The Dissolution Mechanism of Copper Weld Brazing with Cu-Based Brazing Alloys
2011 ◽
Vol 697-698
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pp. 394-398
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Keyword(s):
Cu Foil
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In this paper, the dissolution mechanism of copper weld brazing has been researched. The thickness losses of Cu foil in contact with molten Cu-P and Cu-Ag binary alloys at different temperatures have been studied. And the dissolution rate constants in both alloys is calculated and exists following relation: kCu-P(T)=10kCu-Ag(T), which explains the special phenomenon that the dissolving amount of copper in Cu-P liquid alloys is larger than that in Cu-Ag liquid alloys by using weld brazing technology. The dissolution rate of copper in filler metals is the main reason to realize weld brazing. It can be concluded that element P is indispensable in filler metals as the function of accelerating dissolution during weld brazing.
1999 ◽
Vol 4
(1)
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pp. 1-8
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Keyword(s):
1999 ◽
Vol 4
(1)
◽
pp. 1-8
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Keyword(s):
2014 ◽
Vol 5
(21)
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pp. 3859-3862
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Keyword(s):
1995 ◽
Vol 59
(1)
◽
pp. 77-85
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1980 ◽
Vol 69
(5)
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pp. 607-608
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Keyword(s):
Keyword(s):