High Field Effect Mobility in 6H-SiC MOSFET with Gate Oxides Grown in Alumina Environment

2005 ◽  
Vol 483-485 ◽  
pp. 837-840 ◽  
Author(s):  
Fredrik Allerstam ◽  
G. Gudjónsson ◽  
H.Ö. Ólafsson ◽  
Einar Ö. Sveinbjörnsson ◽  
T. Rödle ◽  
...  

Lateral inversion channel metal-oxide-semiconductor field-effect transistors (MOSFETs) were manufactured on 6H-SiC and two gate oxidation recipes were compared. In one case the gate oxide was grown in N2O using quartz environment. The resulting peak field-effect mobility was µFE=43 cm2/Vs. In the other case the gate oxide was grown in oxygen using alumina environment and the resulting peak field-effect mobility was µFE=130 cm2/Vs. Oxidizing in an environment made from sintered alumina introduces contaminants into the oxide that effect the oxidation in several^ways. The oxidation rate is increased and the resulting SiC/SiO2 interface allows higher inversion channel mobility.

2008 ◽  
Vol 600-603 ◽  
pp. 791-794 ◽  
Author(s):  
Takuma Suzuki ◽  
Junji Senzaki ◽  
Tetsuo Hatakeyama ◽  
Kenji Fukuda ◽  
Takashi Shinohe ◽  
...  

The channel mobility and oxide reliability of metal-oxide-semiconductor field-effect transistors (MOSFETs) on 4H-SiC (0001) carbon face were investigated. The gate oxide was fabricated by using dry-oxidized film followed by pyrogenic reoxidation annealing (ROA). Significant improvements in the oxide reliability were observed by time-dependent dielectric breakdown (TDDB) measurement. Furthermore, the field-effect inversion channel mobility (μFE) of MOSFETs fabricated by using pyrogenic ROA was as high as that of conventional 4H-SiC (0001) MOSFETs having the pyrogenic-oxidized gate oxide. It is suggested that the pyrogenic ROA of dry oxide as a method of gate oxide fabrication satisfies both channel mobility and oxide reliability on 4H-SiC (0001) carbon-face MOSFETs.


2007 ◽  
Vol 556-557 ◽  
pp. 487-492 ◽  
Author(s):  
Einar Ö. Sveinbjörnsson ◽  
Fredrik Allerstam ◽  
H.Ö. Ólafsson ◽  
G. Gudjónsson ◽  
D. Dochev ◽  
...  

We demonstrate how sodium enhanced oxidation of Si face 4H-SiC results in removal of near-interface traps at the SiO2/4H-SiC interface. These detrimental traps have energy levels close to the SiC conduction band edge and are responsible for low electron inversion channel mobilities (1-10 cm2/Vs) in Si face 4H-SiC metal-oxide-semiconductor field effect transistors. The presence of sodium during oxidation increases the oxidation rate and suppresses formation of these nearinterface traps resulting in high inversion channel mobility of 150 cm2/Vs in such transistors. Sodium can be incorporated by using carrier boats made of sintered alumina during oxidation or by deliberate sodium contamination of the oxide during formation of the SiC/SiO2 interface.


2016 ◽  
Vol 858 ◽  
pp. 671-676 ◽  
Author(s):  
Daniel J. Lichtenwalner ◽  
Vipindas Pala ◽  
Brett A. Hull ◽  
Scott Allen ◽  
John W. Palmour

Alkaline earth elements Sr and Ba provide SiO2/SiC interface conditions suitable for obtaining high channel mobility metal-oxide-semiconductor field-effect-transistors (MOSFETs) on the Si-face (0001) of 4H-SiC, without the standard nitric oxide (NO) anneal. The alkaline earth elements Sr and Ba located at/near the SiO2/SiC interface result in field-effect mobility (μFE) values as high as 65 and 110 cm2/V.s, respectively, on 5×1015 cm-3 Al-doped p-type SiC. As the SiC doping increases, peak mobility decreases as expected, but the peak mobility remains higher for Ba interface layer (Ba IL) devices compared to NO annealed devices. The Ba IL MOSFET field-effect mobility decreases as the temperature is increased to 150 °C, as expected when mobility is phonon-scattering-limited, not interface-trap-limited. This is in agreement with measurements of the interface state density (DIT) using the high-low C-V technique, indicating that the Ba IL results in lower DIT than that of samples with nitric oxide passivation. Vertical power MOSFET (DMOSFET) devices (1200V, 15A) fabricated with the Ba IL have a 15% lower on-resistance compared to devices with NO passivation. The DMOSFET devices with a Ba IL maintain a stable threshold voltage under NBTI stress conditions of-15V gate bias stress, at 150 °C for 100hrs, indicating no mobile ions. Secondary-ion mass-spectrometry (SIMS) analysis confirms that the Sr and Ba remain predominantly at the SiO2/SiC interface, even after high temperature oxide annealing, consistent with the observed high channel mobility after these anneals. The alkaline earth elements result in enhanced SiC oxidation rate, and the resulting gate oxide breakdown strength is slightly reduced compared to NO annealed thermal oxides on SiC.


Sign in / Sign up

Export Citation Format

Share Document