Stabilization of Removal Rate in Small Tool Polishing of Glass Lenses

2019 ◽  
Vol 13 (2) ◽  
pp. 221-229 ◽  
Author(s):  
Urara Satake ◽  
Toshiyuki Enomoto ◽  
Teppei Miyagawa ◽  
Takuya Ohsumi ◽  
Hidenori Nakagawa ◽  
...  
Keyword(s):  
Wear Resistance ◽  
Material Removal Rate ◽  
Time Variation ◽  
Material Removal ◽  
Removal Rate ◽  
Polishing Process ◽  
Polishing Pad ◽  
The Stability ◽  
Polishing Pads ◽  
Glass Lenses

The demand for improving the image quality of cameras has increased significantly, especially in industrial fields such as broadcasting, on-vehicle, security, factory automation, and medicine. The surface of glass lenses as a key component of cameras is formed and finished by polishing using small tools. The existing polishing technologies, however, exhibit serious problems including an unstable material removal rate over time. In our previous work, the mechanism of time variation in material removal rate was clarified. Based on the findings, a vibration-assisted polishing method using polishing pads containing titanium dioxide particles was developed for improving the stability of the material removal rate with the accumulated polishing time. Our experiments revealed that the proposed polishing method suppressed the time variation significantly in the material removal rate. The developed polishing pads, however, possessed a short life because of their poor wear resistance; as such, they could not be applied to the mass-production process of lenses. In this study, we applied the vibration-assisted polishing method to the polishing process using commercial polishing pads that exhibit sufficient wear resistance for practical use. To investigate the effect of vibration on the stability of the material removal rate, polishing experiments and the observation of slurry flow on the surface of the polishing pads during the vibration-assisted polishing process were conducted. Based on the findings, a new polishing method utilizing a large-amplitude high-frequency vibration applied to the polishing pressure was developed. In addition, a new polishing method utilizing the overhang of a polishing pad, where the polishing pad was moved to hang over the edge of the workpiece for incorporating periodic dressing processes of the polishing pad surface during the polishing process, was also developed. Our polishing experiments revealed that both the proposed polishing methods improved the stability of the material removal rate significantly over the course of the polishing process.

Achieving Highly Stable Removal Rate in Small Tool Polishing of Glass Lenses

2020 ◽  
Author(s):  
Urara Satake ◽  
Toshiyuki Enomoto ◽  
Teppei Miyagawa ◽  
Takuya Ohsumi
Keyword(s):  
Removal Rate ◽  
Industrial Applications ◽  
Polishing Process ◽  
The Stability ◽  
Sudden Decrease ◽  
Polishing Pads ◽  
Glass Lenses ◽  
Polishing Pressure ◽  
Small Tool

Abstract The demand for improving the image quality of cameras has increased significantly, especially in industrial applications, such as broadcasting, on-vehicle, security, factory automation, and medicine. Surface of glass lenses, which is a key component of cameras, is formed and finished by polishing using small tools. However, the existing small tool polishing technologies exhibit serious problems including an unstable removal rate with the accumulated polishing time. In concrete, low removal rate at the beginning of the polishing process and sudden decrease in the removal rate during the polishing process significantly deteriorate stability of the removal rate. To improve the stability of the removal rate, we proposed a vibration-assisted polishing method using newly developed polishing pads with titanium dioxide particles in the previous work. Polishing experiments on glass lenses confirmed that the variation in the removal rate was suppressed by the developed polishing method; however, the reason for the improvement, in concrete, the relation between the vibration of polishing pressure and the stability of the removal rate remains unknown. In this study, we investigated and clarified the effect of the vibration of polishing pressure on the surface conditions of polishing pads, which strongly affected removal rate.

Effects of the Profile of Workpiece Surface on Material Removal Rate Distribution in Polishing Process

2016 ◽  
Vol 851 ◽  
pp. 149-154
Author(s):  
Zhen Gang Wu ◽  
Dong Shan He ◽  
Ping Zhou ◽  
Dong Ming Guo
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Surface Profile ◽  
Prediction Method ◽  
Quantitative Prediction ◽  
Polishing Process ◽  
Workpiece Surface ◽  
Coefficient Distribution ◽  
Polishing Pad

Accurate prediction of the material removal rate (MRR) distribution is very important for the control of the polishing process. However, the widely used prediction method of MRR based on the Preston equation is still incapable of predicting the roll-off phenomenon in polishing process. One of the reasons is that many of the researchers’ neglected the effect of the surface profile of the workpiece on the MRR. In this paper, the evolutionary process of MRR distribution with the change of surface profile using two different polishing pad is studied, it is found that MRR varies gradually with the change of surface profile and tends to be uniform finally. Based on the analysis of contact pressure considering the actual surface profile of workpiece and modified Preston equation, the distribution of MRR is analyzed. It is found that the Preston coefficient distribution on workpiece surface is stable when the surface profile variation is small and shows obvious differences from the center to the edge of the workpiece. Through the comparison it is found that correlation between the regularities of Preston coefficient distribution and the type of polishing pad is significant. The research results in this paper will play an important guiding role in the quantitative prediction method research of polishing process.

Study on Compound Machining of Polyurethane Polishing Pad and Cluster Abrasive Brush Based on MR Effect

2011 ◽  
Vol 487 ◽  
pp. 238-242 ◽  
Author(s):  
Min Li ◽  
Qiu Sheng Yan ◽  
Jia Bin Lu ◽  
Jing Fu Chai
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Machining Process ◽  
Machining Parameters ◽  
Polishing Process ◽  
Workpiece Material ◽  
Crystal Silicon ◽  
Polishing Pad ◽  
Mr Effect

Method of compound machining is used to process single crystal silicon and SrTiO3 ceramic substrates, and the factors on effects of compound machining are studied such as magnetic field intensity, processing time, rotating speed of lapping plate and lapping pressure. The results show that the roughness of work pieces processed by compound machining are smaller than that by lapping based on cluster MR effect and polyurethane pad polishing process, while the material removal rate is higher than polyurethane pad polishing process, therefore, compound machining shows its synergistic effect between lapping based on cluster MR effect and polyurethane pad polishing process. The type and properties of workpiece material, and machining parameters both have a significant impact on the roughness and material removal rate of compound machining process of polyurethane polishing pad and cluster abrasive brush based on MR effect.

Research on the Surface Change of the Large Optic Plane Wafer In the Fast Polishing Process

2010 ◽  
Vol 97-101 ◽  
pp. 1811-1814
Author(s):  
Jing Lin ◽  
Wei Yang ◽  
Yin Biao Guo
Keyword(s):  
Pressure Distribution ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Skin Model ◽  
Polishing Process ◽  
Surface Change ◽  
Rotational Movement ◽  
Polishing Pad

This paper researches on the surface change of the wafer in the fast polishing process. Firstly, the revised skin model is used to analyze the pressure distribution when the wafer stays beyond the polishing pad. Secondly, using the skin model and the Preston Equation MRR=k×p×v, the material removal rate is simulated and the surface change is predicted when the large optic plane wafer both has the rotational movement and the linear translation movement. Thirdly, the experiment is done to verify the simulation and prediction. The experiment result is similar to the simulation result. The paper shows a designed movement to predict the surface change.

The Experimental Study on Mechanical Polishing on Materials with Hydrolysis Reaction

2017 ◽  
Vol 739 ◽  
pp. 182-186
Author(s):  
Hung Jung Tsai ◽  
Pay Yau Huang ◽  
Chung Ming Tan ◽  
Tang Feng Chang
Keyword(s):  
Experimental Study ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Experimental Studies ◽  
Operating Conditions ◽  
Hydrolysis Reaction ◽  
Polishing Process ◽  
Surface Polishing ◽  
Material Removal Rate Model

The hydrolytic properties of LiAlO2 (LAO) are important factors for its applications on LED fabrication. During soft pad polishing process, the H2O in the slurry is deleterious for LAO surface polishing results. The current study develops a material removal rate model for materials with hydrolysis reaction to predict the result of polishing process.The current research conducts the experimental studies to investigate the material removal rate and its mechanism during the soft pad polishing process. In the experimental study, the hydrolytic properties of LAO have been tested to understand the hydrolysis speed with different operation parameters to assist the development of the theoretical model. Also the material removal rates of LAO with hydrolytic property have been measured under different soft pad polishing operating conditions. The experimental results provide the hydrolytic properties of LiAlO2 to understanding of the mechanism on polishing process.

Pressure and velocity dependence of the material removal rate in the fast polishing process

2008 ◽  
Vol 47 (33) ◽  
pp. 6236 ◽  
Author(s):  
Wei Yang ◽  
YinBiao Guo ◽  
YaGuo Li ◽  
Qiao Xu
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Velocity Dependence ◽  
Polishing Process

The Effect of the Broken Edge on the Concentricity of the Micro-Polished Optical Fiber End-Face

2013 ◽  
Vol 284-287 ◽  
pp. 2778-2783 ◽  
Author(s):  
Ying Chien Tsai ◽  
Guang Miao Huang ◽  
Jun Hong Chen ◽  
Shih Wei Chen
Keyword(s):  
Mathematical Model ◽  
Optical Fiber ◽  
Material Removal Rate ◽  
Tilt Angle ◽  
Material Removal ◽  
Removal Rate ◽  
Coupling Efficiency ◽  
Polishing Process ◽  
Laser Module ◽  
Micro Lens

The concentricity of the optical fiber micro lens affects the coupling efficiency of a laser module a lot. In this paper, the effect of the perpendicularity of the broken edge on the concentricity of the micro optical fiber end-face during the micro polishing process is studied. A mathematical model is derived to describe the variation of the material removal rate (MRR) when the tilt angles and amount of feed of the optical fiber are changed. An experiment is built to measure the concentricity of optical fiber with different tilt angles and feeds. The result shows that both of the dimensionless factor QAB and measured concentricity have the same tendency. The concentricity is better when the tilt angle is smaller and the amount of feed is larger. An improved polishing process is suggested. A good concentricity within 1μm can be achieved when fabricate the double-variable curvatures end-face of the optical fiber.

scholarly journals Material Removal Rate of Double-faced Mechanical Polishing of 4H-SiC Substrate

2021 ◽  
Author(s):  
Peng Zhang ◽  
Jingfang Yang ◽  
Huadong Qiu
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Mechanical Polishing ◽  
Ring Gear ◽  
The Third ◽  
Regression Test ◽  
Polishing Pads ◽  
The Relationship

Abstract Silicon carbide (SiC) has been a promising the-third-generation semiconductor power device material for high-power, high-temperature, substrate applications. It aims to improve the material removal rate (MRR), on the premise of ensuring the surface roughness requirements of the double-faced mechanical polishing of 6-inch SiC substrate. To obtain the relationship between any point on SiC substrate and polishing pads, the model about double-faced mechanical polishing has been built and the kinematics equations were created. Best optimized material removal rate parameters were obtained. MRR reached the maximum when speed rate of the outside ring gear to the inside sun gear m=-1, speed rate of lower plate to the inside sun gear n=5, SiC substrate distribution radius RB=75. The primary and secondary order of MRR (n>m>RB) was obtained. An accurate mathematical model of orthogonal rotary regression test of Tri-factor quadratic of MRR was established and the regression model was significant. Surface quality of SiC substrate was observed and characterized with SEM and AFM. It greatly provides a key guarantee for the next process of CMP, confirmed the importance of MRR to ultra-smooth polishing, and provides a guarantee for its application in semiconductor equipment and technology.

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