◽  
Point Detection ◽  
Polishing Pads

Polishing process is a primary technique for planarization of material surface in manufacture fabrication. The pad structure and its material properties are important to determine the polish rate and planarity that can be achieved by the polishing process. Besides, the pad conditioning is used to regenerate the surface of the polishing pad surface by breaking up the glazed areas. Because the polishing and pad conditioning mechanism is inadequately understood and because higher levels of pad polishing performance are desired, the investigation of experiment becomes more important.In this paper, a high precision polishing machine has established. With an improved design, a test rig can be easily used to simulate the polishing, pad conditioning process and acquire the signals of temperature. The temperature of test pads (i.e. Rodel IC1000A, Rodel IC 1000B and Opetech SB 660) is measured during polishing and pad conditioning process. For the self-design test rig, its surface temperature is measured by T-type thermocouples screwed behind the polishing (or conditioning) interface of the carrier. The experimental results provide a temperature index to end-point-detection and contribute to understanding of the mechanism on polishing pads.

Thermal and Shear Characteristics Study of Various Mechanical Polishing Materials

2010 ◽  
Vol 97-101 ◽  
pp. 2076-2079 ◽  
Author(s):  
Hung Jung Tsai ◽  
Shun Jung Chiu ◽  
Hung Cheng Tsai ◽  
Pay Yau Huang
Keyword(s):  
Shear Force ◽  
Mechanical Polishing ◽  
Material Surface ◽  
Test Rig ◽  
Polishing Process ◽  
Load Transducer ◽  
Shear Characteristics ◽  
Copper Aluminum ◽  
Improved Design ◽  
Point Detection

Mechanical polishing is a primary technique for planarization of material surface in manufacture fabrication. Because the theoretical polishing mechanism is inadequately understood and because higher levels of polishing performance are desired, the investigation of experiment becomes more important. In this paper, a high precision polishing machine has established. With an improved design, a test rig can be easily used to simulate the mechanical polishing process and acquire the signals of polishing. The temperature-rise and shear force are measured for three different materials (i.e. copper, aluminum and silicon wafer) during mechanical polishing process. For the self-design test rig in the mechanical polishing process, its surface temperature is measured by T-type thermocouples screwed behind the polishing interface of the carrier. And shear force is measured by a load transducer mounted on the lever and connected with the polishing head. Furthermore, the roughness and particle size effects during polishing are demonstrated. The experimental results not only provide a good index to end-point-detection, but also increase the understanding of mechanical polishing process.

scholarly journals Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

2021 ◽  
Vol 11 (10) ◽  
pp. 4358
Author(s):  
Hanchul Cho ◽  
Taekyung Lee ◽  
Doyeon Kim ◽  
Hyoungjae Kim
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Shape Error ◽  
Profile Shape ◽  
Conditioning Process ◽  
Polishing Pad ◽  
Simulation Based ◽  
Diamond Conditioner ◽  
Pad Conditioning ◽  
Good Agreement

The uniformity of the wafer in a chemical mechanical polishing (CMP) process is vital to the ultra-fine and high integration of semiconductor structures. In particular, the uniformity of the polishing pad corresponding to the tool directly affects the polishing uniformity and wafer shape. In this study, the profile shape of a CMP pad was predicted through a kinematic simulation based on the trajectory density of the diamond abrasives of the diamond conditioner disc. The kinematic prediction was found to be in good agreement with the experimentally measured pad profile shape. Based on this, the shape error of the pad could be maintained within 10 μm even after performing the pad conditioning process for more than 2 h, through the overhang of the conditioner.

Achieving High Flatness of Workpiece Edge Shape by Considering Polishing Pressure

2010 ◽  
Vol 447-448 ◽  
pp. 71-75
Author(s):  
Takahiro Miyake ◽  
Toshiyuki Enomoto
Keyword(s):  
Semiconductor Devices ◽  
Silicon Wafers ◽  
Polishing Process ◽  
Model Based ◽  
Polishing Pad ◽  
Experimental Analyses ◽  
Polishing Pads ◽  
Polishing Pressure

In recent years, the achievement of further high flatness of workpiece edge shape is strongly required in mirror finishing. Especially, the edge roll off of silicon wafers as the substrates of semiconductor devices is demanded to decrease in the polishing process for raising the yield of IC chips. Many theoretical and experimental analyses for the edge roll off generation have been already done to meet the demand. The analyses, however, cannot fully account for the obtained edge shape in actual polishing. Concretely, the influence of the polishing pressure as one of the key polishing conditions on the edge roll off has not been clarified. In this study, the influence of the polishing pressure on the edge shape was investigated by the polishing experiments and the edge roll off generation analyses using the model based on the viscoelasticity of the polishing pad, which was proposed in the previous study. And it was revealed that an appropriate polishing pressure is needed to be set for achieving high flatness of workpiece edge shape with the consideration of the properties of applied polishing pads.

Stabilization of Removal Rate in Small Tool Polishing of Glass Lenses

2019 ◽  
Vol 13 (2) ◽  
pp. 221-229 ◽  
Author(s):  
Urara Satake ◽  
Toshiyuki Enomoto ◽  
Teppei Miyagawa ◽  
Takuya Ohsumi ◽  
Hidenori Nakagawa ◽  
...  
Keyword(s):  
Wear Resistance ◽  
Material Removal Rate ◽  
Time Variation ◽  
Material Removal ◽  
Removal Rate ◽  
Polishing Process ◽  
Polishing Pad ◽  
The Stability ◽  
Polishing Pads ◽  
Glass Lenses

The demand for improving the image quality of cameras has increased significantly, especially in industrial fields such as broadcasting, on-vehicle, security, factory automation, and medicine. The surface of glass lenses as a key component of cameras is formed and finished by polishing using small tools. The existing polishing technologies, however, exhibit serious problems including an unstable material removal rate over time. In our previous work, the mechanism of time variation in material removal rate was clarified. Based on the findings, a vibration-assisted polishing method using polishing pads containing titanium dioxide particles was developed for improving the stability of the material removal rate with the accumulated polishing time. Our experiments revealed that the proposed polishing method suppressed the time variation significantly in the material removal rate. The developed polishing pads, however, possessed a short life because of their poor wear resistance; as such, they could not be applied to the mass-production process of lenses. In this study, we applied the vibration-assisted polishing method to the polishing process using commercial polishing pads that exhibit sufficient wear resistance for practical use. To investigate the effect of vibration on the stability of the material removal rate, polishing experiments and the observation of slurry flow on the surface of the polishing pads during the vibration-assisted polishing process were conducted. Based on the findings, a new polishing method utilizing a large-amplitude high-frequency vibration applied to the polishing pressure was developed. In addition, a new polishing method utilizing the overhang of a polishing pad, where the polishing pad was moved to hang over the edge of the workpiece for incorporating periodic dressing processes of the polishing pad surface during the polishing process, was also developed. Our polishing experiments revealed that both the proposed polishing methods improved the stability of the material removal rate significantly over the course of the polishing process.

The Development of an Ultrasonic Head for CMP Pad Conditioning

2012 ◽  
Vol 500 ◽  
pp. 275-280
Author(s):  
Pei Lum Tso ◽  
Shi Guo Liu ◽  
J. C. Wang
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Machining Processes ◽  
Conditioning Process ◽  
Polishing Pad ◽  
Key Word ◽  
Ultrasonic Assisted ◽  
Ultrasonic Assisted Machining ◽  
Pad Conditioning ◽  
The Cost

The technology of ultrasonic assisted machining has been successfully used in many machining processes recently. Conditioning in the CMP not only can extending the life of the polishing pad but also improve process stability. In this paper we develop a brand new conditioning process with ultrasonic assisted conditioning UAC head for chemical mechanical polishing CMP process. The slurry came from inside the polishing spindle and had an independent cyclic system. As a result, this UAC device can remove polishing debris 4-6 times faster than conventional conditioning process. This conditioning process may even use water instead of slurry to reduce the cost of consumables of CMP. Key word: Chemical mechanical polishing CMP, Ultrasonic assisted conditioning UAC, Polishing Pad

Study on the CMP Pad Life with its Mechanical Properties

2008 ◽  
Vol 389-390 ◽  
pp. 481-486 ◽  
Author(s):  
Pei Lum Tso ◽  
Zhe Hao Huang ◽  
Sheng Wei Chou ◽  
Cheng Yi Shih
Keyword(s):  
Mechanical Properties ◽  
Surface Roughness ◽  
Physical Properties ◽  
Chemical Mechanical Polishing ◽  
Polishing Process ◽  
Polishing Pad ◽  
Pad Conditioning ◽  
The Difference ◽  
The Stability ◽  
The Cost

The primary consumables in chemical mechanical polishing (CMP) are the polishing pad and the slurry. The polishing pad significantly influences the stability of the polishing process and the cost of consumables (CoC). During the polishing process, a diamond dresser must be frequently employed to remove the debris to prevent accumulation, a process known as pad conditioning. In this paper, we investigated the physical properties of the CMP pad such as compressibility, thickness, and surface roughness. The difference between new and used pads has been studied. Conclusively, conditioning via a diamond dresser will extend pad life and reduce CoC.

The Experiments Study of Polishing Characteristics during Polishing Process

2012 ◽  
Vol 591-593 ◽  
pp. 460-463
Author(s):  
Hung Jung Tsai ◽  
Hung Cheng Tsai ◽  
Pay Yau Huang ◽  
Jeng Haur Horng ◽  
Shun Jung Chiu
Keyword(s):  
Temperature Rise ◽  
Shear Force ◽  
Mechanical Polishing ◽  
Interfacial Phenomena ◽  
Measurement Technology ◽  
Polishing Process ◽  
Load Transducer ◽  
End Point Detection ◽  
Point Detection

The investigation of experiment becomes more important to increase the understanding of polishing performance. In this paper, a high precision polishing process test bench with in-situ measurement technology was applied to investigate the effects of operating parameters on polishing interfacial phenomena during mechanical polishing with IC1000 pad. The shear force and temperature rise were measured for stainless steel during mechanical polishing process. The surface temperature was measured by T-type thermocouples and the shear force was measured by a load transducer. The shear force for various particle size, applied load and rotation speeds during polishing process was demonstrated. Furthermore, the temperature rise under different slurry concentration was investigated. The experimental results contribute to the understanding of polishing mechanism and also provide an index to end-point-detection.

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