Development of 150-mm 4H-SiC Substrates Using a High-Temperature Chemical Vapor Deposition Method
Keyword(s):
To reduce the cost of silicon carbide (SiC) substrates, we have developed a high-temperature chemical vapor deposition (HTCVD) method for high-productivity crystal growth. We have conducted research using crystals of diameter 4 inches or less. In order to further reduce the cost, development of a 150-mm substrate has been demanded. With increasing crystal diameter, the occurrence of cracks should be suppressed efficiently. The internal structure of the furnace was designed to reduce the distribution of temperature in the radial direction of the crystal, ultimately reducing the stress responsible for the formation cracks. We demonstrated a 150-mm 4H-SiC substrate without cracks using by HTCVD method.
2012 ◽
Vol 27
(1)
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pp. 33-37
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2004 ◽
Vol 110
(1)
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pp. 34-37
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2000 ◽
Vol 18
(4)
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pp. 1595-1598
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