A Two-Dimensional Ultrasonically Assisted Grinding Technique for High Efficiency Machining of Sapphire Substrate

2009 ◽  
Vol 626-627 ◽  
pp. 35-40 ◽  
Author(s):  
Z. Liang ◽  
Yong Bo Wu ◽  
Xin Bing Wang ◽  
Y. Peng ◽  
Wei Xing Xu ◽  
...  
Keyword(s):  
Ultrasonic Vibration ◽  
Sapphire Substrate ◽  
High Efficiency ◽  
Vibration Mode ◽  
Two Dimensional ◽  
Grinding Forces ◽  
Work Surface ◽  
Conventional Grinding ◽  
Grinding Technique ◽  
Ultrasonic Vibration Assisted Grinding

This paper discusses the feasibility of improving machining efficiency of sapphire substrate by using two-dimensional (2D) ultrasonic vibration assisted grinding. An elliptic ultrasonic vibrator is designed and produced by bonding a piezoelectric ceramic device (PZT) on a metal elastic body (stainless steel, SUS304). The sapphire substrate is fixed onto the top face of the vibrator and ultrasonically vibrates in 2D vibration mode when the PZT is excited by two alternating current voltages with a phase difference. A grinding apparatus mainly composed of the ultrasonic vibrator is constructed, and experiments are performed with lateral modulation of elliptic ultrasonic vibration vertical to the grinding direction. Both the grinding forces and the ground work surface are measured and examined. Experimental results show that the grinding force decreases significantly and the resulted surface is improved in certain degree with the ultrasonic vibration compared to those of conventional grinding without ultrasonication. This indicates that the high efficiency grinding for sapphire substrate can be performed with the two-dimensional vibration grinding technique presented in this paper.

Research on Surface Quality by Ultrasonic Vibration-Assisted Face Grinding of Cemented Carbide

2021 ◽  
Vol 324 ◽  
pp. 52-57
Author(s):  
Guang Jun Chen ◽  
Jin Kai Xu ◽  
Jia Qi Wang ◽  
Jing Dong Wang ◽  
Le Tong ◽  
...  
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal ◽  
High Efficiency ◽  
Cemented Carbide ◽  
Material Surface ◽  
Precision Manufacturing ◽  
Conventional Grinding ◽  
Face Grinding ◽  
Ultrasonic Vibration Assisted Grinding ◽  
Better Than

Cemented carbide has huge applications in industrial production, but its high mechanical properties also increase the difficulty of processing. In this work, ultrasonic vibration-assisted grinding technology is used for the precision manufacturing of cemented carbide. The influence of the dynamic trajectory of the grains on the material removal process is analyzed. The morphology and roughness of the processed surface are measured and studied. It was observed that in the conventional grinding, the blade pattern is obvious with some defects on the surface. While in the ultrasonic vibration-assisted grinding, the material surface is mainly distributed with pits and small protrusions, and there is no obvious blade pattern. According to the roughness test, the roughness of ultrasonic vibration-assisted grinding is better than that of conventional grinding, and the increase in amplitude has a significant effect on the improvement of roughness. When the amplitude increases from 3μm to 9μm, the surface roughness is improved about 38.1%. The research of ultrasonic vibration-assisted grinding should be of great importance for promote the high-efficiency and high-quality processing and special applications of cemented carbide.

Modeling of High Efficiency Removal in the Grinding of Aluminal/ZrO2 Nanocomposites with the Aid of Two-Dimensional Ultrasonic Vibration

2007 ◽  
Vol 329 ◽  
pp. 451-458 ◽  
Author(s):  
Yan Wu ◽  
A.G. Sun ◽  
Bo Zhao ◽  
Xun Sheng Zhu
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
High Efficiency ◽  
Removal Rate ◽  
Abrasive Particle ◽  
Experimental Results ◽  
Two Dimensional ◽  
Conventional Grinding ◽  
Vibration Assistance

Based on the single abrasive particle motion locus of elliptical spiral in two-dimensional ultrasonic vibration grinding (WTDUVG), the theoretical model representing the material removal rate are deduced and verified, and the reason of high efficiency material removal by applying two-dimensional ultrasonic vibration is analyzed. Finally, experimental researches on material removal rate of ceramics were carried out using coarse grit diamond wheel both with and without workpiece two-dimensional ultrasonic vibration assistance grinding. Experimental results indicated that (1) Material removal rate (MRR) in vibration grinding process is about 1.5 times as large as that of in conventional grinding, the experimental results are in good agreement with the calculated ones. (2)The material removal rate increases along with increases of the grinding depth and workpiece velocity both in with and without vibration grinding. (3)The vibration grinding surface had no spur and build-up edge and its surface roughness was smaller than CG significantly. Surface quality of WTDUVG is superior to that of conventional grinding, it is easy for ultrasonic vibration grinding that material removal mechanism is ductile regime grinding.

Study on Grinding Force in Two-Dimensional Ultrasonic Grinding Nano-Ceramics

2010 ◽  
Vol 42 ◽  
pp. 204-208 ◽  
Author(s):  
Xiang Dong Li ◽  
Quan Cai Wang
Keyword(s):  
Mathematical Model ◽  
Ultrasonic Vibration ◽  
Contact Time ◽  
Reaction Force ◽  
Grinding Force ◽  
Two Dimensional ◽  
Indentation Fracture ◽  
Ultrasonic Grinding ◽  
The Impact ◽  
Ultrasonic Vibration Assisted Grinding

In this paper, the characteristic of grinding force in two-dimensional ultrasonic vibration assisted grinding nano-ceramic was studied by experiment based on indentation fracture mechanics, and mathematical model of grinding force was established. The study shows that grinding force mainly result from the impact of the grains on the workpiece in ultrasonic grinding, and the pulse power is much larger than normal grinding force. The ultrasonic vibration frequency is so high and the contact time of grains with the workpiece is so short that the pulse force will be balanced by reaction force from workpiece. In grinding workpiece was loaded by the periodical stress field, which accelerates the fatigue fracture.

Generation mechanism modeling of surface topography in tangential ultrasonic vibration-assisted grinding with green silicon carbide abrasive wheel

2021 ◽  
pp. 095440542110406
Author(s):  
Yutong Qiu ◽  
Jingfei Yin ◽  
Yang Cao ◽  
Wenfeng Ding
Keyword(s):  
Surface Roughness ◽  
Surface Topography ◽  
Ultrasonic Vibration ◽  
Generation Mechanism ◽  
Surface Generation ◽  
Depth Of Cut ◽  
Abrasive Wheel ◽  
Grinding Parameters ◽  
Conventional Grinding ◽  
Ultrasonic Vibration Assisted Grinding

Tangential ultrasonic vibration-assisted grinding (TUAG) has a wide prospect in machining difficult-to-machine materials. However, the surface generation mechanism in TUAG is not fully recovered. This study proposes an analytical model of the surface topography produced by TUAG. Based on the model, the surface topography and roughness are predicted and experimentally verified. In addition, the influence of the grinding parameters on the surface topography is analyzed. The predicted surface topography well coincides with experimental measurements, and the prediction error in surface roughness Ra by the proposed model is less than 5%. Compared with conventional grinding, TUAG produces a surface with more uniform scratches and surface roughness Ra was reduced by up to 27% with the proper parameters. However, the improvement of surface roughness in TUAG is weakened when grinding speed or depth of cut increases. Moreover, the influence of the ultrasonic vibration amplitude on the surface roughness is not monotonous. With the grinding parameters selected in this study, TUAG with an ultrasonic amplitude of 7.5 μm produces the minimum surface roughness.

Study on Surface Quality of Nano ZrO2 Ceramics in Grinding by the Aid of Ultrasonic Vibration

2006 ◽  
Vol 315-316 ◽  
pp. 190-194 ◽  
Author(s):  
Dao Hui Xiang ◽  
Y.P. Ma ◽  
Bo Zhao ◽  
Ming Chen
Keyword(s):  
Residual Stress ◽  
Ultrasonic Vibration ◽  
High Efficiency ◽  
X Ray Diffraction ◽  
Ultrasonic Grinding ◽  
Surface Character ◽  
Excellent Mechanical Property ◽  
Finished Surface ◽  
Conventional Grinding

Nano ceramics possesses excellent mechanical property and physical characteristics in contrast to conventional engineering ceramics, so it has tremendous application prospect. Adopting ultrasonic composite processing we describe the influences of grinding speed, grinding depth, wheel granularity and no-spark grinding times on the surface roughness of nano ZrO2 ceramics. By means of SEM and AFM the surface character and critical ductile grinding depth of nano ZrO2 ceramics in the condition of conventional and ultrasonic grinding are also discussed. At last, the residual stress of surface and crystalline phase transformation under the condition of conventional grinding and ultrasonic vibration grinding were analyzed by X-ray diffraction. The research indicated that ultrasonic vibration grinding could obtain nano finished surface with high efficiency. The residual stress of nano ZrO2 ceramics surface is determined much by different grinding styles.

Fundamental Investigation of Ultrasonic Assisted Pulsed Electrochemical Grinding of Ti-6Al-4V

2016 ◽  
Vol 874 ◽  
pp. 279-284 ◽  
Author(s):  
Si Si Li ◽  
Yong Bo Wu ◽  
Mitsuyoshi Nomura
Keyword(s):  
Vibration Amplitude ◽  
Material Removal ◽  
Input Voltage ◽  
Grinding Forces ◽  
Work Surface ◽  
Fundamental Investigation ◽  
Ultrasonic Assisted ◽  
Conventional Grinding ◽  
Actual Material ◽  
Electrochemical Grinding

Aiming at the development of a novel grinding technology for the highly efficient machining of difficult to machine materials such as Ti-6Al-4V, an ultrasonic assisted pulsed electrochemical grinding (UAECG) method was proposed. The current work is to reveal the fundamental grinding characteristics of the UAECG of Ti-6Al-4V by experimentally investigating the effect of vibration amplitude on grinding forces, actual material removal and work-surface roughness under different process parameters such as the input voltage and rotational speed. Summarizing the obtained results revealed that the grinding forces in UAECG are significantly smaller than those in conventional grinding (CG).

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